Gustaf Mårtensson | Mycronic AB: How do you jet solder paste at 40 meters per second without destroying placement accuracy?
00:06:29 - 00:08:30
Other snippets from this talk
Summary of the clip:
How do you jet solder paste at 40 meters per second without destroying placement accuracy?
To scale up wearable electronics manufacturing, dispensing speed must increase without sacrificing resolution or damaging pre-mounted components. This segment highlights non-contact jet printing, which leverages piezo or pneumatic actuators to propel droplets at extremely high velocities.
The speaker explains the physics of jetting 200-micron solder paste droplets at speeds up to 40 meters per second. This approach allows high-speed printheads to fly over undulating, flexible substrates at one meter per second while avoiding contact.
By measuring the substrate topography beforehand, the system dynamically adjusts its flight height, enabling what Gustaf calls "two-and-a-half-D" structured printing over previously mounted components.
In this short video, you can learn:
* The physics and actuation mechanisms driving high-speed non-contact fluid jetting
* How to maintain dot consistency and eliminate satellite droplets at high velocities
* Methods for compensating for flexible or undulating surfaces during automated deposition
📋 **Clip Abstract** Gustaf Mårtensson introduces non-contact piezo/pneumatic jetting, showing how solder paste droplets can be shot at 40 m/s to achieve 2.5D structures. He discusses height compensation techniques essential for printing on flexible, non-planar surfaces.
#SolderPasteJetting, #NonContactJetting, #PiezoJetPrinting, #HeightCompensation, #AdditiveElectronics, #FlexibleElectronics
This is a highlight of the presentation:
More Highlights from the same talk.
00:04:54 - 00:06:27
Can we reliably deposit liquid metals down to 15 microns using standard needle dispensing?
Can we reliably deposit liquid metals down to 15 microns using standard needle dispensing?
Traditional screen and stencil printing are hitting their resolution and flexibility limits in the assembly of advanced, stretchable microelectronics. This clip explores the transition to contact needle dispensing and non-contact jetting of complex fluids like liquid metals for next-generation biometric patches.
Gustaf Mårtensson details the mechanics of positive displacement Archimedean screws and capillary needles. By maintaining precise heights relative to the substrate, Mycronic achieved 100-micron and even 15-micron line widths in collaboration with material specialists like XTPL.
Understanding these precise fluid dynamics is critical for researchers working on high-density stretchable interconnects and micro-component integration on soft substrates.
In this short video, you can learn:
* The mechanical differences between contact needle dispensing and non-contact jetting
* How positive displacement and capillary control enable sub-100-micron liquid metal lines
* The engineering challenges of industrializing micro-scale liquid conductive traces
📋 **Clip Abstract** Gustaf Mårtensson explains how contact needle dispensing tools utilize Archimedean screws and capillary needles to deposit micro-scale conductive traces. He highlights the engineering challenge of maintaining exact heights to print 100-micron down to 15-micron liquid metal lines on sensitive substrates.
#LiquidMetalPrinting, #ArchimedeanScrewDispensing, #CapillaryDispensing, #MicroDispensing, #StretchableElectronics, #PrintedElectronics
00:16:58 - 00:18:44
How do you solve the poor surface adhesion of liquid metals in stretchable circuits?
How can traditional surface mount technology adapt to the demands of soft, stretchable, and sustainable electronics?
This presentation explores adapting standard surface mount technology (SMT) production tools to manufacture novel, non-planar, and stretchable electronics. Using a physiological monitoring patch from the EU's Syntec project as a case study, the speaker outlines how existing digital assembly infrastructures handle complex fluids, liquid metals, and flexible substrates.
The speaker details material deposition evolution, contrasting traditional stencil printing with needle dispensing and high-speed non-contact jetting. While contact dispensing achieves fine 15-micron lines, it is slow for high-volume production. To bypass this bottleneck, the speaker highlights non-contact jet printing, which uses piezo or pneumatic processes to project droplets at high velocities. This method allows multi-level printing, real-time surface height compensation on undulating substrates, and rapid patterning of liquid metals like galinstan.
The discussion also addresses component placement and quality control in hybrid assembly. Standard vacuum-based pick-and-place technology mounts components onto stretchable substrates, secured with UV-curable adhesives and protective coatings. To ensure reliability, integrated optical inspection systems combine camera and laser technologies to generate 3D images, resolving erratically mounted components down to sub-100 microns. Finally, a comparative life cycle analysis (LCA) demonstrates that this digital, stretchable manufacturing approach reduces material and energy consumption by approximately 60% compared to traditional rigid FR4-based PCB manufacturing.
In this talk, you can learn:
* How to adapt traditional SMT production lines, including pick-and-place and dispensing systems, for the assembly of soft and stretchable hybrid devices.
* The technical trade-offs between contact needle dispensing and high-speed non-contact jet printing when patterning liquid metals on flexible substrates.
* How digital production methods and stretchable architectures compare to rigid FR4 board manufacturing in terms of energy, material consumption, and environmental impact.
📋 **Talk Abstract** In this talk, the speaker outlines how traditional SMT production equipment can be repositioned to manufacture sustainable, stretchable, and soft electronic devices. Through the lens of a wearable ECG monitoring patch, the presentation details the integration of high-speed jet printing, vacuum component placement, 3D optical inspection, and life cycle analysis to enable viable digital manufacturing.
🎤 Speaker: Gustaf Mårtensson
🏢 Company: Mycronic AB
📅 Event: The Future of Electronics RESHAPED 2023 Berlin
📍 Location: Estrel Congress Centre, Berlin, Germany, Europe
🌐 Learn more at the next TechBlick event: https://www.techblick.com
#LiquidMetalEmulsions, #Galinstan, #StretchableInterconnects, #PolymerCompositeInks, #PrintedElectronics, #FlexibleElectronics