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Day 2 | 18 October

Keynote Presentation - Estrel Hall A
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TechBlick

Khasha Ghaffarzadeh

Welcome & Introduction

8:55 AM

  TRACK 1 - Estrel Hall A
Inkatronic
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Inkatronic

9.00AM

Jetting Functional Fluids - Up Scaling from Laboratory to Industrial Production

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 Georg Boedler

Georg Boedler

Inkatronic has over 25 years’ experience in inkjet technologies, and develops specialised industrial machines for mass production. Implementing an inkjet solution to industrial processes can create incredible advantages, as well as open up new opportunities for manufacturing. However, scaling up a solution from a proven laboratory method to a mass-manufacturing environment is surprisingly difficult. In our presentation, we will give a breakdown of some of the challenges that need to be overcome in order to achieve this successfully.

Jetting Functional Fluids - Up Scaling from Laboratory to Industrial Production

9.00AM

Heraeus
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Heraeus

9.20AM

Redefining Coatings in Electronic Packaging: Turnkey Digital Production Process for Selective Metallic Coating

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Franz Vollman

Franz Vollman

Lets reshape the future of Selective Metallic Coatings. Inkjet printing of 2.5D selective coatings becomes reality with our novel solution consisting of a special particle-free silver ink, an industrial hi-tech printer for mass production and a manufacturing process that translates any standard CAD format of a coating drawing into accurate selectively coated components. Our system adds a new dimension to package design, empowering package designers to create varied pattern layouts efficiently. Customized thin metallization films are possible in the range of 150 nm to 3 μm with a conductivity of 20-50% of bulk silver.

The equipment fulfills the standards of the semiconductor industry, and its mass production capability is proven. This additive manufacturing method is especially suited for EMI shielding of semiconductor packages to secure signal integrity in 5G applications. Digital printing via inkjet enhances the design freedom thanks to maskless selective coating of package topsides, sidewalls (e.g. with stand-off), as well as trenches for compartmental shielding. Shielding effectiveness studies run at a specialized renowned institute confirm that the applied silver film with 2 μm thickness, which is inkjet-coated at the ideal, material saving aspect ratio of 1:1 (side wall to top side), provides excellent shielding performance.

The maskless selective and precise deposition of the silver ink onto specific areas of the components avoids excess material and minimizes waste. No wet chemical processes are required, making this process environmentally friendly. With a factor 10 lower power consumption compared to sputtering, it has a much better CO2 balance, too.

Redefining Coatings in Electronic Packaging: Turnkey Digital Production Process for Selective Metallic Coating

9.20AM

nScrypt
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nScrypt

9.40AM

3D Printed Electronics is Powerful when combined with CHIPS

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Kenneth Church

Kenneth Church

The 3D Printed Electronics market is rapidly growing and, according to several research and marketing studies, is estimated to reach multi-billion dollars annually over the next several years with double-digit growth. The 3rd dimension is more than just an additional space to add electronics; it implies a more optimized use of the space, it becomes a powerful tool to enhance products that are currently limited due to shape and size requirements. Adding planar electronics to non-planar or round objects means making the object larger and using bolts, wires and mounts to hold the electronics in place. This is a standard, and even state of the art method, to make an object electrically functional. However, it wastes space, decreases the durability, adds additional steps in manufacturing for integration and imposes constraints on the users. In many cases, adding electronics is not viable given the size constraints or the complexity imposed when adding.
3D Printed Electronics combines electronic packaging with electronic integration. Adding actives with 3D printing implies that electronics can be a part of any 3D printed object. The value of this has not been fully articulated or even imagined, but early demonstrations and the imagination of some reveal that 3D Printed Electronics will not only be the next-generation of electronic packaging, but it will also revolutionize next-generation products. The discussion on CHIPS and the impact is muted without next-generation packaging. 3D Printed Electronics and semiconductor chips are a natural marriage.
In this talk we will explore the advantages of 3D Printed Electronics and the required tools to make complete working circuits. Additionally, we will show why successful 3D Manufacturing using 3D Printed Electronics is more than printing. We will demonstrate the advantages of using 3D manufacturing and multiple tools and processes in a single system. The idea of printing structures, conductors and adding actives opens new opportunities for more electronic functions in smaller form factors. It also allows for more personalized electronics to be viable. We will focus on optimizing next-generation smart tools and smart labs to ensure thousands of layers are perfect every time.

3D Printed Electronics is Powerful when combined with CHIPS

9.40AM

XTPL
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XTPL

10.00AM

Solution for printed micro-electronics. Next generation of resolution in additive technology.

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 Łukasz Kosior

Łukasz Kosior

XTPL provides additive manufacturing technology and conductive materials at the micron scale to address complex issues in the advanced electronics industry. The company has developed its own solutions that allow for extremely accurate printing of functional features at the micron level with high resolution. This capability extends to both planar and non-planar complex substrates, including the ability to print continuous and highly conductive interconnections oversteps.

