Franz Vollman | Heraeus: How do you achieve military-grade adhesion and stable contact resistance when inkjet-printing silver on multi-material 2.5D packages?
00:14:16 - 00:15:52
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Summary of the clip:
How do you engineer metal-organic decomposition inks to survive the multi-material adhesion and cosmetic demands of advanced semiconductor packaging?
In advanced semiconductor packaging, achieving robust electromagnetic shielding or metallization requires metal-organic decomposition (MOD) inks to adhere to highly heterogeneous surfaces. The deposition target is rarely a single substrate; instead, the ink must form a reliable, high-adhesion bond across a complex topography of epoxy mold compounds (EMC), FR4 laminates, and copper contact pads. To survive rigorous reliability testing—including MSL3, UHAST, TCT, and HTST—the material formulation must be engineered to maintain a 4B to 5B adhesion rating specifically on these challenging, multi-material vertical sidewalls.
Beyond mechanical and electrical performance, cosmetic uniformity is a critical yet frequently underestimated benchmark in semiconductor manufacturing. MOD inks and their deposition processes must be tightly controlled to prevent optical and physical variations post-thermal processing. The final cured coating must exhibit extreme color stability, limiting any color shift between the initial printed state (T0) and the post-reflow state to less than a single Pantone range.
Furthermore, functional integration requires that back-end traceability is preserved throughout the metallization process. Because packages are laser-marked prior to coating, the deposited MOD ink layer must maintain sufficient optical properties to ensure that underlying laser markings remain fully machine-readable. Consequently, the ink's formulation must strike a precise balance between high electrical conductivity, substrate adhesion, and optical clarity or thickness control.
In this short video, you can learn:
* The stringent reliability and sidewall adhesion standards required for MOD inks on multi-material semiconductor substrates.
* The cosmetic and color-consistency tolerances mandated for printed electronics in semiconductor packaging.
* The critical requirement for maintaining laser-mark readability through functional conductive coatings.
📋 **Clip Abstract** The speaker discusses the process capabilities and material requirements of metal-organic decomposition (MOD) inks when applied to multi-material semiconductor packages. He outlines the necessity of achieving high sidewall adhesion under rigorous reliability testing, maintaining strict color consistency post-reflow, and ensuring underlying laser markings remain machine-readable.
🎤 Speaker: Franz Vollman
🏢 Company: Heraeus
📅 Event: The Future of Electronics RESHAPED 2023 Berlin
📍 Location: Estrel Congress Centre, Berlin, Germany, Europe
🌐 Learn more at the next TechBlick event: https://www.techblick.com
#MetalOrganicDecomposition, #InkjetPrintedElectronics, #EpoxyMoldCompound, #ContactResistance, #AdvancedPackaging, #SemiconductorReliability
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00:04:48 - 00:06:09
Why is the separation of material supply and equipment manufacturing the biggest bottleneck in printed electronics scaling?
Why is the separation of material supply and equipment manufacturing the biggest bottleneck in printed electronics scaling?
Vollman highlights that true mass production readiness in printed electronics cannot be achieved by offering materials or equipment in isolation. By integrating ink manufacturing, specialized inkjet printing hardware, and process parameters into a single turnkey system, developers can avoid the classic finger-pointing between chemistry suppliers and machine OEMs.
Specifically, Heraeus utilizes Metal Organic Decomposition (MOD) inks (particle-free silver precursors) whose fluid dynamics, viscosity, and evaporation profiles are directly co-engineered with the printing system's thermal and physical properties. This holistic optimization is critical because even minor chemical modifications drastically alter jetting performance and deposition accuracy.
Ultimately, this system-level ownership bridges the gap between lab-scale feasibility and 24/7 industrial fab reliability. Mass-production clients receive a single, accountable interface rather than a fragmented supply chain, allowing rapid deployment of selective metallic coatings without compromising process yield.
In this short video, you can learn:
* Why combining ink formulation, printing hardware, and process parameters under one roof accelerates mass-production readiness.
* The role of Metal Organic Decomposition (MOD) particle-free inks in achieving consistent fluid dynamics.
* How co-engineering materials and hardware eliminates the classic disconnect between chemistry and mechanical tooling in semiconductor fabs.
📋 **Clip Abstract** This clip highlights the strategic and technical benefits of integrating materials, equipment, and process engineering into a single turnkey solution for printed electronics. By co-developing particle-free MOD inks alongside industrial inkjet systems, Heraeus overcomes the typical yield and integration challenges of the semiconductor supply chain.
#MetalOrganicDecomposition, #ParticleFreeInks, #IndustrialInkjet, #AdditiveMetallization, #PrintedElectronics, #SemiconductorPackaging
00:10:04 - 00:11:40
Can digital inkjet printing compete with physical sputtering in high-volume semiconductor advanced packaging?
Can digital inkjet printing compete with physical sputtering in high-volume semiconductor advanced packaging?
Vollman outlines the multi-generation equipment roadmap required to transition printed electronics from low-volume technology validation to high-volume semiconductor manufacturing. While initial systems targeted lab scales, the current industrial generation handles populated wafer frames with automated load/unload cycles at throughputs of two to three wafers per hour.
To challenge conventional sputtering systems, Heraeus is developing a next-generation high-volume manufacturing (HVM) tool. This system scales to 12-15 wafers per hour using 24 active printheads to handle 12-inch wafers in a fully automated inline process that integrates pre-treatment, print, and curing.
The progression highlights why printed electronics has faced slow adoption in back-end packaging: each equipment generation takes at least 1.5 years to engineer, followed by another 1 to 1.5 years of stringent customer qualification cycles. This long developmental runway means there are no shortcuts to achieving fab-grade reliability.
In this short video, you can learn:
* The evolution of inkjet equipment from lab-scale validation tools to multi-nozzle high-volume production machines.
* How next-generation systems with 24 printheads achieve throughputs of 12-15 wafers per hour on 12-inch wafers.
* The realistic timelines and qualification bottlenecks involved in introducing additive printing into semiconductor fabs.
📋 **Clip Abstract** The clip details the technical roadmap and scaling timelines required to transition digital inkjet printing tools to high-volume semiconductor packaging. It contrasts early-stage low-throughput tools with next-generation 24-printhead inline machines designed to compete directly with physical sputtering systems.
#DigitalInkjetPrinting, #AdvancedPackaging, #PhysicalSputtering, #HighVolumeManufacturing, #PrintedElectronics, #AdditiveElectronics