Kyosuke Michigami | Panasonic Industry: How do you process stretchable substrates using conventional subtractive PCB lines and lead-free SMT reflow?
00:09:26 - 00:10:53
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How do you process stretchable substrates using conventional subtractive PCB lines and lead-free SMT reflow?
Implementing stretchable substrates into volume production requires compatibility with existing printed circuit board manufacturing infrastructure. Panasonic's CCS and stretchable coverlay technology integrates seamlessly into a standard subtractive PCB process, including mechanical drilling, desmearing, copper plating for via-hole connections, and chemical wet etching.
A key challenge is managing dimensional stability during high-temperature steps; this is resolved using a specialized polyimide release liner that secures the dimensions of the stretchable layer. The coverlay is first laminated at a mild 80°C and then fully cured at 180°C to establish a highly crosslinked thermoset network.
Once fully cured, the resulting stretchable board exhibits excellent thermal resistance, allowing it to survive lead-free SAC305 SMT reflow profiles peaking at 240°C without any delamination or trace damage, clearing the path for standard automated component mounting.
In this short video, you can learn:
* The step-by-step subtractive PCB process flow for Panasonic's stretchable copper-clad laminate.
* How a temporary polyimide release liner maintains dimensional stability during critical high-temperature manufacturing steps.
* The specific lamination, curing, and SAC305 reflow parameters required to successfully mount surface-mount devices (SMDs) on stretchable boards.
📋 **Clip Abstract** This segment details the manufacturing processability of Panasonic's stretchable circuit materials within a conventional subtractive PCB line. It outlines how the combination of a temporary release liner and thermosetting polymer chemistry enables the stretchable boards to withstand standard 240°C SAC305 SMT reflow.
#StretchableCopperCladLaminate, #SubtractivePCBProcessing, #SAC305Reflow, #PolyimideReleaseLiner, #FlexibleHybridElectronics, #StretchableElectronics
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00:05:20 - 00:06:07
Can we drop substrate modulus by three orders of magnitude without sacrificing mechanical reliability?
How can next-generation wearable electronics overcome the mechanical rigidity of conventional substrate materials?
Traditional polyimide substrates present a significant bottleneck in the development of truly conformable electronics due to their high elastic modulus. While polyimide provides excellent thermal stability, its rigid nature limits the mechanical freedom of flexible circuits, preventing seamless integration with soft, dynamic surfaces.
To address this limitation, a novel thermosetting resin system designated as CCS offers a dramatic reduction in elastic modulus compared to standard polyimide. By lowering the modulus from the gigapascal regime down to the megapascal range, this material introduces high elasticity and mechanical compliance to the substrate level.
This drastic reduction in modulus enables advanced form factors that were previously unattainable with conventional engineering plastics. The resulting ultra-pliable CCS resin can undergo severe, repeatable deformations—including stretching, bending, and twisting—without mechanical failure or permanent deformation.
In this short video, you can learn:
* The quantitative difference in elastic modulus between conventional polyimide and the novel CCS resin.
* How lowering substrate modulus enables extreme mechanical pliability and diverse form factors.
* The macroscopic deformation capabilities of CCS resin, including stretching, bending, and twisting.
📋 **Clip Abstract** The speaker compares the elastic modulus of conventional polyimide at seven gigapascals to that of CCS resin at seven megapascals. He demonstrates how this lower modulus allows the CCS resin to achieve highly pliable form factors, including stretching, bending, and twisting.
🎤 Speaker: Kyosuke Michigami
🏢 Company: Panasonic Industry
📅 Event: The Future of Electronics RESHAPED 2023 Berlin
📍 Location: Estrel Congress Centre, Berlin, Germany, Europe
🌐 Learn more at the next TechBlick event: https://www.techblick.com
#CopperCladStretchable, #LowModulusSubstrates, #CrosslinkedElastomers, #StretchableCopperTraces, #SkinConformalElectronics, #FlexibleElectronics
00:06:52 - 00:08:19
How does a stretchable coverlay prevent rapid electromigration and trace failure under high humidity and bias?
How does a stretchable coverlay prevent rapid electromigration and trace failure under high humidity and bias?
Reliability of flexible and stretchable circuits in humid environments depends heavily on the protective coverlay's ability to encapsulate fine-pitch copper traces without leaving voids. Panasonic's stretchable coverlay utilizes a flowable thermosetting resin formulation that completely fills high-aspect-ratio 100-micron gaps between adjacent traces during lamination, eliminating pathways for moisture accumulation.
To validate its environmental protection capabilities, a biased humidity test was conducted at 60°C and 90% relative humidity under a constant 5V bias. Unprotected comb patterns suffered rapid electrochemical migration and failed due to open circuits in less than an hour of exposure.
In contrast, circuits protected by the stretchable coverlay maintained their insulation resistance and continued to function flawlessly after 1,000 hours of continuous testing. This demonstrates that the coverlay provides a robust, hermetic-like moisture barrier even when subjected to prolonged environmental stress.
In this short video, you can learn:
* The encapsulation performance of stretchable coverlays in filling narrow 100-micron copper trace gaps without voids.
* The performance delta between protected and unprotected stretchable circuits under biased highly accelerated stress testing (HAST).
* Why void-free, crosslinked thermoset coverlays are mandatory for long-term electrical reliability in wearable environments.
📋 **Clip Abstract** This clip examines the environmental reliability and insulation properties of Panasonic's stretchable coverlay material. It shows how void-free trace encapsulation protects copper circuits from electromigration during a 1,000-hour biased humidity test at 60°C and 90% RH.
#StretchableCoverlay, #ElectrochemicalMigration, #VoidFreeEncapsulation, #ThermosetResin, #FlexibleHybridElectronics, #WearableElectronics