In our presentation, we will showcase the available solutions for next-generation Flexible Hybrid Electronics, Advanced IC Packaging, and Flat Panel Display applications. Additionally, we will present our plans to introduce Ultra-Precise Deposition technology to the industry.

Solution for printed micro-electronics. Next generation of resolution in additive technology.

10.00AM

ioTech Group
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ioTech Group

10.20AM

C.L.A.D. - Continuous Laser-Assisted Deposition of Standard Materials
Manufacturing Sustainability, Flexibility and Product Miniaturisation

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Hervé Javice

Hervé Javice

IoTech is introducing a new and patented digital additive manufacturing technology: the Continuous Laser-Assisted Deposition or CLAD. CLAD is a breakthrough multi-material production process for electronics, from semiconductor packaging to flexible electronics.

CLAD enables the fast, precise, high-resolution, and high-volume deposition of most industrial materials, no reformulation required. Manufacturers can

- use their standard industrial materials,
- control the deposition of every single drop,
- print at up to 30µm resolution and,
- reach unmatched production yields.

The system is fast, contactless, high-resolution and micron-accurate. It enhances manufacturing flexibility for advanced electronic designs. CLAD enables more compact, powerful product functionalities in a wide range of applications. It is compatible with most conductive and dielectric fluids, even of high viscosity.

CLAD is also ESG-compliant and labour-efficient. It provides an alternative to highly polluting subtractive technologies, enabling the re-shoring of production processes to OECD countries

C.L.A.D. - Continuous Laser-Assisted Deposition of Standard Materials
Manufacturing Sustainability, Flexibility and Product Miniaturisation

10.20AM

Exhibition Networking Event
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Exhibition Networking Event

10.40AM

Coffee & Exhibition

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Coffee & Exhibition

10.40AM

Electroninks
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Electroninks

11.30AM

MOD Inks for Additive Manufacturing

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Sima Hannani

Sima Hannani

MOD Inks for Additive Manufacturing

11.30AM

IDS
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IDS

11.50AM

Ultraprecision Aerosol Deposition: Applications in 3D Printing and Packaging

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Dov Henry Phillips

Dov Henry Phillips

Ultraprecision Aerosol Deposition: Applications in 3D Printing and Packaging

11.50AM

Printed Electronics Ltd
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Printed Electronics Ltd

12.10PM

Increasing the productivity of micron-scale printing with Superfine Inkjet (SIJ) and other tools.

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Neil Chilton

Neil Chilton

PEL is both an experienced manufacturer and specialist machine supplier for printable electronics. At TechBlick we present together with our key partner SIJ. In this presentation we will explain where we have used our knowledge to determine the optimal print methods for applications ranging from large area to ultra-fine-line printing. We will focus on new developments in SIJ including the high productivity multi-nozzle systems.

Increasing the productivity of micron-scale printing with Superfine Inkjet (SIJ) and other tools.

12.10PM

Neotech AMT
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Neotech AMT

12.30PM

Advances in 3D Printed Electronics

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Martin Hedges

Martin Hedges

This presentation will review recent advances in manufacturing sustainable 3D mechatronic systems using Additive Manufacturing (AM) technologies. A brief update of select key industrial applications in Luminaires, Medical and Signal Electronics will be given.

Advances in 3D Printed Electronics

12.30PM

Brewer Science
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Brewer Science

12.50PM

Printed Electronics for Air and Water Quality Measurements

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Adam Scotch

Adam Scotch

Brewer Science's vision is to design, build, and deploy connected gas and water sensors that monitor environmental contaminants quantitatively on a large scale. For the last 10 years, Brewer Science has developed the technology to print cost-effective sensors that can measure contaminants in water, such as heavy metals (lead, cadmium), copper, nitrate, pH, and ORP, as well as sensors that assess air quality by measuring gases like carbon monoxide, carbon dioxide, hydrogen, VOCs, and oxygen. Brewer Science fabricates a variety of printable sensor materials and deposits them onto a substrate utilizing processes such as physical vapor deposition (PVD) sputtering, screen printing, stencil printing, ink-jet printing, and high-speed jet dispensing. Producing low-cost sensors with low-power electronics and wireless communication will enable the deployment of sensors over vast areas for real-time monitoring of environmental conditions.

Printed Electronics for Air and Water Quality Measurements

12.50PM

Lunch & Exhibition
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Lunch & Exhibition

1.10PM

Lunch & Exhibition

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Lunch & Exhibition

1.10PM

Printed Energy
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Printed Energy

2.50PM

Printed batteries, any shape, everywhere

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Harsha Kolli

Harsha Kolli

Printed Energy, early-stage US based hard science company with deep expertise in electro chemistry, printed electronics, and manufacturing automation. The current focus is on flexible, printed, and thin batteries integrated into fully built-up circuits for a complete device such as active RFID. These batteries are non-toxic, environmentally friendly and can be manufactured in any shape and size based on customer requirements. Some of the applications include, smart tags and labels, wearables, medical supplies, tags for timed sporting events, and many other internet of things (IoT) uses. Even though Printed Energy is starting to enter the market, the team has been working on development of thin printed batteries for many years. The unique value that Printed Energy brings to its customer is the ability to manufacture fully integrated device that is cost competitive with coin-cell battery devices. Our proprietary manufacturing line allows us to enter the market and deliver high quality devices at a highly competitive price. Printed Energy’s initial product offering includes delivering disposable Active RFID tag solutions to an existing market with roadmap that includes Semi-Passive tags, temperature loggers and wearable cosmetic/medical patches.

