Georg Boedler

Inkatronic has over 25 years’ experience in inkjet technologies, and develops specialised industrial machines for mass production. Implementing an inkjet solution to industrial processes can create incredible advantages, as well as open up new opportunities for manufacturing. However, scaling up a solution from a proven laboratory method to a mass-manufacturing environment is surprisingly difficult. In our presentation, we will give a breakdown of some of the challenges that need to be overcome in order to achieve this successfully.

Franz Vollman

Lets reshape the future of Selective Metallic Coatings. Inkjet printing of 2.5D selective coatings becomes reality with our novel solution consisting of a special particle-free silver ink, an industrial hi-tech printer for mass production and a manufacturing process that translates any standard CAD format of a coating drawing into accurate selectively coated components. Our system adds a new dimension to package design, empowering package designers to create varied pattern layouts efficiently. Customized thin metallization films are possible in the range of 150 nm to 3 μm with a conductivity of 20-50% of bulk silver.

The equipment fulfills the standards of the semiconductor industry, and its mass production capability is proven. This additive manufacturing method is especially suited for EMI shielding of semiconductor packages to secure signal integrity in 5G applications. Digital printing via inkjet enhances the design freedom thanks to maskless selective coating of package topsides, sidewalls (e.g. with stand-off), as well as trenches for compartmental shielding. Shielding effectiveness studies run at a specialized renowned institute confirm that the applied silver film with 2 μm thickness, which is inkjet-coated at the ideal, material saving aspect ratio of 1:1 (side wall to top side), provides excellent shielding performance.

The maskless selective and precise deposition of the silver ink onto specific areas of the components avoids excess material and minimizes waste. No wet chemical processes are required, making this process environmentally friendly. With a factor 10 lower power consumption compared to sputtering, it has a much better CO2 balance, too.

Kenneth Church

The 3D Printed Electronics market is rapidly growing and, according to several research and marketing studies, is estimated to reach multi-billion dollars annually over the next several years with double-digit growth. The 3rd dimension is more than just an additional space to add electronics; it implies a more optimized use of the space, it becomes a powerful tool to enhance products that are currently limited due to shape and size requirements. Adding planar electronics to non-planar or round objects means making the object larger and using bolts, wires and mounts to hold the electronics in place. This is a standard, and even state of the art method, to make an object electrically functional. However, it wastes space, decreases the durability, adds additional steps in manufacturing for integration and imposes constraints on the users. In many cases, adding electronics is not viable given the size constraints or the complexity imposed when adding.
3D Printed Electronics combines electronic packaging with electronic integration. Adding actives with 3D printing implies that electronics can be a part of any 3D printed object. The value of this has not been fully articulated or even imagined, but early demonstrations and the imagination of some reveal that 3D Printed Electronics will not only be the next-generation of electronic packaging, but it will also revolutionize next-generation products. The discussion on CHIPS and the impact is muted without next-generation packaging. 3D Printed Electronics and semiconductor chips are a natural marriage.
In this talk we will explore the advantages of 3D Printed Electronics and the required tools to make complete working circuits. Additionally, we will show why successful 3D Manufacturing using 3D Printed Electronics is more than printing. We will demonstrate the advantages of using 3D manufacturing and multiple tools and processes in a single system. The idea of printing structures, conductors and adding actives opens new opportunities for more electronic functions in smaller form factors. It also allows for more personalized electronics to be viable. We will focus on optimizing next-generation smart tools and smart labs to ensure thousands of layers are perfect every time.

Łukasz Kosior

XTPL provides additive manufacturing technology and conductive materials at the micron scale to address complex issues in the advanced electronics industry. The company has developed its own solutions that allow for extremely accurate printing of functional features at the micron level with high resolution. This capability extends to both planar and non-planar complex substrates, including the ability to print continuous and highly conductive interconnections oversteps.

In our presentation, we will showcase the available solutions for next-generation Flexible Hybrid Electronics, Advanced IC Packaging, and Flat Panel Display applications. Additionally, we will present our plans to introduce Ultra-Precise Deposition technology to the industry.

Hervé Javice

IoTech is introducing a new and patented digital additive manufacturing technology: the Continuous Laser-Assisted Deposition or CLAD. CLAD is a breakthrough multi-material production process for electronics, from semiconductor packaging to flexible electronics.

CLAD enables the fast, precise, high-resolution, and high-volume deposition of most industrial materials, no reformulation required. Manufacturers can

- use their standard industrial materials,
- control the deposition of every single drop,
- print at up to 30µm resolution and,
- reach unmatched production yields.

The system is fast, contactless, high-resolution and micron-accurate. It enhances manufacturing flexibility for advanced electronic designs. CLAD enables more compact, powerful product functionalities in a wide range of applications. It is compatible with most conductive and dielectric fluids, even of high viscosity.

CLAD is also ESG-compliant and labour-efficient. It provides an alternative to highly polluting subtractive technologies, enabling the re-shoring of production processes to OECD countries

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Sima Hannani

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Dov Henry Phillips

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Neil Chilton

PEL is both an experienced manufacturer and specialist machine supplier for printable electronics. At TechBlick we present together with our key partner SIJ. In this presentation we will explain where we have used our knowledge to determine the optimal print methods for applications ranging from large area to ultra-fine-line printing. We will focus on new developments in SIJ including the high productivity multi-nozzle systems.

