Gari Arutinov | TNO at Holst: Can laser-assisted mass transfer selectively harvest microLED dies spaced only 2 microns apart without causing thermal collateral damage?
00:10:05 - 00:12:11
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How do we scale perovskite photovoltaics from spin-coated laboratory substrates to high-throughput roll-to-roll production without sacrificing power conversion efficiency?
Transitioning from spin-coated laboratory devices to scalable sheet-to-sheet (S2S) processing on rigid substrates represents a critical milestone for perovskite photovoltaics. Recent developments demonstrate that rigid, S2S-coated perovskite solar cells can achieve efficiencies approaching 20%, matching the performance of spin-coated benchmarks with virtually no loss. This linear scalability is maintained across larger areas due to precise, uniform deposition control, paving the way for industrial-scale manufacturing.
The transition to flexible substrates, however, introduces distinct optoelectronic challenges that limit efficiency compared to rigid glass baselines. While a 100-square-centimeter rigid perovskite module can achieve up to 18% efficiency when optimized with back reflectors and anti-reflective coatings, its flexible counterpart reaches only 13.1%. This performance gap is primarily driven by the lower electrical conductivity of the bottom transparent conductive oxide (TCO) layer, which cannot undergo high-temperature annealing on temperature-sensitive flexible polymer substrates.
To overcome these thermal budget constraints and scale up production volume, advanced roll-to-roll (R2R) processing equipment is being deployed. Utilizing a specialized dual-coater R2R system, researchers can now deposit two consecutive device layers in a single pass. This continuous manufacturing approach is essential for optimizing the deposition of flexible perovskite stacks and achieving the high-throughput yields required for commercial viability.
In this short video, you can learn:
* How sheet-to-sheet coated rigid perovskite cells achieve parity with spin-coated laboratory devices.
* The impact of substrate thermal limitations on the conductivity of flexible transparent conductive oxides.
* How dual-coater roll-to-roll systems enable the consecutive deposition of multiple device layers in a single run.
π **Clip Abstract** The speaker presents a performance comparison between rigid and flexible perovskite solar cells, highlighting how sheet-to-sheet coating matches the efficiency of spin-coating up to nearly 20%. He explains the efficiency limitations of flexible modules due to transparent conductive oxide annealing constraints and introduces a dual-coater roll-to-roll system designed for consecutive layer deposition.
π€ Speaker: Gari Arutinov
π’ Company: TNO at Holst
π
Event: The Future of Electronics RESHAPED 2023 Berlin
π Location: Estrel Congress Centre, Berlin, Germany, Europe
π Learn more at the next TechBlick event: https://www.techblick.com
#LaserMassTransfer, #SelectiveLaserTransfer, #AdaptivePitchControl, #MicroLEDMassTransfer, #MicroLEDDisplays, #ARDisplays
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00:01:48 - 00:03:04
Why are existing laser-assisted microLED transfer methods failing to scale?
Why are existing laser-assisted microLED transfer methods failing to scale?
The microLED display industry faces a critical bottleneck in the mass transfer phase, where traditional pick-and-place equipment must be replaced by laser-assisted processes. However, a closer look at existing laser transfer paradigms reveals significant, deep-seated limitations. Direct ablation from standard carriers either lacks the necessary precision or introduces unacceptable debris and residues onto the fragile, micron-scale dies.
Alternative approaches like thermal degradation offer higher precision but are severely limited by slow kinetics. The chemical and thermal processes involved in thermal release simply cannot meet the massive throughput demands required for high-volume consumer display manufacturing, making them commercially unviable.
Meanwhile, blister-based laser transfer, though successful for miniLEDs, runs into physical scaling limits. Because the footprint of the generated blister is often larger than the microLED itself, this approach becomes highly questionable when dealing with ultra-high-density wafers or true microLED architectures.
In this short video, you can learn:
* Understand the structural limitations of direct ablation and thermal degradation in laser-assisted transfer.
* Discover why blister-based laser transfer fails to scale down for high-density microLED wafers.
* Analyze the performance trade-offs between transfer precision, throughput speed, and residue contamination.