Printed batteries, any shape, everywhere

2.50PM

Solliance/TNO at Holst
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Solliance/TNO at Holst

3.10PM

Towards Roll-to-Roll Manufacturing of Flexible Perovskite Solar Cells

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Ilker Dogan

Ilker Dogan

The scalable slot-die coating methods adopted within TNO enable fabrication of efficient perovskite solar devices with intrinsic stability using various material and layer combinations. Furthermore, several different encapsulation strategies are investigated to define a low-cost route to guarantee long term stable modules. Demonstration of a stable semi-transparent bifacial flexible perovskite module is a step forward on various applications, such as building- and vehicle-integrated PV (BIPV & VIPV) and noise barriers on highways. In this talk, we will give an overview of our story towards realizing a stable, efficient, and bifacial perovskite processed via roll-to-roll slot-die coating technique.

Towards Roll-to-Roll Manufacturing of Flexible Perovskite Solar Cells

3.10PM

CCL Industries Inc. - Imprint Energy
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CCL Industries Inc. - Imprint Energy

3.30PM

Ultrasafe Printed Batteries for Smart Electronics

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Ehsan Faegh

Ehsan Faegh

The rapid growth of smart electronics and internet-connected devices has spurred the demand for compact, flexible and energy-efficient power sources. Printed batteries have emerged as highly promising alternatives to traditional bulky batteries, such as AA or AAA, offering a distinctive solution by seamlessly integrating energy storage directly into electronic components and systems.

In recent years, lithium-ion batteries have dominated the market, however, the lithium-based batteries face several challenges, including lammability, toxicity and disposability concerns, and regulatory challenges related to shipping. Given the importance of safety in smart electronics applications, the adoption of environmentally friendly battery chemistries becomes paramount.

Imprint Energy has pioneered an ultrathin and flexible Zinc battery technology designed to meet the demanding power requirements of cellular applications across a wide range of operating temperatures, from -35°C to 60°C. Our innovative battery solution boasts a remarkable peak power of >1500 mW in a small form-factor.

Compared to lithium chemistries, Imprint Energy batteries excel in multiple performance aspects. A significant advantage of Imprint Energy zinc batteries is their non-hazardous classification, eliminating transport and operational limitations associated with hazardous goods like batteries containing lithium. This makes Zinc batteries particularly appealing for powering smart shipping labels, where safe and unrestricted transportation is essential.

Imprint Energy employs a cutting-edge manufacturing process utilizing screen and stencil printing technologies. The high-throughput sheet and roll-to-roll process ensures efficient and scalable production, enabling widespread adoption.

Herein, we present emerging applications where printed batteries can revolutionize smart electronics. These applications span across wearable devices, Internet of Things (IoT) sensors, flexible displays, electronic textiles, and medical devices and patches. We discuss the advantages offered by printed batteries produced at Imprint Energy in terms of safety, size, shape, weight, flexibility and seamless integration, which enable the development of innovative and user-friendly smart electronic products.

Ultrasafe Printed Batteries for Smart Electronics

3.30PM

Ensurge
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Ensurge

3.50PM

Manufacturing Scale-Up of mAh Class Anode-less Solid-State Lithium Microbatteries

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Arvind Kamath

Arvind Kamath

Rechargeable anode-less solid-state lithium microbattery technology has numerous advantages over conventional alternatives. These include higher volumetric energy density (VED), significantly faster charging with a simpler charging infrastructure and the ability to deliver higher discharge pulses than Li-ion alternatives. These flexible form factor, multi-layer stacked batteries built on stainless steel are key to enabling space constrained wearables, hearables and IoT applications. Addressing the difficult challenges of manufacturing scale-up on the path to commercialization requires addressing a number of challenges ranging from materials supply chain and roll-to-roll battery fabrication management to high-speed test and novel ultrathin packaging. Some examples of these coupled with battery performance will be presented.

