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Michael Gleason

Director of Product Development

Greensource Fabrication

United States

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Environmental Innovation Meets Reshoring: Advancing US PCB Production Capability with Zero Liquid Discharge Systems

The Future of Electronics RESHAPED 2025 USA

10 June 2025

Boston, USA

UMass Boston

The reshoring of advanced High-Density Interconnect (HDI) printed circuit board (PCB) manufacturing in the United States presents a strategic opportunity to not only strengthen domestic production capability and capacity, but presents a path to environmentally responsible manufacturing. With increasing regulatory pressure and the need for more sustainable operations, the integration of Zero Liquid Discharge (ZLD) systems is becoming essential. ZLD technology eliminates wastewater discharge, enabling PCB manufacturers to minimize environmental impact while ensuring compliance with strict water regulations.

Beyond traditional PCB production, reshoring also opens the door to bringing back advanced technologies that are currently unavailable in the US, such as IC substrate manufacturing with Semi-Additive Processes (SAP). These capabilities are critical for reducing reliance on overseas suppliers.

In this talk, we will outline the roadmap for expansion, detailing how ZLD and advanced manufacturing technologies can be integrated into US facilities.”

Watch the 5-minute excerpt from the talk

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How does building copper directly on a dielectric material enhance circuit density compared to using a copper foil seed layer?

00:02:07 - 00:02:15

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How does thermal expansion mismatch between the dielectric material and vias lead to potential failures, and what testing methodologies are employed to mitigate these risks?

00:06:17 - 00:06:27

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What are the key process steps and advantages of achieving a 10:1 aspect ratio plated shut mechanical via, and why is it considered unique, especially in the US?

00:04:53 - 00:05:00

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