π **Clip Abstract** Gari Arutinov highlights the core physical and chemical bottlenecks of existing laser-based transfer methods, including direct ablation, thermal degradation, and blister-based approaches. He explains why these methods struggle to balance precision, speed, and debris control for high-density microLED manufacturing.
#LaserMassTransfer, #BlisterBasedTransfer, #DirectAblation, #ThermalReleaseTransfer, #MicroLEDDisplays, #DisplayManufacturing
00:08:43 - 00:10:09
Can laser printing replace traditional micro-dispensing for ultra-fine-pitch display interconnects?
Can laser printing replace traditional micro-dispensing for ultra-fine-pitch display interconnects?
As microLEDs shrink to single-digit micron dimensions, traditional micro-dispensing and screen printing of interconnect materials reach their physical resolution limits. To solve this, Holst Centre developed a volume-controlled laser printing technology that utilizes structured carrier plates filled with conductive adhesives or solder pastes. A proprietary, laser-insensitive release layer ensures that the target materials are ejected cleanly without thermal or chemical degradation.
The system has already demonstrated non-contact, safe release of 14-micron solder paste dots. For conductive adhesives, the technology has successfully scaled down to 20-micron features, with a clear engineering roadmap to reach 5 microns in the short term. For solder paste, current capabilities sit at 40 microns with a rapid path to 20 microns.
By isolating the energy transfer to the release stack rather than the target material, the system preserves the chemistry, viscosity, and electrical performance of the adhesive or solder. This prevents the "spraying" phenomenon typical of standard laser-induced forward transfer (LIFT) processes, ensuring uniform, well-defined micro-bump deposition.
In this short video, you can learn:
* The mechanics of volume-controlled laser printing for ultra-fine-pitch backplane interconnects.
* The scaling limits of current solder paste (40Β΅m) and conductive adhesives (20Β΅m) using this non-contact approach.
* How a laser-insensitive release layer prevents material spraying and maintains material performance.
π **Clip Abstract** Gari Arutinov introduces Holst Centre's innovative volume-controlled laser printing technology for depositing ultra-fine interconnects. He details how this non-contact technique scales solder paste and conductive adhesives down to micron levels without affecting material integrity.
#VolumeControlledLaserPrinting, #UltraFinePitchInterconnects, #MicroSolderBumping, #LaserForwardTransfer, #MicroLEDDisplays, #AdvancedPackaging
00:04:36 - 00:05:36
How can you achieve 1-micron precision transfer across a gap five times the die's thickness?
How can you achieve 1-micron precision transfer across a gap five times the die's thickness?
Scaling down display architectures from miniLEDs to true microLED components requires advanced release stack physics and optical control. Holst Centreβs proprietary release stack and tailored optics enable seamless non-contact transfer of 60x60 micron dies. This unique approach allows high-density wafers with only 20-micron dicing streets to be selectively processed without damaging neighboring dies.
A major breakthrough in this process is the ability to transfer dies across a physical gap equivalent to five times the thickness of the die. This spatial buffer is crucial for display yield engineering, as it effectively mitigates any surface topology variations on the target backplane. Furthermore, it paves the way for highly efficient, non-contact post-repair strategies during active matrix assembly.
Crucially, this system achieves a remarkable assembly precision of 1 micron alongside excellent rotational alignment. What makes this commercially viable is that these tolerances are met using a relatively inexpensive laser source, drastically lowering the capex barriers typically associated with high-precision micro-assembly.
In this short video, you can learn:
* How Holst Centre achieves non-contact transfer of 60-micron dies from highly dense wafers.
* The technical importance of transferring dies across a gap five times their thickness to bypass substrate topology.
* How to achieve 1-micron assembly precision using cost-effective laser sources.
π **Clip Abstract** This clip explores Holst Centre's high-precision laser-assisted transfer system handling 60x60 micron dies with 1-micron precision. Gari Arutinov explains how this technology overcomes backplane topology challenges and simplifies repair steps.
#LaserAssistedTransfer, #NonContactTransfer, #MicroAssembly, #BackplaneTopology, #MicroLEDDisplays, #ActiveMatrixAssembly