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Ryojiro Tominaga

FUJI CORPORATION

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Embedding of electrical components with stacked up structure by additive manufacturing method.

Perovskites Innovation Day 2025

Additive, Sustainable or 3D Electronics Innovations Day 2025

3 April 2025

Online

TechBlick Platform

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We aimed to escalate additive manufactured electronics (AME) to the 3D device manufacturing. In the session, I will introduce multi layers electrical circuit formation process by inkjet printing of both UV ink and Ag nano particle ink. Moreover, by the combination of automated low temperature SMT process, we validated that those technology can make the electrical device which has 3D component layout embedded into the highly accurate additive manufactured object.

Watch the 5-minute excerpt from the talk

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FUJI CORPORATION

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High Tech Campus, Conference Centre

Eindhoven, Netherlands

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