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TechBlick Blog

15 October 2018

Adhesive ACF for efficient room temperature bonding in FHE

Speaker: Morten Lindberget | Company: CondAlign AS | Date: 24-Jun-22 | Full Presentation The CondAlign anisotropic conductive film is an adhesive (ACF) that bonds electronic components at room temperature and low pressure. With mechanical properties like softness, flexibility and good adhesiveness, achieved by efficient use of the conductive particles, this product addresses a key challenge in the FHE area; how to attach components to flexible substrates at room temperature. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

1 October 2018

Demonstration of high frequency 5G modules using LTCC

Speaker: Brian Laughlin | Company: DuPont Microcircuit & Component Materials. | Date: 24-Jun-22 | Full Presentation DuPont™ GreenTape™ 9KC Low-Temperature Co-fire Ceramic (LTCC) tape and silver (Ag) metallization was used to fabricate an antenna-in-package (AiP) radio frequency front end (RFFE) module operating at 28 GHz. DuPont collaborated with ITRI in Taiwan to design, fabricate, and test this AiP RFFE module which utilizes a Anokiwave phasor chipset and a 2x4 patch antenna array that gives >18 dBm Effective Isotropic Radiated Power (EIRP) while steering the radiated beam over ±35° with <1 ppm error vector magnitude (EVM) under 64 QAM modulation. This reference design is analogous to many use cases for 5G telecommunication deployment such as small cells and mmWave base stations where LTCC is a excellent material platform due to high reliability, superior thermal performance, and stable material performance at high frequency over all practical ambient conditions. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.c...

TechBlick Blog

17 September 2018

Evolution of touch surfaces – Haptic feedback

Speaker: Stefano Bianchi | Company: Seristampa | Date: 24-Jun-22 | Full Presentation We are going to show a prototype made by Seristampa with an IMD surface joint to a capacitive foil (printed with stretchable conductive inks) assembled on an electromechanical device, giving mechanical feedback under your finger once you press the touch surface. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

3 September 2018

Flexible conductive adhesives for thin film solar cells and flexible (in-molded) electronics

Speaker: Robert Boks | Company: Panacol-Elosol GmbH | Date: 24-Jun-22 | Full Presentation Flexible electrically and thermally conductive adhesive systems are mostly heat curing adhesives which have a given flexibility after curing. They are perfectly designed for flexible(in-molded) electronics, for example in the field of wearable stretchable electronics and thin-film solar cells. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

8 October 2018

Recent advancements in organic photovoltaics

Speaker: Nicolas Bouchard | Company: Brilliant Matters | Date: 24-Jun-22 | Full Presentation Organic photovoltaic (OPV) technologies have been steadily moving towards market-ready applications in the past decade due to rapid evolutions in materials discovery, device stack engineering and processing strategies. For instance, OPV technologies being tunable, flexible, and semi-transparent, are ideal candidates for photovoltaic modules for indoor energy harvesting and integration into buildings (BIPV). Materials innovation is at the forefront of the quest towards reaching better power conversion efficiency (PCE). While this innovation is mostly focused on reaching a higher efficiency level, the industry has challenges of its own in its materials selection. At Brilliant Matters, we believe that addressing industrial figures of merits, such as printability and synthetic sustainability, is key to enabling the lab-to fab transition. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback abou...

TechBlick Blog

24 September 2018

Wearable skin patches as a key enabler for digital health

Speaker: Pauline Hibon | Company: Quad Industries | Date: 24-Jun-22 | Full Presentation Quad Industries is a printed electronics solution provider that delivers value through exceptional print, assembly and converting skills. We enable innovation, growth and customer success through long term partnerships! By means of highly accurate screen-printing, we integrate smart functionality on a wide range of flexible and stretchable films. This presentation focuses on technology and application developments in the domain of medical electrode patches. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

10 September 2018

Next-generation 3D Formable Substrates

Speaker: Menno Bos | Company: KIMOTO | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

TechBlick Blog

27 August 2018

Soft, Stretchable and Functional: Printed Hybrid Electronic Demonstrators made with High-Temperature

Speaker: Minami Masato | Company: Panasonic Electronic Materials | Date: 24-Jun-22 | Full Presentation Printed electronics manufacturers are continually developing new use cases using Panasonic BEYOLEX film. This unique thermoset substrate is very soft, has high temperature resistance and almost zero permanent deformation after strain. This talk will briefly highlight several examples of PE devices made with this new. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

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