[Panelist | InMold Electronics] - “Bonding of electronic components for injection molding electronics processes

During the last years more and more attention is given to so called injection molded electronic (IME) components. It saves weight, decreases the number of parts, contributes to the automotive interior lighting trend and even has a much lower CO2 footprint.
The whole production process starts with a foil onto which components must be electrically contacted by conductive adhesives. Soldering is no option as the melting temperature of solder paste conflicts with the temperature resistance of for example PC or PMMA foils. This is where adhesive technology comes into the game; low temperature curing is the right track – flexible electrically conductive materials are nice to have and curing speed is relevant as injection molding is one of the following steps in the production process.
Having over 10 years of experience on adhesive development for this industry, I am excited that Techblick offers a platform for learning and discussions. I see this as a great step towards their live event “the future of electronics” in Berlin later this year.