Manufacturing Scale-Up of mAh Class Anode-less Solid-State Lithium Microbatteries

3.50PM

Exhibition Networking Event
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Exhibition Networking Event

4.10PM

Coffee & Exhibition Closes

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Coffee & Exhibition Closes

4.10PM

  TRACK 2 - Estrel Hall B
TNO at Holst
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TNO at Holst

9.00AM

Laser-Assisted High-throughput microLED Integration

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Gari Arutinov

Gari Arutinov

.With the growing demand for ever-smaller devices, such as mini- and microLED displays with higher resolution rates, there is an unstoppable trend toward the miniaturization of components. High-speed, mass-production of these electronics is getting more and more difficult because the handling and accurate placement of these tiny components is very challenging. Each component needs to be carefully selected, transferred, and then accurately placed and assembled with interconnects – all at lightning speeds. As conventional industrial equipment fails to deposit ultrafine patterns of die attach material and handle such tiny components at required high rates, this calls for the development of alternative high-throughput assembly technologies. At Holst Centre, we have developed laser-assisted processes enabling high-throughput flip-chip integration of microLEDs. More specifically, we demonstrate the capability of high-throughout printing of die attach materials (solder pastes and conductive glues) at sub-20µm resolution and highly-selective and accurate mass transfer of microLEDs at assembly precision of 1µm (lateral) and 1° (rotation) and >99.9% yield.

Laser-Assisted High-throughput microLED Integration

9.00AM

Toppan
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Toppan

9:20AM

Highly bendable oxide TFT withstanding over one million bending cycles

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Manabu Ito

Manabu Ito

In order to realize highly bendable oxide TFT, we have developed a novel organic / inorganic dielectric layer.
Our IGZO TFT with organic/inorganic hybrid dielectric layer can withstand one million bending tests at a bending radius of 1mm without employing the neutral plane concept.
Applications for wearable motion sensors are also demonstrated.

Highly bendable oxide TFT withstanding over one million bending cycles

9:20AM

Raynergy Tek
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Raynergy Tek

9.40AM

New Opportunity for Organic Semiconductors: Applications in Shortwave Infrared Photodetectors

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Yi-Ming Chang

Yi-Ming Chang

The demand for shortwave infrared (SWIR) sensors has shown significant growth in the market. However, the prevailing high costs of existing technology presents a challenge to widespread adoption in consumer electronics. In response, novel technologies have emerged, and among them, organic semiconductors have garnered attention due to their flexible molecular design, large-area coating capability, and devoid of heavy metals. These distinctive attributes position organic semiconductors as promising candidate for SWIR applications. In this presentation, we will summarize an overview of the current status and challenges of utilizing organic semiconductors for SWIR photodetectors from the perspective of a material developer.

New Opportunity for Organic Semiconductors: Applications in Shortwave Infrared Photodetectors

9.40AM

Hummink
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Hummink

10.00AM

The Submicron Printing Breakthrough

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Sahar Al Kamand

Sahar Al Kamand

The future is driven by advancements in microelectronics; however, the design and manufacturing of these intricate components pose significant challenges due to their small dimensions and the complex assembly process involved. Addressing this need, Hummink offers a cutting-edge HPCAP (High-Precision Capillary Printing) technology that allows the direct deposition of materials not only at the micron scale but also at the sub-micron scale. Leveraging Hummink's innovative AFM (Atomic Force Microscopy) based technology, the complex additive manufacturing process for microelectronics is streamlined into a simplified single-step procedure. In this presentation, we will underscore the significance of sub-micron printing in contemporary applications and show its wide-ranging applications in semiconductor packaging, display, biosensors, waveguides, and beyond.

The Submicron Printing Breakthrough

10.00AM

Brilliant Matters
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Brilliant Matters

10.20AM

Materials Developments for Stable, Scalable and Efficient Organic Solar cells

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Philippe Berrouard

Philippe Berrouard

With ever increasing energy needs, rising environmental regulations and a clear paradigm shift in the energy sector towards energy production from renewable sources, there is an immediate need for cost-effective and rapidly deployable renewables. Organic photovoltaics (OPVs) are a 3rd generation solar cell technology which can be mass produced using R2R printing methods and are made from earth abundant organic materials capable of efficiently harvesting light energy both in indoor and outdoor environments. Due to their incredible versatility, they can be made lightweight, flexible and partially transparent, which enables their use in many applications including agrivoltaics (greenhouses), IoT or building-integrated applications. This presentation will discuss some of the latest materials innovations from Brilliant Matters which enable the advancement of OPV technologies.

Materials Developments for Stable, Scalable and Efficient Organic Solar cells

10.20AM

Exhibition Networking Event
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Exhibition Networking Event

10.40AM

Coffee & Exhibition

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Coffee & Exhibition

10.40AM

CEZAMAT, Warsaw University of Tech..
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CEZAMAT, Warsaw University of Tech..

11.30AM

From Hands-On Experience to Calculated Composites: Case Studies of Scaling Up Biomedical Wearables

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Andrzej Pepłowski

Andrzej Pepłowski

After years of extensive research and development in biomedical wearables, focusing on chemical and physical measurements, we have gained significant expertise in their manufacturing. Our extensive knowledge of ink dynamics, colloid mechanics, and material characterization enables us to understand the underlying phenomena in technological processes. Starting from material composition and preparation to printing and device operation, we effectively translate our expertise into scientific advancements. Through quantitative and reproducible methods, we establish the foundation for groundbreaking innovations in printed electronics.

