Marty Ganser | Function47, a division of The Meyers Printing Companies: How can Design of Experiments (DOE) be leveraged to optimize screen printing processes for printed electronics?
00:03:46 - 00:04:12
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Summary of the clip:
How can Design of Experiments (DOE) be leveraged to optimize screen printing processes for printed electronics?
The speaker describes using a Design of Experiments (DOE) approach to address inconsistencies in a carbon flood base printing process. Initially, operators were using varied and often ineffective methods to adjust sheet resistance, leading to inconsistent results. To standardize the process and maintain control limits, a DOE was implemented.
A wide-ranging screening design was first conducted, considering factors like line speed, ink viscosity, and squeegee settings. The results of the screening design indicated that squeegee height and impression were the most statistically significant and easily adjustable parameters for the operators. These two parameters were then used for further optimization.
The next step involved generating a modified central composite design, focusing specifically on squeegee height and impression as inputs, with sheet resistance as the primary output. Print quality, measured by counting pinholes, was also considered but found to correlate closely with film build. This systematic approach allowed for the development of a robust model that could be translated into a practical tool for the operators.
In this short video, you can learn:
* How a screening DOE identifies key process parameters.
* How a central composite design optimizes those parameters.
* How to translate a DOE model into a user-friendly tool for operators.
📋 **Clip Abstract:** This segment details the application of DOE to optimize screen printing, focusing on squeegee parameters to control sheet resistance. It highlights the transition from inconsistent operator adjustments to a data-driven, standardized process.
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#ScreenPrintingOptimization, #PrintedElectronics, #SqueegeeProcessControl, #SheetResistanceTuning, #FlexibleElectronics, #SemiconductorManufacturing
This is a highlight of the presentation:
Roll‑to‑Roll Printed Electronics: DOE‑Guided Control of Sheet Resistance
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00:05:15 - 00:05:37
How can a statistical model derived from DOE be implemented in a user-friendly interface for real-time process control?
How can a statistical model derived from DOE be implemented in a user-friendly interface for real-time process control?
The speaker explains how the robust model derived from the Design of Experiments (DOE) was translated into a practical tool for the operators. A simple spreadsheet interface was created with the DOE model running in the background. This interface allows operators to input real-time data and receive immediate feedback.
Operators take a print sample at the end of each roll and measure quality metrics, including sheet resistance. If a sample falls outside the established control limits, the operator enters the current squeegee height, impression settings, and the measured sheet resistance into the spreadsheet. By clicking a button, a macro runs in the background, taking the existing settings and measurement to offset the model.
The macro adds a "fudge factor" to the intercept of the model to account for variables not explicitly included in the model, such as ink viscosity or environmental factors. The spreadsheet then outputs new squeegee height and impression settings, along with an expected sheet resistance result. This provides operators with actionable adjustments to maintain process control.
In this short video, you can learn:
* How a spreadsheet interface can integrate a complex statistical model.
* How real-time data input can drive process adjustments.
* How a "fudge factor" can account for unmodeled variables.
📋 **Clip Abstract:** This segment describes the creation of a spreadsheet tool that uses a DOE-derived model to provide real-time feedback to operators, enabling them to adjust printing parameters and maintain process control. The tool incorporates a fudge factor to account for variables not explicitly included in the model.
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#DesignOfExperiments, #RealTimeProcessControl, #StatisticalProcessControl, #ProcessParameterAdjustment, #SemiconductorManufacturing, #DisplayManufacturing
00:08:50 - 00:09:11
What are the practical limitations of printing very fine traces in roll-to-roll printed electronics, particularly concerning conductivity and reliability?
What are the practical limitations of printing very fine traces in roll-to-roll printed electronics, particularly concerning conductivity and reliability?
The speaker discusses the dimensional capabilities of their roll-to-roll printing process, stating that they are comfortable with 10 mil trace and space. While finer features can be printed, there are diminishing returns in terms of conductor trace performance. Printing very fine traces introduces several challenges that impact the overall quality and reliability of the printed electronics.
One significant limitation is the z-height, or thickness, of the ink laydown. As trace widths decrease, the achievable ink thickness also decreases, which directly limits the current-carrying capacity of the trace. This can be a critical factor in applications requiring specific electrical performance.
Furthermore, the likelihood of opens (breaks in the conductive path) increases significantly when printing very fine traces. This is due to the increased sensitivity to defects and variations in the printing process. The speaker emphasizes that while finer printing is possible, it often comes at the expense of robustness and quality capability.
In this short video, you can learn:
* The trade-offs between trace width and current-carrying capacity.
* The increased risk of opens when printing very fine traces.
* The importance of balancing resolution with process robustness.
📋 **Clip Abstract:** This segment addresses the limitations of printing very fine traces in roll-to-roll processes, highlighting the trade-offs between feature size, current-carrying capacity, and the increased risk of defects. It emphasizes the importance of considering process robustness when designing printed electronic circuits.
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#FineTracePrinting, #PrintedConductorReliability, #InkThicknessControl, #CurrentDensityLimits, #FlexibleElectronics, #ElectronicInterconnects