Enabling Room Temperature Electronics Bonding In FHE Applications, Addressing Sustainability and Cost

Introduction
CondAlign is an innovative technology company that has patented and developed a new range of adhesive anisotropic conductive films (ACFs), to enable efficient components bonding for the flexible and hybrid electronics (FHE) industry. This new ACF named E-Align, provides excellent electrical and mechanical bonding performances, in particular to bond electronic components to flexible and rigid substrates.This ACF comes in the form of a double-sided tape, and it doesn’t require any post curing process. Its application process is also very simple, considering that doesn’t require any high pressure (typical bonding pressure is ca 0,1 – 0,3 MPa) or heat (it can be bonded at room temperature).Through these unique characteristics, the E-Align ACF has the ambition of simplifying the entire electronic production and assembly process, increasing efficiency and reducing costs.Presentation content In this presentation, CondAlign will start with an introduction of the technology principles behind the products development, will then provide an overview of the characteristics of the different ACF products already available in the market and the others under qualification, and will finally conclude with different examples of successful end user applications, where the E-Align ACF products enable sustainable and cost-efficient electronic bonding of different products for distinct industries. Examples of applications are the following: bonding printed batteries to printed IOT platforms for logistic and inventory tracking solutions, bonding flexible displays to flex-tails, bonding skin patches to wearable electronic medical devices, etc.