Martin Hedges

This presentation will review recent advances in manufacturing sustainable 3D mechatronic systems using Additive Manufacturing (AM) technologies. A brief update of select key industrial applications in Luminaires, Medical and Signal Electronics will be given.

Adam Scotch

Brewer Science's vision is to design, build, and deploy connected gas and water sensors that monitor environmental contaminants quantitatively on a large scale. For the last 10 years, Brewer Science has developed the technology to print cost-effective sensors that can measure contaminants in water, such as heavy metals (lead, cadmium), copper, nitrate, pH, and ORP, as well as sensors that assess air quality by measuring gases like carbon monoxide, carbon dioxide, hydrogen, VOCs, and oxygen. Brewer Science fabricates a variety of printable sensor materials and deposits them onto a substrate utilizing processes such as physical vapor deposition (PVD) sputtering, screen printing, stencil printing, ink-jet printing, and high-speed jet dispensing. Producing low-cost sensors with low-power electronics and wireless communication will enable the deployment of sensors over vast areas for real-time monitoring of environmental conditions.

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Harsha Kolli

Printed Energy, early-stage US based hard science company with deep expertise in electro chemistry, printed electronics, and manufacturing automation. The current focus is on flexible, printed, and thin batteries integrated into fully built-up circuits for a complete device such as active RFID. These batteries are non-toxic, environmentally friendly and can be manufactured in any shape and size based on customer requirements. Some of the applications include, smart tags and labels, wearables, medical supplies, tags for timed sporting events, and many other internet of things (IoT) uses. Even though Printed Energy is starting to enter the market, the team has been working on development of thin printed batteries for many years. The unique value that Printed Energy brings to its customer is the ability to manufacture fully integrated device that is cost competitive with coin-cell battery devices. Our proprietary manufacturing line allows us to enter the market and deliver high quality devices at a highly competitive price. Printed Energy’s initial product offering includes delivering disposable Active RFID tag solutions to an existing market with roadmap that includes Semi-Passive tags, temperature loggers and wearable cosmetic/medical patches.

Ilker Dogan

The scalable slot-die coating methods adopted within TNO enable fabrication of efficient perovskite solar devices with intrinsic stability using various material and layer combinations. Furthermore, several different encapsulation strategies are investigated to define a low-cost route to guarantee long term stable modules. Demonstration of a stable semi-transparent bifacial flexible perovskite module is a step forward on various applications, such as building- and vehicle-integrated PV (BIPV & VIPV) and noise barriers on highways. In this talk, we will give an overview of our story towards realizing a stable, efficient, and bifacial perovskite processed via roll-to-roll slot-die coating technique.

Ehsan Faegh

The rapid growth of smart electronics and internet-connected devices has spurred the demand for compact, flexible and energy-efficient power sources. Printed batteries have emerged as highly promising alternatives to traditional bulky batteries, such as AA or AAA, offering a distinctive solution by seamlessly integrating energy storage directly into electronic components and systems.

In recent years, lithium-ion batteries have dominated the market, however, the lithium-based batteries face several challenges, including lammability, toxicity and disposability concerns, and regulatory challenges related to shipping. Given the importance of safety in smart electronics applications, the adoption of environmentally friendly battery chemistries becomes paramount.

Imprint Energy has pioneered an ultrathin and flexible Zinc battery technology designed to meet the demanding power requirements of cellular applications across a wide range of operating temperatures, from -35°C to 60°C. Our innovative battery solution boasts a remarkable peak power of >1500 mW in a small form-factor.

Compared to lithium chemistries, Imprint Energy batteries excel in multiple performance aspects. A significant advantage of Imprint Energy zinc batteries is their non-hazardous classification, eliminating transport and operational limitations associated with hazardous goods like batteries containing lithium. This makes Zinc batteries particularly appealing for powering smart shipping labels, where safe and unrestricted transportation is essential.

Imprint Energy employs a cutting-edge manufacturing process utilizing screen and stencil printing technologies. The high-throughput sheet and roll-to-roll process ensures efficient and scalable production, enabling widespread adoption.

Herein, we present emerging applications where printed batteries can revolutionize smart electronics. These applications span across wearable devices, Internet of Things (IoT) sensors, flexible displays, electronic textiles, and medical devices and patches. We discuss the advantages offered by printed batteries produced at Imprint Energy in terms of safety, size, shape, weight, flexibility and seamless integration, which enable the development of innovative and user-friendly smart electronic products.

Arvind Kamath

Rechargeable anode-less solid-state lithium microbattery technology has numerous advantages over conventional alternatives. These include higher volumetric energy density (VED), significantly faster charging with a simpler charging infrastructure and the ability to deliver higher discharge pulses than Li-ion alternatives. These flexible form factor, multi-layer stacked batteries built on stainless steel are key to enabling space constrained wearables, hearables and IoT applications. Addressing the difficult challenges of manufacturing scale-up on the path to commercialization requires addressing a number of challenges ranging from materials supply chain and roll-to-roll battery fabrication management to high-speed test and novel ultrathin packaging. Some examples of these coupled with battery performance will be presented.

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