The Future of ALD

As the demand for smaller, faster, and more energy-efficient electronics accelerates, traditional manufacturing methods struggle to keep pace with design flexibility, material compatibility, and environmental requirements. This presentation introduces a novel direct-write microfabrication approach that enables the selective deposition of a wide range of materials, down to the atomic scale, without the need for masks, resists, or extensive post-processing. By streamlining patterning and material integration into a single-step process, this technology opens new possibilities for advanced packaging, heterogeneous integration, and rapid prototyping of complex electronic architectures.
The talk will explore how this method overcomes critical challenges in high-resolution additive manufacturing, such as temperature sensitivity, chemical waste, and alignment precision. Application examples will illustrate its potential to drastically reduce energy consumption and material waste while unlocking new geometries and functionalities across semiconductors, MEMS, and beyond. This paradigm shift in microfabrication is poised to reshape the future of electronics—from lab to fab.