From Hands-On Experience to Calculated Composites: Case Studies of Scaling Up Biomedical Wearables

11.30AM

SunRay Scientific
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SunRay Scientific

11.50AM

A Novel, Robust Anisotropic Conductive Epoxy Technology for Advanced Electronics Packaging Applications

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John Yundt

John Yundt

In this work, we propose a novel packaging concept for highly integrated RF systems using SunRay Scientific’s magnetically aligned ZTACH® ACE. We demonstrate the ability to "grow" z-axis interconnects allowing for multilayer packages that are not sensitive to the height between pads. Using this effect, we
introduce two approaches to integrating multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated system-in-a-package. First, a reverse-pyramid package with all chips stacked facing down on a silicon substrate is demonstrated. Second, a "Matryoshka" package assembled with the alternation of chip's face direction is also demonstrated. The simplified assembly process of ZTACH® ACE and the new packaging concepts can offer a compact and cost-effective solution to system-in-package based RF systems. This technology can be processed at temperatures ranging from 80˚C up to 160˚, making it friendly to a range of substrates and applications from PCB, FPC, Flexible Hybrid Electronics and even wearable textile applications where device attach presents considerable issues.

SunRay Scientific will present its success in the development of a novel anisotropic conductive adhesive, ZTACH® ACE, for the next level of heterogenous integration. Materials and process development will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements were made for die-to-die bonding and Ball Grid Arrays (BGA) on Polyimide. Test results will show the thin ZTACH® ACE bond, typically 25 – 75 microns thick, provides superior adhesion, low contact resistance, and mechanical robustness on a range of rigid, semi-rigid and flexible substrates during electromechanical testing. Updates on progress towards achieving ≤ 50-micron pitch will be shared.

A Novel, Robust Anisotropic Conductive Epoxy Technology for Advanced Electronics Packaging Applications

11.50AM

Lehigh University
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Lehigh University

12.10PM

Epidermal Electronics for Digital Therapeutics and Companion Digital Diagnostic Applications

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Dhruv Seshadri

Dhruv Seshadri

Epidermal Electronics for Digital Therapeutics and Companion Digital Diagnostic Applications

12.10PM

Rochester Institute of Technology
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Rochester Institute of Technology

12.30PM

Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets

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Denis Cormier

Denis Cormier

Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets

12.30PM

Celanese
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Celanese

12.50PM

Silver Sintering Pastes - Improved Bond Performance and Simplified Handling

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Andree Maindok

Andree Maindok

Silver sintering pastes and films are widely used for attaching SiC dies to their substrates in modern power electronics. They offer mechanical stability to well above the use temperatures (>200C), high thermal conductivity, and do not form brittle inter-metallics. They provide a strong, high reliability bond, especially when sintered with pressure assistance. However, they are not always easy to work with. Developing a product that will sinter at modest temperatures and with modest levels of pressure often results in an unstable formulation that requires cold storage and transport. These products then require conditioning to bring them up to working temperatures before they can be used. If the product cannot be dried before die placement, die size will be limited, or reliability will suffer due to trapped organics left after the sintering process. We have developed several novel paste formulations for sintered silver die, heat sink and top of die attach. They are shelf stable for months at room temperature, offer long open working times with little or no viscosity drift. They can be metal mask stencil printed syringe dispensed, or jetted, and are dried before placement (even when dispensed), allowing large area dies and substrates to be bonded without loss of reliability or thermal performance. We also have new developments in high reliability performance for large area heat sink attachment at reduced temperature and pressure. This allows attachment of encapsulated die/substrate structures onto heat sinks without damage to the organic encapsulant. Extensive reliability test data for these novel formulations will be shared that includes harsh liquid to liquid thermal shock performance.

Silver Sintering Pastes - Improved Bond Performance and Simplified Handling

12.50PM

Lunch & Exhibition
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Lunch & Exhibition

1.10PM

Lunch & Exhibition

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Lunch & Exhibition

1.10PM

CONTAG AG
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CONTAG AG

2.50PM

A versatile toolbox for innovative mechatronic systems in industrial applications

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Hendrik Mohrmann

Hendrik Mohrmann

Coming from prototyping of complex PCBs in automotive, telecommunication, medical and other applications, we developed a versatile toolbox providing customized 3D electronics. The use of stretchable substrates such as polyurethane greatly expands the possibilities of conventional flexible and rigid-flexible boards by allowing conformal changes of the PCB. Meandering layout in combination with a textile reinforced dielectric allows controlled stretchability up to 30% with anisotropic stress compensation. The consequent use of Copper allows high conductivity and complex networks with seamless transitions between different dielectric materials. We can thus produce stretchable hybrid multilayer boards that include the whole world of PCB materials and technologies.

The portfolio is further supplemented by solutions from the field of printed electronics. 3D-MIDs are realized by stereolithographic printing of LDS-prepared UV-curing resin as a fast alternative for injection moulding in prototyping and small series. Integration of antennas, sensors and cables into one mechatronic product facilitates assembly, improves reliability and reduces costs.

