Characterization and Development of Printed Multi-material Interconnects and Passive Elements for Microwave Applications

Increasing demands on requirements for high power microwave and mm-wave communications systems need volume compaction but also require a high degree of heat transfer to meet system needs. In many cases, this precludes use of emerging commercial embedded die approaches to volume compaction. Also, complex, low volume, and high value added microwave systems often require repair and replace reworkability at the die level. The Raytheon U-Mass/Lowell (UML) Research Institute (RURI) has developed and demonstrated integration of a three dimensional printed near chip scale interposer. This capability enables die embedment that can accommodate die level reworkability and direct cold plate access for the device. Realization of the interposer includes an nFD print of a 3D insulating structure, a planarizing dielectric, a multi-axes conductor print, a printed gasket and a conformal conductor print over multiple materials at multiple heights to make the final interconnect. This structure is embedded within a PCB assembly leading to circuit card assemblies (CCAs) that can then be stacked for volume efficiency. Robustness to multiple surface mount reflow profiles and thermal cycling will be shared. The developed approach can be used and extended to add functionality beyond the basic interconnect. Details of the fabrication and integration of the interposer will be provided.

Bio: Susan Trulli is a Principal Engineering Fellow in the Advanced Microelectronics Solutions department of Raytheon Missiles and Defense Systems. She is a recognized leader in microelectronics in high reliability microwave packaging, with over 40 years of experience in communication and radar products for defense, space and commercial applications. Susan is very active in the International Microelectronics Assembly and Packaging Society (IMAPS) serving seventeen years on the Executive Council in multiple positions including the presidency and chairing numerous IMAPS advanced technology workshops in RF and Microwave Packaging. Susan is the recipient of multiple awards including Raytheon’s highest technical achievement award, the Thomas K. Phillips Award for Excellence in Technology, the IMAPS Sidney J. Stein International Award and the Society for Women Engineers Patent Recognition Award. Susan is focused on gallium nitride (GaN) packaging solutions for high reliability, high power microwave systems and is currently principal investigator for Embedded Die for High Power Microwave Applications through NextFlex. Susan holds patents in the area of microwave module design and materials as well as in the area of printed electronics, thermal design and plasma applicator materials and construction.