Additively manufactured multi-layer and stacked circuits with embedded electronics components

We have confirmed manufacturing capability of multilayer circuit boards using additive methods by forming silver nano-ink circuits with an inkjet printer and molding UV-curable resin substrates. Furthermore, by combining it with ultra-low temperature surface mount technology, it is possible to realize devices that encapsulate components in three dimensions. This technology not only enables the realization of devices with new geometries but also will indicate the potential to fundamentally transform the way we approach manufacturing in electronics. FUJI will continue to engage with additive manufacturing electronics and challenge its applications in the industry.