A versatile toolbox for innovative mechatronic systems in industrial applications

2.50PM

Cicor Group
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Cicor Group

3.10PM

Printed sensors using aerosol jet technology

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Karl-Heinz Fritz

Karl-Heinz Fritz

Aerosol jet technology offers capabilities in printing sensors in 2D and 3D, as well as a way to connect off the shelf components in a very efficient and space saving way.

This presentation will give an overview about different ways to make best use of the capabilities.

Printed sensors using aerosol jet technology

3.10PM

Kynze
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Kynze

3.30PM

Sensor Integration and Antenna for Connected Medical Applications

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Florent Lefèvre

Florent Lefèvre

Sensor Integration and Antenna for Connected Medical Applications

3.30PM

National Research Council Canada
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National Research Council Canada

3.50PM

Molecular Inks Applied to Printed and In-Mold Electronics

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Arnold Kell

Arnold Kell

Molecular Inks Applied to Printed and In-Mold Electronics

3.50PM

Exhibition Networking Event
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Exhibition Networking Event

4.10PM

Coffee & Exhibition Closes

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Coffee & Exhibition Closes

4.10PM

  TRACK 3 - Paris Room
RMIT University
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RMIT University

9.00AM

Stretchable and flexible electronics reshaped for industry-driven aged-care technologies

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Sharath Sriram

Sharath Sriram

The convergence of lab-based discoveries and industry-need created reimagined products based on stretchable and/or flexible substrates.Soft electronics made of silicone were translated into a printed technology to create smart bedding products to monitor aged-care residents and improve quality of care. Working closely with manufacturers, the evolution of the technology from stretchable electrodes to a sensor array across a mattress, will be covered. This approach represented a new take on production of electronic textiles.Combining flexible substrates with surface mount components, composite structures have created a category of modular sensing skin patches. Based on clinical need, different sensor combinations have been utilised for aged-care health monitoring, with potential use cases targeted to dementia care and post-operative management.

Stretchable and flexible electronics reshaped for industry-driven aged-care technologies

9.00AM

VTT
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VTT

9.20AM

Towards roll-to-roll manufacturing of green wearable electronics

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Teemu Alajoki

Teemu Alajoki

Towards roll-to-roll manufacturing of green wearable electronics

9.20AM

DELO
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DELO

9.40AM

Adhesive Solutions for Flexible Substrates and Electronics

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Sven Hujo

Sven Hujo

Flexible electronics have the great potential to reshape the upcoming decade from automotive interior design to smart textiles. In this presentation the potential of new functional polymers will be highlighted, which are on the one hand side capable to ensure flexibility and on the other hand side long term reliability. The property profile of functional polymers or adhesives is able cover a wide range of bonding and coating applications in flexible electronics. To ensure both electrical and mechanical connection of SMDs on flexible substrates it is possible to dispense non-conductive (NCA) and isotropic conductive adhesives (ICA) together to combine their benefits. For this reason, adhesive solutions are important for the introduction of new flexible electronic devices and applications to the market.

Adhesive Solutions for Flexible Substrates and Electronics

9.40AM

Danish Technological Institute
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Danish Technological Institute

10.00AM

DTI Printed Electronics: The One Stop Shop for eTextiles, Structures Monitoring and more.

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Zackary Davis

Zackary Davis

The demand for flexible, stretchable and sustainable electronic solutions is growing rapidly due to the growth in eHealth, automotive, smart buildings and other similar application areas. At the core is printed electronics, which uses printing technologies such as screen, flexographic and inkjet printing, together with functional materials and inks to fabricate electronics directly onto plastic foils, paper or textiles.

To de-risk European industry to adept these novel materials and technologies, Danish Technological Institute (DTI), has established a One-Stop-Shop, which facilitates European industry with consultancy, development and pilot production. DTI can take novel ideas and perform proof of concept projects, develop these into full prototypes and in many cases, upscale prototypes to a pilot scale. Furthermore, DTI can provide support throughout the entire value chain, from materials to final products.

In this presentation, you will witness DTI's work on novel material formulations, particularly focusing on bio-based and sustainable printable materials, including copper-based and transparent silver nanowire inks. DTI will showcase various fully functional demonstrators and prototypes they have developed, ranging from wearable EMG sleeves and heated undergarments to crystal lighting and embedded sensors in drones.

DTI Printed Electronics is also heading a vast network through the formation of the open innovation test bed, Sustainatronics. This collaborative initiative involves leading research and technology organizations, as well as industries across Europe, accessible through a single-entry platform. Through Sustainatronics, you can access dedicated services as well as infrastructure access to the best printed electronics laboratories in Europe.

DTI Printed Electronics: The One Stop Shop for eTextiles, Structures Monitoring and more.

