Christoph Bosshard | Kimoto: What are the key differences in capabilities between Kimoto's wide coating line (Line 2) and compact coating line (LC3) in the US?
00:03:50 - 00:04:02
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What are the key differences in capabilities between Kimoto's wide coating line (Line 2) and compact coating line (LC3) in the US?
Kimoto operates two coating lines in the USA: a wide coating line (Line 2) and a compact coating line (LC3). The wide line, with a width of 1,500 millimeters, is equipped with three coating heads, enabling the application of up to five layers in a single pass, although typically three layers are applied in practice due to speed considerations. This line is suited for complex structures and high-volume production.
In contrast, the LC3 compact coating line has a width of 800 millimeters and features only one coating head. This limits it to applying a single layer in one pass, although a lamination layer can be added on top. The LC3 line is particularly well-suited for development projects due to its shorter length, which reduces material consumption and allows for more efficient experimentation.
The choice between the two lines depends on the specific requirements of the project. The wide line is ideal for high-volume production of multi-layered coatings, while the compact line is better suited for development work and single-layer applications. This dual-line approach provides Kimoto with the flexibility to meet a wide range of customer needs.
In this short video, you can learn:
* The maximum number of layers achievable in a single pass on each coating line.
* The primary applications for each coating line (production vs. development).
* The width specifications for both the wide and compact coating lines.
π **Clip Abstract** This segment compares Kimoto's two US-based coating lines, highlighting the wide line's multi-layer capability and the compact line's suitability for development projects. It details the differences in coating heads, line width, and typical applications.
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#MultiLayerCoating, #WebCoating, #CoatingLineConfiguration, #ProcessDevelopment, #OpticalFilms, #FlexibleElectronics
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Custom coating of flexible substrates and coating solutions
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06:48 - 08:31
Is silicone contamination from your process films ruining your vacuum deposition steps?
Is silicone contamination from your process films ruining your vacuum deposition steps?
Self-wetting adhesives are a popular choice for applying protection films, especially in display manufacturing, because they enable a bubble-free lamination that progresses automatically once initiated. The most common chemistry for these is silicone-based. The properties of these silicone adhesives, such as their thickness and hardness, can be precisely tuned to accommodate for small dust particles, making them effective even in non-ideal environments by engulfing specs to ensure a clear, bubble-free result.
Despite their excellent application properties, silicone-based adhesives present a major challenge in multi-step electronics manufacturing. Silicones are known to outgas and migrate, leading to contamination of the substrate surface and the processing equipment. This is a critical issue for any subsequent vacuum-based processes, such as sputtering or metal deposition, as the silicone residue will prevent proper adhesion and bonding of the new material layers, potentially ruining the entire device.
To solve this, a silicone-free, urethane-based self-wetting adhesive has been developed. This material provides the same key advantages of automatic, bubble-free lamination seen in its silicone counterparts but without the risk of contamination. By using a urethane chemistry, manufacturers can protect sensitive surfaces during handling and then proceed with subsequent vacuum deposition or bonding steps with confidence, ensuring a clean and reliable process flow.
In this short video, you can learn:
* The mechanism and benefits of self-wetting adhesives for bubble-free lamination.
* The critical problem of silicone contamination in vacuum chamber processes.
* How urethane-based adhesives provide a silicone-free alternative for sensitive applications.
π **Clip Abstract** Learn about self-wetting adhesives that enable easy, bubble-free application of protection films. Discover why common silicone-based versions can be problematic for vacuum processes and how urethane-based alternatives solve this critical manufacturing challenge.
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#SelfWettingAdhesives, #SiliconeAdhesives, #UrethaneAdhesives, #VacuumDeposition, #AdvancedElectronicsManufacturing, #FlexibleElectronics
09:56 - 10:37
Is your carrier film absorbing all the energy from your laser lift-off process?
Is your carrier film absorbing all the energy from your laser lift-off process?
A critical challenge in emerging technologies like MicroLED mass transfer is the efficiency of laser-based processes. When using a laser for lift-off or release, a conventional carrier tape with a polymer base film (like polyester) can cause significant problems. The polymer film absorbs a portion of the laser's energy, preventing the laser from operating in its ideal wavelength window and reducing the energy that reaches the adhesive interface, which compromises process speed and control.
To overcome this, an innovative "film-less" adhesive system has been developed. This product is not a traditional tape; instead, it consists solely of a specialized laser-release adhesive layer sandwiched between two protective release liners. By eliminating the polymer base film entirely, the issue of laser energy absorption is completely removed from the equation, allowing for maximum energy delivery to the active interface.
The process involves laminating this adhesive-only layer onto a transparent carrier, such as a glass plate. The MicroLEDs or other components are then picked up by the adhesive. During the transfer step, the laser can be directed through the transparent glass carrier to interact directly with the adhesive, ensuring a highly efficient and precisely controlled release without any energy loss to an intermediate polymer film. This enables the next generation of high-throughput, laser-based micro-assembly processes.
In this short video, you can learn:
* The problem of laser energy absorption by conventional polymer carrier films in MicroLED transfer.
* An innovative "film-less" adhesive design that eliminates the base film.
* How this adhesive-only system enables efficient laser-release processes by using a transparent glass carrier.
π **Clip Abstract** Laser-based MicroLED mass transfer requires precise energy delivery, but traditional carrier films get in the way. This clip reveals a novel "film-less" adhesive system that eliminates the energy-absorbing polymer film, enabling a more efficient and controlled laser lift-off process.
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#LaserLiftOff, #FilmLessAdhesive, #MicroLEDTransfer, #TransparentCarrier, #AdvancedDisplays, #MicroAssembly
10:42 - 11:39
How do you keep your process carrier films from degrading and leaving residue after a 230Β°C thermal cycle?
How do you keep your process carrier films from degrading and leaving residue after a 230Β°C thermal cycle?
Many advanced manufacturing processes in the electronics industry, such as those for secondary batteries or electric motors, involve high-temperature steps like curing or annealing that exceed 150Β°C. Standard carrier films, which are typically based on polyester (PET), cannot withstand these conditions and will degrade, compromising the manufacturing process. This thermal limitation creates a significant bottleneck for developing robust, high-performance components.
The solution for these demanding high-temperature applications is a carrier film system built on a more thermally stable polymer base. Instead of polyester, a polyamide (PI) film is used as the carrier. Polyamide's inherent material properties allow it to remain dimensionally and chemically stable at temperatures up to 230Β°C, providing a reliable platform for handling components through harsh thermal cycles.
Simply changing the base film is not enough; the adhesive itself must also be engineered for high-temperature performance. A specially formulated adhesive is used that resists thermal degradation, which is critical for maintaining process integrity. As shown in the data, a standard adhesive's haze increases significantly at high temperatures, indicating breakdown that leads to residue upon removal. This specialized adhesive remains stable, ensuring it can be cleanly delaminated without leaving any trace on the component after the high-temperature process is complete.
In this short video, you can learn:
* Why standard polyester (PET) films fail in high-temperature electronic manufacturing processes.
* The use of polyamide (PI) as a thermally stable base film for carrier tapes.
* The importance of specialized adhesives that resist degradation and prevent residue after high-temp exposure.
π **Clip Abstract** Standard carrier films can't handle the heat of many electronics manufacturing steps. This clip explains how a combination of a polyamide base film and a specially formulated adhesive enables removable process carriers to withstand up to 230Β°C without leaving residue.
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#HighTempCarrierFilms, #PolyimideSubstrates, #ThermalStableAdhesives, #ResidueFreeDelamination, #FlexibleElectronics, #PrintedElectronics