Thibaut Soulestin | Henkel: What are the key challenges and solutions associated with using copper-based inks as a cost-effective alternative to silver inks in printed electronics?
00:11:41 - 00:11:55
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What are the key challenges and solutions associated with using copper-based inks as a cost-effective alternative to silver inks in printed electronics?
The speaker introduces the concept of silver-plated copper inks as a cost-effective alternative to pure silver inks. A primary challenge with using copper in printed electronics is its susceptibility to oxidation and degradation, particularly in environments with high humidity. This degradation can significantly impact the conductivity and long-term reliability of the printed circuits.
To mitigate the oxidation issue, the copper particles are coated with a silver shell. This silver coating acts as a protective barrier, preventing the copper core from direct exposure to the environment and thus reducing the risk of oxidation. The goal is not to entirely replace silver, but to leverage the lower cost of copper while maintaining acceptable conductivity and stability.
The speaker emphasizes that while silver-plated copper inks offer a more stable price point compared to the fluctuating cost of silver, their conductivity is generally lower than that of pure silver inks. Therefore, the selection of silver-plated copper inks involves a trade-off between cost savings and electrical performance, requiring careful consideration of the specific application requirements.
In this short video, you can learn:
* The use of silver-plated copper inks as a cost-effective alternative to silver inks.
* The challenge of copper oxidation and the solution of using a silver shell.
* The trade-off between cost savings and conductivity when using copper-based inks.
š **Clip Abstract:** This segment discusses the use of silver-plated copper inks to address the rising cost of silver, highlighting the challenges of copper oxidation and the benefits of silver plating. It emphasizes the trade-offs between cost and performance.
š Link in comments š
#SilverPlatedCopperInks, #CopperOxidation, #PrintedElectronics, #ConductiveInks, #FlexibleElectronics, #AdvancedManufacturing
This is a highlight of the presentation:
High Performance Inks for Cost Efficient Manufacturing of Printed Electronics
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00:06:36 - 00:07:00
How does the use of micro silver particles impact the sintering process and flexibility of the resulting printed structure?
How does the use of micro silver particles impact the sintering process and flexibility of the resulting printed structure?
The speaker highlights the composition of their silver inks, noting they are not nano-based but rather utilize micro silver particles. These microparticles, specifically sub-micro particles, undergo a sintering process at around 150 degrees Celsius, forming intermetallic bonds. This sintering process is crucial for achieving low sheet resistance in the printed conductive traces.
The formation of intermetallic bonds during sintering directly influences the mechanical properties of the printed structure. While sintering enhances conductivity by creating a more cohesive and interconnected network of silver particles, it also tends to reduce the overall flexibility of the material. This trade-off between conductivity and flexibility is a key consideration in material selection and process optimization.
The speaker emphasizes that while the sintering process lowers sheet resistance, it can also lead to cracking if the material is subjected to excessive bending or stress. Therefore, the choice of ink and the sintering parameters must be carefully balanced to achieve the desired electrical performance without compromising the mechanical integrity of the printed electronic device.
In this short video, you can learn:
* The composition of the silver inks, focusing on the use of micro silver particles.
* The sintering process at 150 degrees Celsius and the formation of intermetallic bonds.
* The trade-off between low sheet resistance and flexibility due to the sintering process.
š **Clip Abstract:** This segment discusses the use of micro silver particles in Henkel's conductive inks and the impact of the sintering process on conductivity and flexibility. It highlights the trade-off between electrical performance and mechanical properties.
š Link in comments š
#MicroSilverParticles, #SinteringProcess, #IntermetallicBonds, #PrintedConductiveTraces, #PrintedElectronics, #FlexibleElectronics
00:13:01 - 00:13:33
How do advancements in ink formulation enable higher printing speeds in flexographic and gravure printing processes for printed electronics?
How do advancements in ink formulation enable higher printing speeds in flexographic and gravure printing processes for printed electronics?
The speaker shifts the focus from material composition to process optimization, specifically addressing how ink formulations are being developed to enable higher printing speeds. The goal is to improve the cost-effectiveness of printed electronics by increasing throughput. Flexographic and gravure printing are presented as methods capable of achieving significantly higher speeds compared to traditional screen printing.
Achieving high printing speeds requires inks with specific properties that allow for the deposition of thin layers while maintaining excellent electrical conductivity. The ink formulation must be optimized to ensure proper wetting, adhesion, and drying characteristics at these elevated speeds. This often involves careful selection of solvents, binders, and additives to control the ink's rheology and surface tension.
The speaker notes that printing at higher speeds necessitates the deposition of much thinner layers of ink. Therefore, the ink must be formulated to achieve the desired electrical conductivity even at reduced thicknesses. This requires a balance between the concentration of conductive particles, their dispersion within the ink matrix, and their ability to form a continuous conductive network after printing and drying.
In this short video, you can learn:
* The shift towards flexographic and gravure printing to increase printing speeds.
* The importance of ink formulation for achieving high-speed printing of thin layers.
* The need for excellent electrical conductivity even with reduced ink thickness.
š **Clip Abstract:** This segment discusses the use of flexographic and gravure printing to improve the cost-effectiveness of printed electronics by increasing printing speeds. It highlights the importance of ink formulation for achieving high conductivity in thin layers.
š Link in comments š
#InkFormulation, #FlexoGravurePrinting, #HighSpeedPrinting, #ThinFilmConductivity, #PrintedElectronics, #AdvancedManufacturing