Future of Electronics RESHAPED USA - Where The Global Additive, Printed, Hybrid, 3D Electronics Industry Connect   Join us and 500 professionals in Boston on 11 and 12 June 2025 to RESHAPE The Future of Electronics, making it Additive, Sustainable, Flexible, Hybrid, Wearable, Textile-Based, R2R, Soft, Stretchable, InMold, etc   ✅70+ Onsite Talks ✅70+ Onsite Exhibitors (All exhibitor spots SOLD OUT) ✅8 Masterclasses ✅2 Tours ✅500  Attendees ✅1500 Talks in the On-Demand Talk Library and Online Annual Access to All Future of Online and Onsite Events   FINAL Early Bird Rates END on 30 MAY World-Class Agenda Explore the world-class agenda featuring 70 invited contributions covering the full spectrum of applications, processes, materials, and R&D. Explore the agenda here. SOLD OUT Exhibition A sold-out dynamic exhibition awaits you offering you the chance to see and experience the latest and find your next partners, manufacturers and suppliers. What will be next in additive, hybrid and 3D electronics is already on show here! Explore exhibitors  here Year-Round Program You will also have access to all our past events as well as on-demand version of all upcoming onsite talks including all talks and masterclasses taking place at our Future of Electronics RESHAPED Europe. The agenda will be released soon but you can see a sneak peek here...

National Research Council of Canada, Ottawa, Canada 3D electronics afford a means to miniaturize and enhance the performance and integration of electronic devices; however, adoption of 3D-printed electronics has been delayed by the lack of processes to effectively produce high-resolution metallic interconnects with good electrical performance on complex 3D shapes. While direct-write 3D printing has demonstrated the ability to generate conformal conductive interconnects, the technique is slow and yields low print resolution. The National Research Council of Canada (NRC) has developed a new fabrication approach based on tomographic volumetric additive manufacturing (VAM) that can produce electronics on complex 3D shapes with high manufacturing speed, high conductivity and 3D design freedom. Do not miss TechBlick event on 11-12 June 2025 in Boston . Our Final Attendee Discount Ends Soon!  Book you tickets now. We are Exhibiting! Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend VAM is an emerging 3D printing technique developed in 2019 [1,2] and has since advanced as an additive manufacturing approach that can yield complex 3D objects with ultra-high speeds, with no support structures or layering artifacts. [3-7] The approach projects light patterns onto a rotating vial containing liquid photoresin. When the absorbed light dose reaches a critical threshold, the photoresin cures, resulting in solid polym...

TechBlick's The Future of Electronics RESHAPED USA - Why Should You Join Us? The Future of Electronics RESHAPED USA (Boston, 11 & 12 June 2025) is just less than a month away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches. This is the only event in North America dedicated to additive, printed, sustainable, hybrid, wearable and 3D electronics. See the program here . In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In a previous article we highlighted some process innovations and material innovations as well as applications, manufacturing, and enabling technologies related to flexible hybrid electronics in wearable sensors and biosensors In this particular article, we focus on several applications beyond wearables/sensors as well as additional critical process innovations that advances the art of additive, hybrid and 3D electronics. Final Early Bird Discount Ends Soon! NASA Goddard Space Flight Center : NASA’s 3D Printed Electronics Lab enables custom antennas, sensors, and circuits to be printed directly onto spacecraft surfaces, enhancing performance and reducing SWaP. Printed solutions allow precise control over materials and geometry, improving reliability and accelerating mission design cycles. Raytheon | An RTX Business presents advances...

From AI-powered AR smartglasses to defect-free red micro-LEDs: Innovations shaping the future of electronics This edition dives into work by LetinAR, Arkema, ADDEV Materials, Micropen Technologies, and Verticle. You’ll learn how LetinAR’s plastic reflective waveguides are bringing high-performance AI into everyday smartglasses, how Arkema’s printable piezoelectric polymers are enabling smarter human-machine interfaces, and how ADDEV’s ultra-thin heating film is already being used by battery manufacturers for safety testing. We also explore Micropen’s unique 5-axis printing system for space-grade materials and Verticle’s solution to a long-standing bottleneck in red micro-LEDs: defect-free mesa etching. LetinAR | Advancements in plastic reflective waveguides for enhanced AI integration in AR smartglasses Arkema | Piezoelectric Polymers: Transforming Sensor Technology with Innovative Solutions ADDEV Materials | Flexible Printed Substrate as a Smart Heating Solution for Industrial applications Exxelia Micropen | Thermoformable and lightweight dielectric materials for use in 3D additive manufacturing Verticle | Defect-free AlGaInP micro-LEDs by wet chemical etching The Future of Electronics RESHAPED USA   #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration: 🎤 70+ World-Class Speakers 🏢 75+ Global...

