Watch the 5-minute excerpts of the presentations from the following companies:
ASE
Alex Wang
Manager
Semiconductor Package Design Solution for High Density Fan-out Packaging – Chiplets & SiP
There is great need for multi-die packaging – Chipletes & SiP – to meet the needs of High Performanc...
ASE
William Chen
ASE Fellow & Senior Technical Advisor, Life Fellow of IEEE
The HIR Village for the Heterogeneous Future
Bio: Dr William Chen (Bill) holds the position of ASE Fellow & Senior Technical Advisor at ASE Group...
Auburn
Michael Hamilton
Director of Alabama Micro/Nano Science and Technology Center
Superconducting Interconnect Technologies for Cryogenic and Quantum Systems
Superconducting electronics and quantum systems are experiencing a significant growth in interest du...
Binghamton University
Seokheun Choi
Professor
Papertronics for Internet of Disposable Things
Disposable wireless sensor networks (WSNs) will allow every corner of the world to be connected thro...
Binghamton University
Eric Cotts
Professor
Examination of Electromigration Effects in Sn-Bi Based Solder Joints
A study of the effect of the variation of processing parameters on the microstructure of Pb free sol...
Defense Advanced Research Projects Agency (DARPA)
Carl McCants
Special Assistant to the Director
Electronic Resurgence Initiative Briefing
The DARPA Microsystems Technology Office (MTO) Electronics Resurgence Initiative (ERI), initially an...
Fraunhofer IZM
Christine Kallmeyer
Research Scientist
Technologies and Applications for Wearable e-Textiles
Smart textiles have been a research topic for more than 20 years. A broad range of technologies has ...
Fraunhofer IZM
Mathilde Billaud
Research scientist
Economic and Environmental Perspectives on Panel Level Packaging
Bio: Dr. Mathilde Billaud is a research fellow at Fraunhofer IZM since 2017. Between 2013 and 2016, ...
GE Research
Ahmed Elasser
Principal Systems Engineer
Energy Storage: The Next Big Thing – 200 years in the making.
Energy Storage has been in the making for at least two hundred years, but it has recently been playi...
Georgia Institute of Technology
Manos Tentzeris
Ken Byers Professor in flexible electronics
Inkjet-/3D-/4D-Printed “Zero-Power” Flexible Wireless Ultrabroadband Modules for IoT, Smart Agriculture and Smart Cities Applications
In this talk, inkjet-/3D-printed antennas, interconnects, “smart” encapsulation and packages, RF ele...
Griffis AF Base
Mike Fanto
Senior Research Physicist
Quantum Integrated Photonics: Heterogeneous Integration in Foundry Level Devices
Silicon integrated photonics has grown in the last decade to fill the market with classical devices ...
IBM
Tom Wassick
Senior Technical Staff Member
Semiconductor Packaging Competitive Analysis: An Overview of Key Technologies Used in HPC Applications
Bio: Tom Wassick is a Senior Technical Staff Member in the Packaging Development organization within...
IBM
Kamal Slkka
Engineering Manager
Heterogeneous Integration for Al Workloads
Semiconductor scaling to smaller dimensions has led to tremendous improvement in electronic systems ...
IBM Research
Mukesh V. Khare
Vice President
What's Next in Computing
Semiconductor advances have powered nearly every aspect of technology for over 50 years and continue...
IBM Research
Mukesh V. Khare
Vice President
Opening Remarks
Semiconductor advances have powered nearly every aspect of technology for over 50 years and continue...
Intel
Babak Sabi
Corporate Vice President and General Manager of Assembly/Test Development
Advanced Packaging Architectures: Opportunities and Challenges
Advanced packaging architectures are today widely acknowledged as being increasingly important to dr...
Lockheed Martin
Roger Brewer
Capacitors for Energy Storage and as a companion to Wide Band Gap Power Electronics
Bio: With 32 years of experience at Lockheed Martin, Roger started his career in Electrical Engineer...
NC State University
Doug Hopkins
Professor
Ceramic-Epoxy Integrated Substrate Structures for E-Field Profiling in Ultra Dense Power
Wide Band Gap (WBG) power semiconductors provide much higher power densities than silicon-based syst...
NC State University
Michael Dickey
Professor
Liquid Metals for Soft and Additive Electronics
This talk will discuss efforts to additively pattern and utilize liquid metals as conductive inks fo...
NSWC Crane Division
Roger Smith
DoD Executive Agent for Printed Circuit Board and Interconnect Technologies
Interconnect Technologies (Printed Circuit Boards) Required to Support Microelectronics Packaging in DoD
This presentation will provide an overview of DoD Executive Agent (EA) efforts promoting printed cir...
NSWC Crane Division
Darren Crum
Leading Microelectronics Advanced Packaging
State-Of-The-Art Heterogeneous Integrated Packaging (SHIP) Program
For over a decade it has been a challenge for the Department of Defense (DoD) to engage in State-of-...
Prismark Partners
Brandon Prior
Senior Consultant
5G and Its Impact on Semiconductor and Packaging Supply Chain
As we approach 2.5 years since the release of the first
commercial 5G phone to the market, the impac...
Rochester Institute of Technology
Dennis Cormier
Professor
Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets
This presentation will explore the use of on-demand liquid metal droplet jetting to fabricate printe...
SUNY Polytechnic Institute
Nathaniel Cady
Empire Innovation Professor of Nanobioscience
Materials Development and Integration Strategies for Neuromorphic Computing and AI Hardware
Neuromorphic and AI computing hardware is trending away from traditional von Neumann computational a...
Tampere University of Technology
Matti Mäntysalo
Professor
Printed Conformable Electronics for Body-Worn Sensors and Systems
Chronic diseases require a continuing medical care and limits the daily activities of patients. Digi...
US Army Research Laboratory
Eric Forsythe
Team Leader for Flexible Electronics
PM NextFlex Manufacturing Institute, ARL-ERP 3D Hybrid Electronics Thrust Leads
The presentation will highlight ongoing public-private partnerships developing advanced hybrid elect...
University at Buffalo
Shenqiang Ren
Professor
High-Temperature Cu Ink Material and All-Printed Conformal Electronics
Each year, more than 60% of Cu is used in electrical applications due to its excellent electronic, t...
University of Minnesota
Lucy Dunne
Professor of Apparel Design and Wearable Technology
Traditional and Fiber-Based Components: Challenges and Opportunities for E-Textile Garments
Garment-scale applications are increasingly attractive for medical wearables, as they afford a far g...
Łukasiewicz - ITR
Marek Kościelski
Laboratory Manager
Elements of Sustainable Development of Electronics Products
Bio: Marek Kościelski is currently a Laboratory Manager at Łukasiewicz Research Network- Tele- and R...