10.00AM

Yamagata University
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Yamagata University

10.20AM

Flexible Printed Carbon-based Sensors and Their Applications

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Shizuo Tokito

Shizuo Tokito

Our research group at Yamagata University in Japan is actively developing flexible and printed organic electronics, covering all related technologies from materials and devices to fabrication processes and applications. Our focus is on wireless applications for healthcare, robotics, and logistics.
We have recently developed highly sensitive and reliable pressure, strain, and humidity sensors using composite materials of carbon and polymeric materials with simple printing methods. The pressure sensor exhibited a high resistivity change with a sensitivity of 0.014kPa-1 when pressure was applied. The stretchable strain sensors demonstrated high sensitivity with a gauge factor of approximately 14 and could stretch up to 100% with small hysteresis. The developed humidity sensors exhibited a high resistive response of 120% over the relative humidity (RH) range of 30% to 90% through an absorption and desorption mechanism, with fast response and recovery times.

We have used these sensors to demonstrate human pulse wave and respiration detection, as well as tactile sensing for robot grippers. In addition, we have established flexible hybrid electronics (FHE) with screen printing methods and combined these sensors with the FHE technology to realize more practical applications for the Internet of Things (IoT) society.

Flexible Printed Carbon-based Sensors and Their Applications

10.20AM

Exhibition Networking Event
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Exhibition Networking Event

10.40AM

Coffee & Exhibition

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Coffee & Exhibition

10.40AM

Coatema
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Coatema

11.30AM

Upscaling OPV into production tech

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Thomas Kolbusch

Thomas Kolbusch

Upscaling OPV into production tech

11.30AM

The Warming Surfaces Company
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The Warming Surfaces Company

11.50AM

Digitalizing heating for a sustainable future”

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Jani-Mikael Kuusisto

Jani-Mikael Kuusisto

Integrating ultra-thin large area electrical radiant heaters into interior surface and furniture materials enables fast response warmth. Controlling heating like lighting delivers increased energy efficiency, comfort, and better health in built environments. This talk looks at how The Warming Surfaces Company is bringing its Halia™ warming technology to various surfaces to improve people’s lives while reducing material and energy requirements of heating.

Digitalizing heating for a sustainable future”

11.50AM

Sinovia Technologies
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Sinovia Technologies

12.10PM

Flexographically Printed OLED Indicator and Passive Matrix Displays

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Whitney Gaynor

Whitney Gaynor

OLED is widely known as the highest quality display on the market, used in flagship products such as high-end TVs and smartphones. Many of the early promises of OLEDs have been realized and commercialized, including their ultra-thinness and potential for flexibility. However, today's flexible OLEDs are still fabricated in much the same way as rigid OLEDs on glass. And most of the innovation in the field is still aimed at high-end consumer products. At Sinovia, we are using roll-to-roll flexographic printing to fabricate bottom-emitting OLEDs suitable for use in segmented, indicator, and passive matrix displays at price points that can compete with incumbent LCDs and LED assemblies. This is enabled by our proprietary materials technology and our in-house process, along with some key supplier partnerships. In this talk, I will cover our core technology, our development status, applications of our displays, and our future plans as we move toward mass production.

Flexographically Printed OLED Indicator and Passive Matrix Displays

12.10PM

Inuru
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Inuru

12.30PM

Affordable Surface Lighting for Visual Interfaces through printed OLED technology

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Marcin Ratajczak

Marcin Ratajczak

Surface Lighting has the ability to change the world of design and change how we interact with products around us. It is a game changer for the printed electronics industry, since light and visual interfaces are becoming a part of any product. We are becoming completely depended on light as a indicator and design element, that communicates ambience, emotions, and statuses. Today Visual Interfaces have to be assembled through the hybrid electronics approach. LEDs are picked and placed and covered with light guides to achieve the target shape and form. Technologies like this maybe cheap to manufacture in mass, but they are hard to setup and to incorporate and any adjustment in shape requires additional setup costs and time. Surface lighting is paper-thin and thus has no space requirements. Affordable Surface Lighting technologies so far have been also accompanied with draw-backs of complex driving electronics, large size or lack of brightness. A technology that can meet all of this is OLED. OLED are made in process that are similar to the chip manufacturing industry. This makes them expensive in unit cost and even more in setup. Thus the dream of Light Everywhere, OLED Everywhere vanishes quickly on hard economical reality. Inuru has simplified the way OLEDs are manufactured by not taking the material into vacuum to to evaporate them, but taking the molecules and printing them. We are utilizing state of the art ink-jet technology used for color printing today. The infrastructure we use for an output of 8M panels require a fracture of the space than conventional evaporation processes. The additive manufacturing of ink-jet allows us to save materials, reduce cost and print any shape in real time, on demand like color. We are 3D printing lighting on a nano-meter precision. This technology will revolutionize the electronics manufacturing and will open printed electronics industry to a wider audience.

Affordable Surface Lighting for Visual Interfaces through printed OLED technology

12.30PM

SamwonAct
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SamwonAct

12.50PM

Metal Pattern Transfer Printing Technology

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Kyung Yul LEE

Kyung Yul LEE

Micro electronic pattern and flat cable core manufacturing process with electroforming by roll to roll equipments. This process can be applied to the development of flexible flat-cable, copper electrode of solar cell and flexible electonic components. The first advantage of this process is that relative long and wide scale metal pattern could be produced.

