Daniel Hines | Raytheon | An RTX Business: How can printed interconnects effectively replace traditional wire and ribbon bonds in RF applications?
00:00:33 - 00:00:36
Other snippets from this talk
Summary of the clip:
How can printed interconnects effectively replace traditional wire and ribbon bonds in RF applications?
The research focuses on replacing wire bonds and ribbon bonds with printed interconnects, particularly for RF applications. Wire bonds, while mature in design, exhibit limitations at higher frequencies due to abrupt geometric transitions. The initial comparison involves a generic printed interconnect against an optimized ribbon bond design, analyzing insertion loss and mismatch loss.
Even with conductive ink that is not as conductive as a ribbon bond, the insertion loss remains comparable at lower frequencies. However, the mismatch loss, attributed to the abrupt geometric transition in wire bonds, significantly increases at higher frequencies. This is because the geometry of wire bonds doesn't perform well in RF as frequencies increase.
An optimized printed interconnect design, incorporating a tapered geometry to ensure a smooth transition and maintain impedance control, demonstrates superior performance at higher frequencies compared to optimized ribbon bonds. This is particularly evident above 35 GHz, where ribbon bonds show significant degradation in power loss, while printed interconnects maintain a flatter response.
In this short video, you can learn:
* The limitations of wire bonds in high-frequency RF applications.
* How optimized printed interconnects can outperform traditional ribbon bonds.
* The importance of geometric design in printed interconnects for impedance matching.
š **Clip Abstract** This segment discusses the replacement of traditional wire bonds with printed interconnects in RF applications, highlighting the performance advantages of optimized printed designs at higher frequencies. It emphasizes the role of geometric design in achieving impedance matching and reducing signal loss.
š Link in comments š
#PrintedInterconnects, #RFInterconnects, #WireBondReplacement, #ImpedanceMatching, #SemiconductorPackaging, #HighFrequencyElectronics
This is a highlight of the presentation:
Printed Hybrid Electronics (PHE) Manufacturing for next-Gen RF electronics
More Highlights from the same talk.
00:06:01 - 00:06:30
Can additive manufacturing techniques produce transmission lines with lower losses compared to traditional electroplated copper lines?
Can additive manufacturing techniques produce transmission lines with lower losses compared to traditional electroplated copper lines?
The discussion shifts to the transmission loss in printed transmission lines compared to standard electroplated copper lines. The loss in electroplated copper lines is attributed to the roughness of the material. When a silver transmission line is printed, the roughness of the printed silver line is observed to be less than that of the electroplated copper.
This lower roughness results in less loss in the printed version compared to the copper version. This finding was unexpected, suggesting an advantage of additive manufacturing in this specific context. An aerosol jet printed transmission line exhibits lower loss than an electroplated line up to approximately 5 MHz.
This advantage is attributed to the smoother surface finish achievable with aerosol jet printing compared to the roughness inherent in electroplated copper. This result highlights a potential benefit of using additive manufacturing for RF electronics, specifically in achieving lower transmission losses due to reduced surface roughness.
In this short video, you can learn:
* How surface roughness affects transmission loss in transmission lines.
* That printed silver transmission lines can have lower roughness than electroplated copper.
* That printed transmission lines can outperform electroplated lines in terms of transmission loss at certain frequencies.
š **Clip Abstract** This segment compares the transmission losses of printed silver transmission lines with those of standard electroplated copper lines, revealing that printed lines can exhibit lower losses due to reduced surface roughness. This unexpected finding underscores a potential advantage of additive manufacturing in RF electronics.
š Link in comments š
#AdditiveManufacturing, #AerosolJetPrinting, #TransmissionLineLoss, #SurfaceRoughness, #SemiconductorManufacturing, #RFDevices
00:08:16 - 00:08:30
What are the challenges and opportunities in achieving true three-dimensional fabrication of electronics on structural surfaces?
What are the challenges and opportunities in achieving true three-dimensional fabrication of electronics on structural surfaces?
The speaker transitions to the topic of true three-dimensional fabrication of electronics onto structural surfaces. He references previous work involving the fabrication of an Arduino-type circuit on the outer surface of a hemisphere. A key question that arose was whether similar fabrication could be achieved on the *inside* surface of such structures.
The ability to print electronics on internal surfaces offers advantages, such as protecting the electronics from external elements. Engineers have been working on modifying existing tools to enable printing deep within the internal surfaces of complex structures. This involves adapting the printing process to reach and deposit materials within confined spaces.
The advancements in printing on internal surfaces open up possibilities for structurally integrated electronics, where electronics are built directly into the structure of the desired object. This approach eliminates the need for traditional rectangular PC boards inserted into cylindrical holes, enabling more efficient use of space and integration of electronics into tight spaces.
In this short video, you can learn:
* The benefits of fabricating electronics on the internal surfaces of structures.
* How existing printing tools can be modified to enable printing in confined spaces.
* The potential for structurally integrated electronics to revolutionize electronic design and packaging.
š **Clip Abstract** This segment explores the challenges and opportunities of printing electronics on the internal surfaces of three-dimensional structures, highlighting the potential for structurally integrated electronics and more efficient use of space. It discusses modifications to existing printing tools to enable this capability.
š Link in comments š
#3DElectronicsFabrication, #InternalSurfacePrinting, #StructurallyIntegratedElectronics, #ConformalElectronics, #AdvancedPackaging, #MiniaturizedElectronics