top of page

Simon Ogier

CTO

Smartkem

United Kingdom

* All members of the platform can watch the entire presentation.

 

Please register to become a member.

OTFT circuit developments enabling low-voltage flexible processors

The Future of Electronics RESHAPED 2025

22 October 2025

Berlin, Germany

Estrel

Embedding smartness in plastic-based devices requires some form of circuitry based on transistors to generate logical functions. Equally there may be need for signal processing to amplify and digitise signals from sensors. Such combinations of functionality goes towards the generation of so-called internet-of-things (IOT). For large scale deployment of the technology, there are a number of desirable features of the property and capability of the circuitry such as circuit operating power, voltage, frequency, transistor gate count, production yield and overall cost of production. Whilst p-type OTFT circuits have been developed with some promising performance metrics, challenges remain up till now to provide a technology that operates at a low enough power consumption and with high enough noise margin. Recently, we have advanced the capability to integrate n-type oxide TFTs and this has brought the much anticipated and rapid progress towards very low power operation and high noise margin. This presentation will illustrate the technical and commercial approach to provide a rapid turnaround capability for plastic-based CMOS circuitry. The process offered by Smartkem follows an affordable route to both prototyping and scale up via the use of existing IGZO capability in the display backplane industry combined with a versatile digital lithography-based p-type OTFT process. Balanced device current driving characteristics and matched turn-on voltages give near ideal inverter behaviour with high tolerance for process variations. Finally, a roadmap for provision of a PDK using EDA tools is presented so that electronic designers can design plastic CMOS circuits and submit layouts for production.

Watch the 5-minute excerpt from the talk
More presentations from
Smartkem

MicroLED Connect + AR/VR Connect

23 September 2025

High yield electrical connections to micro-LEDs via the chip-first OTFT backplane process

Simon Ogier

High Tech Campus, Conference Centre

Eindhoven, Netherlands

MicroLED Connect 2024

25 September 2024

Chip-first active-matrix fabrication approach for effective connection of TFT backplanes to micro-LEDs

Simon Ogier

High Tech Campus, Conference Centre

Eindhoven, Netherlands

The Future of Electronics RESHAPED 2024 USA

12 June 2024

Powering the Next Generation of Displays Using OTFT Technology

Ian Jenks

UMass Boston

Boston, USA

Innovations Festival: Printed, Hybrid, 3D, InMold, Textile Electronics 2022

23 June 2022

The Metaverse and The Display Industry

Ian Jenks

TechBlick Platform

Online

The TechBlick Platform: Why Join?

Onsite Admission

With your Hybrid Individual or Group Pass, you can attend one or more of our world-class conferences and exhibitions around the world, including Electronics RESHAPED USA or Europe, MicroLED Connect, AR/VR Connect, Perovskite Connect, Sustainable Electronics RESHAPED, and more…

CONTACT US

KGH Concepts GmbH

Mergenthalerallee 73-75, 65760, Eschborn

+49 17661704139

venessa@techblick.com

TechBlick is owned and operated by KGH Concepts GmbH

Registration number HRB 121362

VAT number: DE 337022439

  • LinkedIn
  • YouTube

Sign up for our newsletter to receive updates on our latest speakers and events AND to receive analyst-written summaries of the key talks and happenings in our events.

Thanks for submitting!

© 2026 by KGH Concepts GmbH

bottom of page