Metal Pattern Transfer Printing Technology

12.50PM

Lunch & Exhibition
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Lunch & Exhibition

1.10PM

Lunch & Exhibition

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Lunch & Exhibition

1.10PM

 Fraunhofer IZM
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Fraunhofer IZM

2.50PM

Integration Technologies for Next Generation Wearables

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Erik Jung

Erik Jung

Integration Technologies for Next Generation Wearables

2.50PM

Loomia Technologies
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Loomia Technologies

3.10PM

The Electronic Textile Landscape: Use Cases, Technologies and More

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Madison Maxey

Madison Maxey

This talk provides an analysis of the current electronic textile landscape, the USP of using these materials and where they can be valuable in industry. Attendees should walk away from this talk with a clear picture of the current technologies leading this field and when to choose an electronic textile over more standard electronic solutions like Flex PCBS.

The Electronic Textile Landscape: Use Cases, Technologies and More

3.10PM

3E Smart Solutions
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3E Smart Solutions

3.30PM

Reliable mass production of e-textiles using embroidery technology

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Steliyan Vasilev

Steliyan Vasilev

Embroidery is a textile manufacturing technique that has its roots in historic hand-stitched garment design. However, with the invention of computers, this textile manufacturing technique has seen a resurgence due to its high levels of material optimization. Embroidery allows the textile engineer to place single fibers, yarns, fiber bundles, or even wires with high precision in a variable, predesigned geometry. Because of this high precision, embroidery is highly applicable for integrating functionality into textiles through textile sensors, actuators, or electrodes. Three types of embroidery technologies are commonly used and defined in the literature. These include chain and moss stitch embroidery, standard embroidery as well as tailored fiber, wire, or tube placement. Each of these methods can be utilized in varying ways for the mass production of smart textiles. The embroidery technology offers enormous possibilities for the automatic integration of conductive fibers and electronic components into textiles to create e-textiles. E-textiles are in development for decades but only a few products could make it to the market. The main reason for this lack of products on the market is the high production costs. Manual production steps increase the production costs and lead to high product costs. Furthermore, reproducibility cannot be guaranteed or manually created products. The high level of automation of the embroidery process finally allows the mass production of e-textiles.

Reliable mass production of e-textiles using embroidery technology

3.30PM

Mycronic AB
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Mycronic AB

3.50PM

Sustainable, digital production of wearable soft-stretchable electronic devices

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Gustaf Mårtensson

Gustaf Mårtensson

The production and consumption of electrical and electronic equipment (EEE) in the European Union (EU) are on the rise (Eurostat 2020). Due to low levels of reuse, collection, recycling, and other forms of recovery of waste EEE, the consumption of rare and expensive natural resources is also increasing. This imposes higher economic and environmental pressure on manufacturers of modern electronic devices. As new fields of applications for stretchable electronics continue to emerge, such as wearable smart textiles and medical/health-monitoring devices, the market for stretchable electronics is expected to grow rapidly. Amid the COVID-19 crisis, research indicates that the global stretchable electronics market will reach $2.6 billion by 2027 (Researchandmarkets 2020).

The development of methods to assess the ecological impact of not only the electronic device, but also the production process, is an area of research that is growing. Life Cycle Assessment (LCA) is a useful method to identify and quantify the environmental impacts of a product, process, or activity. Comparative LCA can be carried to compare the environmental impacts of two or more products that have similar functionality (Kokare, 2022).

The production process for stretchable electronics that is being developed is based on a digital production strategy, where the production steps are digitally controlled and optimised. An example of a proposed production line, including deposition machines, inspection devices et cetera, will be presented. A comparative life cycle assessment of stretchable and rigid electronics-based cardiac monitoring devices will be discussed to elucidate aspects of the production process from an environmental point of view.

Sustainable, digital production of wearable soft-stretchable electronic devices

3.50PM

Exhibition Networking Event
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Exhibition Networking Event

4.10PM

Coffee & Exhibition Closes

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Coffee & Exhibition Closes

4.10PM

Closing Presentations - Estrel Hall A
Beko
Graham Anderson

Beko

Graham Anderson

Can additive electronics help in the white goods industry

4:30 PM

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Airbus
Dennis Hahn

Airbus

Dennis Hahn

The Printed Future At Airbus

4.40PM

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Presentation of an animated movie of our end-to-end vision on how we imagine the printed electronics technology may impact the aviation industry. Introducing our current status of technology testing (hopefully with some breathtaking photos) and open topics such as customization software, max automation and end of life processes. Q&A.

TechBlick
Khasha Ghaffarzadeh

TechBlick

Khasha Ghaffarzadeh

Thank you and see you again next year!

5:00 PM

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Drinks Reception & Exhibition

5:35 PM

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