Speaker: Sagi Daren | Company: PrintCB| Date: 10-11 March 2021 | Full Presentation The race for Electric Vehicles (EVs) and sustainable energy resources creates big opportunities for advanced materials. Copper, although a widely used material in electronics, has not played a major role in car manufacturing, mainly due to its tendency to oxidize fast when printed, thus losing its conductivity. PrintCB has developed a novel copper-based, materials platform that enables straightforward use of copper in various applications while maintaining stable electric and thermal conductivity. During the presentation, the technology will be reviewed alongside new solutions developed to address real-life challenges in vehicle electrification. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Silver nanoparticle inks improve every year. These improvements are often incremental, but very important. One ever-present direction of development is towards inks which offer ever higher conductivity levels at a low curing temperature and a short curing time. This a critical figure of merit because it opens more substrate choices, saves time, and lowers energy consumption costs.
Here, we highlight the progress by Agfa, who offers both solvent and water based, as well as screen and inkjet printed (IJ) Ag nanoparticle (NP) inks. The first slide below shows the progress in curing time and temperature of a solvent-based IJ printable Ag NP inks. The left picture is the zoomed up version of the right picture. The compares the properties of two different solvent based IJ Ag NP inks: SPS201 and SPS210 sintered at different temperatures (110C, 130C, and 150C).
For a given sintering temperature, we can see that SPS210 reaches a lower resistivity level at a shorter time compared to SPS201, clearly demonstrating this incremental but important advancement of the Ag NP ink technology. As seen in the following slide, the SP2010 Ag NP IJ ink can achieve 3mOhm/sqr/mill when sintered at just 130C for 10min. These are excellent results.
IJP Ag NP inks are beginning to find suitable applications. In the last slide, you can see printed Ag NP lines as narrow (70um) metallization line on a thin film photovoltaic technology (note: screen printed lines on Si PV are now 34um). Next to it, you ...

Coatema Coating Machinery GmbH has demonstrated exciting developments, showing a pathway ultimately towards autonomous self-optimising coating and printing machines within the next decade or so. As can be seen below, Coatema develops multi-station printing and coating systems, inline integrating R2R slot die coating, inkjet printing, drying, laser processing, intense light sintering, winding/unwinding, etc. The example below is a machine installed at the OET - Organic Electronic Technologies P.C. in Greece. Of course, printing and coating are complex technologies with a large multi-parameter pace. Just some of the parameters are shown below. Therefore, product development and transition from lab-to- fab can be time consuming and challenging since finding as well as maintaining optimal printing, coating, drying, and sintering conditions across such as complex multi-step system can be a significant challenge, particularly for printing multi-layer devices or structures and for lab-to-fab transition. Coatema now integrates multiple measurement points inline within its machinery (see below). The result is millions of data points per minute as output, giving insights at every stage of the process. To make sense of all these data points, Coatema, together with partners Panda, is developing AI algorithms, which, for example, enable automatic identification of the location of the anomalies on the coated or printed surfaces. This automatic AI-based anomaly detection can be done in th...

Andy Behr, Technology Manager, Panasonic Electronic Materials
andy.behr@us.panasonic.com
North America website: https://na.industrial.panasonic.com/products/electronic-materials
Visit our virtual booth The simple and direct answer is - because this is how we have always made them. And, for the last 80 years or so, this planar approach has served humanity pretty well. IC chips are flat and rectangular. Circuit boards are flat and rectangular. Displays are flat and rectangular. And we make these things by the millions! However, it’s challenging for designers to create alternative form-factor devices when all the primary functional components available are hard, flat, and rectangular. But, as Bob Dylan sang, the times they are a-changing. Creative companies have realized that there’s an enormous and emerging demand for new form factors across a wide variety of industry verticals. Advances in printed electronics, 3D printing, additive manufacturing, roll-to-roll processing and soft electronics are enabling new devices in sectors as diverse as medical/wellness/healthcare, automotive, aerospace, robotics, extended reality, sports, fashion and more. But there are significant challenges to be addressed. For example, conventional circuit board fabrication and assembly have had decades to optimize the entire manufacturing process and supply chain based on panel formats to create reliable circuit assemblies in a stream-lined and cost-effective manner. The materials used in these proces...