We are excited to announce that TechBlick’s flagship event, Future of Electronics RESHAPED USA , will take place on 10–11 June 2026  at the iconic Computer History Museum  in Mountain View, California . 🗓 Event:  Future of Electronics RESHAPED USA 📅 Dates:  10 & 11 June 2026 📍 Venue:  Computer History Museum 📌 Location:  Mountain View, California 🎤 Organised by:  TechBlick This premier international event is North America’s largest and most important exhibition and conference focused on the latest advancements in: Additive Electronics Printed Electronics Hybrid Electronics 3D Electronics Sustainable Electronics Soft Electronics Wearable & Textile Electronics Flexible & Stretchable Electronics Formed & R2R Electronics ... and more! 🔜 More details, including our 80+ exhibitor floorplan, will be announced in June 2025. In the meantime, explore our upcoming  and past  editions of Future of Electronics RESHAPED: Upcoming 2025 (Boston) 2025 (Berlin) Past 2024 (Boston) 2024 (Berlin) 2023 (Berlin) 2022 (Eindhoven)...

Author: Johanna Zikulnig, Silicon Austria Labs As the sensor market surges ahead, driven by megatrends like the Internet of Things (IoT), digital healthcare, and smart packaging, it's becoming increasingly urgent to consider not just how sensors are made, but also but also what happens to them at the end of their life cycle. At Silicon Austria Labs (SAL), we are investigating a critical yet often neglected aspect of this growth from manufacturing until the end-of-life (EoL) of printed and hybrid sensors. Our research focuses on sustainability-driven design to address environmental implications. Why Now? Three Key Drivers 1. Ubiquitous Sensing The global sensor market is expanding rapidly, with an estimated annual growth of ~9% [1]. From automotive to digital health and industrial automation, sensors are being embedded everywhere to enable real-time monitoring and smart control. Driven by the rise of IoT-enabled environments, this trend will only accelerate. 2. Emergence of Single-Use Applications Fields like point-of-care (PoC) diagnostics [2] and smart packaging [3] are seeing unprecedented growth. These applications often require low-cost, disposable sensors integrated directly into products or packaging. Printed electronics have emerged as a key enabling technology in this context, offering thin, flexible, and scalable solutions that meet performance and cost demands. While functionally effective, these single-use applications raise red flags for sustainability. 3. Electro...

Author: Rudy Ghosh, Vice President - Business and Applications Development, NovaCentrix

#PrintedElectronics #AdditiveElectronics #GoldInks #CondutiveInks #Innovation #HighAspectRatio The performance demands of next-generation electronic systems—especially in biomedical devices, sensors, and RF platforms—are outpacing what traditional fabrication methods can deliver. Increasingly, designers require conductive materials that can support not only fine-line patterning but also vertically structured, high-aspect-ratio features on unconventional substrates. At NovaCentrix, we’ve developed advanced gold inks optimized for exactly these challenges, engineered for compatibility with high-resolution deposition systems like inkjet and aerosol jet printers. We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston . Contact us for your special discount coupon to attend Material Design for 3D and High-Fidelity Printing NovaCentrix’s Metalon® gold inks are designed to meet the precision demands of modern additive electronics—particularly in biomedical engineering—where fine features, complex 3D geometries, and biocompatibility are all critical requirements. Two of our flagship inks, JG-125 and JG-024UA, exemplify this focus on performance and process adaptability. JG-125 is a water-based gold nanoparticle ink optimized for inkjet printing, offering excellent stability, adhesion, and print fidelity on flexible and rigid substrates. It is well-suited for app...

TechBlick's The Future of Electronics RESHAPED USA - Why Should You Join Us? The Future of Electronics RESHAPED USA (Boston, 11 & 12 June 2025) - co located with the Wearables RESHAPED conference - is nearly a month away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches. This is the only event in North America dedicated to additive, printed, sustainable, hybrid, wearable and 3D electronics. See the program  here.   In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In a previous article we highlighted some process innovations ( here)  and material innovations ( here ) which will showcased In this particular article, we focus on the following Wearable devices and continuous healthcare/vital signs monitoring Flexible Hybrid Electronics (FHE) in biosensors, wound care, and neural simulation Wearable sensor manufacturing Electronic textile development and manufacturing Pioneering R&D in wearable sensors and FHE Enabling materials (inks, substrates, adhesives) and technologies for wearable sensors, biosensors and e-textiles Wearable Healthcare Monitoring Patches and Biosensors GE Healthcare is invited to explore wearable physiological and molecular monitoring patches designed for both medical and defense applications, single-use Vital Signs Monitoring (V...