Lina Kadura | CEA: How do you design and print an 8-layer additive stackup with 200-micron vias on a single flexible PET sheet?
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How do you design and print an 8-layer additive stackup with 200-micron vias on a single flexible PET sheet?
Replicating a complex four-layer conventional PCB using additive printed electronics requires a total of eight printed layers. The architecture utilizes a single polyethylene terephthalate (PET) core, with silver metallization and dielectric inks printed symmetrically on both sides of the substrate to construct the multi-layer routing.
Interconnection between the layers is achieved via double-sided through-hole vias with a 200-micrometer diameter, which are additively filled with conductive ink during the screen printing sequence. The design rules utilize 200-micrometer track widths and spaces to handle complex circuit routing, including double-sided assembly of active surface-mount devices.
The primary engineering challenge lies in maintaining precise registration and alignment across eight sequential screen printing steps on a flexible substrate. Achieving zero-defect registration is vital for mounting fine-pitch components, such as a microcontroller unit with a 400-micrometer pitch.
In this short video, you can learn:
* The physical layer stackup required to replicate a 4-layer copper PCB with additive inks.
* How 200-micrometer through-hole vias are additively filled using screen printing.
* The alignment and registration challenges of processing eight consecutive printed layers.
π **Clip Abstract** CEA outlines the design rules and stackup process for a fully printed, four-layer double-sided PCB on a flexible PET substrate. This proof of concept features 200-micron tracks and vias, enabling the integration of a 400-micron pitch microcontroller.
#AdditiveMultilayerPCB, #ScreenPrintedVias, #DoubleSidedPrintedElectronics, #FinePitchAssembly, #FlexibleHybridElectronics, #AdditiveManufacturingOfElectronics
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Can we really slash PCB carbon footprint by 50% simply by switching from subtractive etching to additive screen printing?
Can we really slash PCB carbon footprint by 50% simply by switching from subtractive etching to additive screen printing?
Conventional printed circuit boards (PCBs) rely heavily on glass-reinforced epoxy (FR4) substrates and subtractive wet-chemical etching of copper. This established manufacturing paradigm is resource-intensive, generates substantial chemical waste, and suffers from low end-of-life recyclability.
Transitioning to additive printed electronics presents a massive environmental advantage. Life cycle assessments reveal that merely changing the manufacturing process from subtractive to additiveβwhile maintaining the same FR4 substrateβreduces the global warming potential of the board by 50%.
Further environmental dividends are unlocked by swapping the rigid substrate itself for flexible or bio-based materials. This strategy establishes a pathway toward truly circular electronics, matching conventional performance while dramatically lowering the carbon and material footprint of electronic assemblies.
In this short video, you can learn:
* Why subtractive copper etching dominates conventional PCB waste metrics.
* How additive manufacturing steps reduce global warming potential by half.
* The impact of substrate selection on the life cycle assessment of printed circuits.
π **Clip Abstract** CEA researchers demonstrate that transitioning from conventional FR4 subtractive processes to additive printing yields a 50% reduction in global warming potential. This process paves the way for sustainable electronics with minimal structural waste.
#AdditiveScreenPrinting, #SubtractiveEtching, #FR4Substrates, #CopperEtching, #PrintedElectronics, #CircularElectronics
00:11:34.555 - 00:13:32.885
What are the physical resolution and conductivity trade-offs when shifting from bulk copper to screen-printed silver inks?
What are the physical resolution and conductivity trade-offs when shifting from bulk copper to screen-printed silver inks?
While screen printing can achieve impressive resolution limits down to approximately 80 micrometers, practical line widths must account for material performance limits. Conductive silver inks exhibit significantly lower electrical conductivity compared to electrodeposited bulk copper, requiring a careful balance between trace width, thickness, and signal integrity.
PET is typically selected as the baseline substrate in printed electronics due to its thermal stability during ink curing and established recycling infrastructure. However, the search for sustainable alternatives has led researchers to successfully print complex, functional circuitry directly onto bio-based substrates like paper and cellulose.
Printing on cellulose and paper introduces additional mechanical and surface challenges, such as absorption and surface roughness, which must be managed during the ink formulation and curing stages. Despite these hurdles, functional proofs of concept demonstrate the viability of paper-based hybrid electronics.
In this short video, you can learn:
* The resolution limits of screen printing and the impact of ink mesh parameters.
* Why silver ink conductivity dictates minimum trace width constraints over bulk copper.
* The engineering trade-offs of printing on standard PET versus bio-based cellulose and paper.
π **Clip Abstract** Lina Kadura explains the resolution limits of screen printing and discusses the conductivity trade-offs between printed silver inks and bulk copper. She also highlights the progression from standard PET substrates toward printing on bio-sourced cellulose and paper.
#ScreenPrintingResolution, #SilverConductiveInk, #CelluloseSubstrates, #PaperElectronics, #PrintedElectronics, #FlexibleElectronics