Soldering onto flexible substrates has been a challenge because even standard bismuth-based low temperature solders are not compatible with substrates like PET or even heat stabilized PET which cannot tolerate high temperatures. To overcome this challenge, many deploy conductive adhesives. This is a good solution but has several shortcoming: (1) one misses the automatic self-alignment feature of solder which is an essential feature in SMT processes; (2) conductive adhesives can contribute to overall resistivity, putting flexible hybrid electronic further beyond standard PI-based FPCB techniques (lower conductivity of printed ink vs bulk copper plus lower conductivity of conductive adhesive interconnects vs standard solder); and (3) narrow pitch sizes will be difficult to support. Digital thermal processing developed by Pulse Forge Inc (spun off from NovaCentrix) offers a solution. As shown below, a rapid pulse of light raises the temperature of the surface of the substrate very fast, whilst the substrate itself remains relatively cool, allowing one to sinter inks on low-T temperatures such as PET and paper. This feature has been extensively used in connection with printed inks. Incredibly, it has recently been demonstrated to also work with solder. The second slide shows how the PulseForge technology can in less than a second reflow standard SAC305 solder, creating good joints and also benefiting from solder's automatic realignment feature. Next slide shows how the PulseForge...

Current substrate technologies impose severe limits on potential of stretchable or flexible hybrid electronics. This is because (a) they often limit curing temperature of conductive inks which limits conductivity levels far below bulk metal and (b) they rule out compatibility with standard SMT processes and materials such as solder reflow. The table below is a comparison of common flexible and stretchable substrates. The most common ‘flexible’ substrate is PET, which is low cost, resistant to chemicals, and offers a good surface energy for printing of inks. It however has poor heat resistance, generally making it incompatible with SMT processes and imposing temperature constraints on the curing of the ink, which can limit achieved conductivity levels. The most common ‘stretchable’ substrate is TPU which offers excellent stretching as well as a good surface for printing, but has very intolerant of heat and humidity, and imposes even more severe constrains on ink and solder/conductive adhesive processing temperatures than PET. Therefore, there is a need for a substrate that it flexible and stretchable and offers compatibility with SMD and higher temperature processes. Panasonic is developing such a product based on a novel patented fully cross-linked thermoset polymer system. Below you can film stretch comparison, showing how the new thermoset substrate survives 100% stretch cycle without deformation, unlike even TPU. In the next slide, it can be seen how this substrate survi...

Introducing the Materials Informatics Platform (MIP) Demonstrated on Perovskite Solar Cells and Solid-State Batteries Basila Kattouf, Ph.D. - Customer Success - Materials Zone Contact: Contact@Materials.Zone, Set a meeting, Materials Zone presentation on TechBlick - Thursday, June 16, 2022 14:45-15:05 (CET) Visit our virtual booth The Materials Informatics Platform (MIP) Revolution Materials Zone is a Materials Informatics (AI/ML) Platform or MIP in short. Like the CRM revolution in marketing/sales before it, the MIP is the next organizational platform revolution for materials/products. Powered by AI/ML, it rapidly visualizes all the insights from all the data and serves multiple stakeholders - R&D, supply chain, manufacturing, and business. Thus, it accelerates materials/products innovation from discovery to commercialization. The MIP ingests multi-dimensional, unstructured, and dispersed materials data and transforms it into ML driven results for R&D, supply chain and manufacturing. It does so rapidly, cost-effectively, and sustainably on a collaborative organizational platform. Materials Zone is domain agnostic and has been proven on solar cells, solid-state batteries, hydrogen technologies, building materials, polymers, 3D printing, alloys, coatings, packaging, healthcare, metrology and more. Follow video links to platform demonstrations in the context of below examples. Fig 1: Materials Zone (MIP) - From Raw Data to Rapid Insights - Download short document We will demon...

Process for High Energy Li-ion Batteries Speaker: Nicolo Brambilla | Company: Nanoramic Laboratories | Date: 9-10 Feb 2022 | Full Presentation Nanoramic’s Neocarbonix™ at the Core technology enables Tier-I battery companies and automotive OEMs to achieve next-gen battery performance using existing equipment and manufacturing processes. Neocarbonix™ at the Core uses PVDF-free cathode electrodes manufactured with an NMP-free coating process, resulting in environmentally friendly, lower-cost, high-power and energy-dense batteries that are compatible with any cathode chemistry. Neocarbonix™ at the Core is also an enabler of Si-dominant anodes, using a water-based coating process and inexpensive forms of Si. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National Laboratory, Fraunhofer IKTS, RWTH Aachen University, Lawrence Livermore National Laboratories, Meta Materials Inc, Skeleton Technologies, Solid State Battery Inc, Argonne National Laboratories, OneD Battery Sciences, VTT, Leyd...