Jasper Wesselingh | ITEC B.V.: How can you print both adhesive and place micro-components with the same laser system?
00:03:23 - 00:05:42
Other snippets from this talk
Summary of the clip:
How can you print both adhesive and place micro-components with the same laser system?
This clip details a dual-function laser-based assembly process, a technology developed by the Holst Centre and integrated into ITEC's equipment. The process is divided into two main steps performed by the same laser system. The first step is a Laser-Induced Forward Transfer (LIFT) process designed specifically for printing interconnect materials. This allows for the precise, high-speed deposition of materials like glue, solder paste, or flux onto the target substrate, creating the foundation for component bonding.
The LIFT process for interconnects is shown to be a rapid, non-contact method. A cavity plate is filled with the desired adhesive, and a laser pulse generates a pressure wave that ejects a single, well-defined droplet. This droplet travels a short distance (typically 50-100 microns) and lands on the substrate within microseconds. This technique provides a flexible and clean alternative to traditional dispensing or screen-printing methods for creating micro-scale adhesive patterns.
The second step is the component transfer itself, which uses a laser-induced de-release mechanism. After the interconnect material is printed, micro-components (like microLEDs) are picked up from a donor wafer that has a specially developed Dynamic Release Layer (DRL). The same laser is then used to irradiate the DRL, causing a highly localized release of the component, which is then accurately placed onto the pre-printed adhesive on the target substrate. This non-contact, high-speed transfer completes the assembly process.
In this short video, you can learn:
* The two-stage laser assembly process: interconnect printing and component transfer.
* How Laser-Induced Forward Transfer (LIFT) precisely deposits adhesive droplets.
* The mechanism of laser-induced de-release for non-contact, high-speed chip placement.
π **Clip Abstract** Discover the dual-function laser-based assembly technology for micro-scale components. This process first uses Laser-Induced Forward Transfer (LIFT) to print interconnect materials, followed by a laser de-release step to accurately place chips.
π Link in comments π
#LaserInducedForwardTransfer, #LaserDeRelease, #MicroComponentAssembly, #DynamicReleaseLayer, #MicroLEDDisplays, #AdvancedPackaging
This is a highlight of the presentation:
XG-Alpha: Exploring Cost-Effective, High-Quality Laser Assembly of MicroLEDs
More Highlights from the same talk.
00:09:08 - 00:10:09
Beyond speed, what advanced optical and software features are critical for high-yield microLED mass transfer?
Beyond speed, what advanced optical and software features are critical for high-yield microLED mass transfer?
The ITEC XG Alpha tool incorporates several advanced features designed to maximize throughput and yield in chip assembly. For interconnect printing, the system utilizes a large laser spot that can cover a significant area at once. This enables the simultaneous printing of multiple I/O pads or adhesive dots in a single laser shot, dramatically accelerating the interconnect deposition stage compared to a point-by-point process.
To ensure high placement accuracy, the system employs a sophisticated localized alignment strategy. Using its integrated vision system, the tool can detect substrate imperfections, such as stretching or distortion, on a local level. The control software then actively compensates for these detected errors in real-time during the transfer process, ensuring that each die is placed precisely on its target pad, regardless of substrate-level variations.
Flexibility is further enhanced by an adaptable aperture within the optical path. This allows the laser spot to be precisely shaped to match the specific dimensions of the die being transferred, from as small as 50 microns up to much larger semiconductor chips. Additionally, the system integrates a bin mixing algorithm, a crucial software feature for display manufacturing that strategically places LEDs from different bins to ensure the final display has excellent color and brightness homogeneity.
In this short video, you can learn:
* How a large, adaptable laser spot can print multiple interconnects simultaneously.
* The role of localized vision alignment in compensating for substrate distortions.
* The importance of a bin mixing algorithm for achieving display color uniformity.
π **Clip Abstract** Explore the advanced capabilities of the ITEC XG Alpha laser transfer tool designed for flexible and high-throughput chip assembly. Key features include multi-dot interconnect printing, localized alignment for distortion correction, and a bin mixing algorithm for display homogeneity.
π Link in comments π
#MicroLEDMassTransfer, #LocalizedAlignment, #BinMixingAlgorithm, #MultiDotLaserPrinting, #ARdisplays, #FlexibleElectronics
00:10:35 - 00:12:32
Can laser-based mass transfer achieve the sub-5-micron accuracy needed for next-gen displays?
Can laser-based mass transfer achieve the sub-5-micron accuracy needed for next-gen displays?
This clip presents critical performance data validating the precision of the XG Alpha laser transfer tool. The first key metric is overlay accuracy, which measures how well the donor carrier can be aligned to the target substrate. The results show an impressive overlay accuracy of just 3 microns across a large 10x10 millimeter field of view. This level of precision is fundamental for ensuring that arrays of micro-components are correctly positioned relative to the features on the final substrate.
The second critical metric is the laser's pointing accuracy, which determines how precisely the laser can target a specific die on the donor. The system demonstrates a pointing accuracy of better than 5 microns over the entire operational field. This precision is essential for selectively releasing a single die without inadvertently illuminating and affecting neighboring components, which is a key requirement for high-yield transfer and for processes like bin mixing or defect repair.
Finally, the system's throughput is showcased, highlighting its capability for high-speed manufacturing. A demonstration of the laser creating burn marks on a test surface reveals a transfer rate of 600 hertz, meaning the system can place 600 dies per second within its working area. This combination of high speed with high accuracy (3-micron overlay and <5-micron pointing) demonstrates the technology's potential for commercially viable mass production of microLED displays and other advanced packages.
In this short video, you can learn:
* How a 3-micron overlay accuracy is achieved over a 10x10 mm area.
* The importance of sub-5-micron laser pointing accuracy for selective die transfer.
* The system's capability to reach a transfer speed of 600 dies per second.
π **Clip Abstract** This clip presents key performance metrics for a new laser-based mass transfer system, validating its readiness for microLED applications. The data demonstrates a 3-micron overlay accuracy, sub-5-micron laser pointing precision, and a transfer speed of 600 dies per second.
π Link in comments π
#LaserMassTransfer, #MicroLEDTransfer, #Sub5MicronAccuracy, #HighThroughputTransfer, #MicroLEDDisplays, #ARDisplays