Resistive Inks for High Temperature Applications on Low-CTE Substrates

Aerospace and defense industry requires thick film solutions for specialty low-thermal expansion substrates that can withstand high operating temperatures. A package consisting of RuO2-based resistive inks and optional underglaze dielectric/sealing overglaze targeting the firing temperature of 1020°C was developed. The materials show excellent high temperature stability and can tolerate rapid thermal cycling. The inks can be deposited by screen printing or spraying and are fully compatible with Ceramic Matrix Composite (CMC), Silicon Carbide, and Fused Quartz substrates.