Ryojiro Tominaga | Fuji Corporation: How does the low-temperature SMT process enable the encapsulation of components within 3D printed structures?
00:10:18 - 00:10:33
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Summary of the clip:
How does the low-temperature SMT process enable the encapsulation of components within 3D printed structures?
The speaker highlights key technologies that enable the creation of 3D devices using their additive manufacturing platform. A critical aspect is the low-temperature Surface Mount Technology (SMT) process. This is essential because the printed dielectric materials lack glass growth and glass fill, which restricts the maximum processing temperature to minimize swelling. The ability to repeat the SMT process multiple times necessitates maintaining a low temperature throughout the fabrication.
Fuji Corporation has established an 80-degree Celsius SMT process, significantly lower than typical reflow temperatures and even low-temperature soldering processes. This low-temperature SMT capability is crucial for embedding components within 3D structures without damaging them or the surrounding printed materials.
Furthermore, maintaining surface flatness is vital, even after embedding components, as subsequent printing and SMT processes are performed on the newly created surface. High aspect ratio via holes are also important for establishing electrical connections between components, and these vias are filled with solder paste using a dispensing process.
In this short video, you can learn:
* The importance of low-temperature SMT for component encapsulation.
* The need for surface flatness in multi-layer additive manufacturing.
* The role of high aspect ratio vias in establishing electrical connections.
š **Clip Abstract** This clip focuses on the key technological advancements that enable 3D device fabrication, specifically highlighting the low-temperature SMT process, the importance of surface flatness, and the use of high aspect ratio vias for electrical connectivity within encapsulated structures.
š Link in comments š
#LowTemperatureSMT, #3DPrintedElectronics, #ComponentEncapsulation, #HighAspectRatioVias, #AdvancedPackaging, #HeterogeneousIntegration
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Additively manufactured multi-layer and stacked circuits with embedded electronics components
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00:03:56 - 00:04:13
How does the low-temperature sintering process impact the choice of conductive inks and substrate materials?
How does the low-temperature sintering process impact the choice of conductive inks and substrate materials?
The HPM-300DI system utilizes a two-module approach, integrating pick-and-place functionality with a printing module. The printing module initially deposits a UV-curable dielectric material using a 600 DPI inkjet system, followed by UV exposure for hardening. Subsequently, the same inkjet system prints a silver conductive ink onto the dielectric surface.
The printed silver ink undergoes a drying and sintering process at a relatively low temperature. This low-temperature sintering is a critical aspect of the process, enabling the creation of conductive circuits on the substrate. The process is repeated to build up multi-layer circuits.
This additive manufacturing approach allows for the creation of material circuits through a fully digital process. The system's capabilities are being evaluated with partners to explore various applications, including 2D substrate prototyping and the fabrication of novel 3D geometry devices.
In this short video, you can learn:
* The two-module architecture of the HPM-300DI system.
* The process of printing dielectric and conductive layers.
* The importance of low-temperature sintering for circuit formation.
š **Clip Abstract** The clip details the core printing and curing process of the HPM-300DI, highlighting the use of UV-curable dielectrics and low-temperature sintered silver conductive inks. It emphasizes the system's ability to create multi-layer circuits through a fully additive digital manufacturing process.
š Link in comments š
#LowTempSintering, #ConductiveInk, #UVCurableDielectric, #AdditiveManufacturing, #PrintedElectronics, #SemiconductorManufacturing
00:06:01 - 00:06:17
What are the key performance characteristics that additive manufacturing must achieve to compete with traditional PCB manufacturing?
What are the key performance characteristics that additive manufacturing must achieve to compete with traditional PCB manufacturing?
Fuji Corporation is exploring both 2D and 3D applications for their additive manufacturing technology. For 2D circuit board formation, they have established a process capable of producing conductive circuit layers with 80-90 micrometer line spacing using an inkjet system. Via holes can also be created additively, eliminating the need for laser or mechanical drilling, which facilitates the creation of multi-layer substrates.
A key advantage of their process is the low processing temperature, which is crucial due to temperature limitations of the materials used. In the 3D space, they have developed a process for encapsulating components within a 3D structure. Current efforts are focused on creating completely curved 3D circuits and hybrid additive electronics, including the integration of additive processes with conventional PCBs to form interposer or 3D molding structures.
Customer demand in the 2D space is driven by the desire for rapid printing and shortened development cycles, enabling on-demand PCB fabrication. However, existing PCB manufacturing and prototyping services already offer speed and convenience, making it a competitive market. Customers are increasingly demanding additive manufacturing processes that can achieve the same density and properties as PCBs manufactured using traditional methods.
In this short video, you can learn:
* The line spacing resolution achievable with Fuji's inkjet printing system.
* The advantages of additive via creation over traditional drilling methods.
* The importance of matching material properties in additive PCB prototyping to traditional manufacturing.
š **Clip Abstract** This segment outlines Fuji Corporation's efforts in both 2D and 3D additive electronics applications, emphasizing the importance of low-temperature processing and the need for additive manufacturing to match the performance and material properties of traditionally manufactured PCBs to meet customer demands.
š Link in comments š
#AdditivePCB, #CircuitResolution, #LowTempProcessing, #PCBPerformanceMatching, #PrintedElectronics, #AdvancedPackaging