Perovskite Innovation Day

We develop unique conductive materials for an energy-smart, sustainable world using our core technique. This talk introduces newly developed items, which are oxidation-resistant nano copper powder and MOD (metal-organic decomposition) paste for printed electronics. Our fine copper powder shows uniform size, strong oxidation resistance, and dense sintering near 200℃.

Also, MOD paste consists of MOD ink and its Cu powder to obtain film thickness—from thin lines to thick buses, over 3× typical nano inks—while keeping copper-like conductivity.

During curing, a protective layer forms on Cu, enabling reliable, low-resistance paths for high-current and large-area devices and compact modules. We aim to bring affordable, scalable copper printing to mainstream manufacturing.

Printed electronics are evolving fast, and electroactive polymers are paving the way for a new generation of devices that don’t just perform—they feel. Available as powders, inks, and films, these materials combine the versatility of polymers with piezoelectric functionality, enabling electronics that respond to touch, vibration, and impact.
With their printability, flexibility, and lightweight design, electroactive polymers make it possible to create highly sensitive sensors across a wide frequency range. They are already opening opportunities in automotive (safer human–machine interfaces), energy (structural health monitoring of hydrogen tanks and batteries), healthcare (vital signs monitoring), acoustics (musical pickups), and sports (impact detection).
This talk will demystify piezoelectric polymers and show how they can be implemented in real applications. Attendees will discover why these materials are an essential platform for innovation in tomorrow’s smart and sustainable electronics.

This 10-minute tech talk introduces NanoSen PNC Force Sensors, a breakthrough in printed and hybrid electronics. Leveraging our specially developed piezoresitive and piezocapacitive polymer nanocomposite (PNC) material, this sensor material can be seamlessly integrated with flexible substrates, enabling robust, sensitive, and adaptable force measurements via impedance readout electronics. A single 20mm sensor can measure 0.01 newton - 150 newton and withstand 20 megapascals of pressure before the material is damaged. We have also tested the robustness with 20 million cycles á 200 newtons of force, without experiencing material degredation.

The talk will highlight their durability, flexibility for applications like wearables and robotics, and high sensitivity for precise force detection in medical and consumer devices. Attendees will explore real-world use cases with printed electrodes made from different substrates and configurations to show the future potential of this innovative technology.

Three-dimensional (3D) carbon nanomaterials are transforming the landscape of functional materials, unlocking new possibilities in sectors ranging from diagnostics and energy storage to smart sensing and thermal management. Their unique three-dimensional architecture and tuneable properties enable the development of high-performance, cost-effective, and sustainable solutions that are compatible with existing technology systems.

At the forefront of this innovation is Gii, our proprietary 3D carbon material platform, engineered for seamless integration across diverse application systems. This presentation will showcase recent breakthroughs in Gii’s deployment across a spectrum of use cases, including:

Electrochemical sensing: for real-time diagnostics and environmental monitoring

Printed batteries: for flexible, lightweight energy storage, IoT, wearables, and digital health applications

Pressure and strain sensors: for wearable devices and occupancy monitoring

Microheaters: for localised thermal control in biosensors, microreactors and other compact systems

Catalytic platforms: for energy and chemical processing applications

Gii™ not only addresses the limitations of conventional material system, such as durability, high cost, and limited scalability, but also delivers superior performance metrics:

High surface area: specific electroactive surface area of 3 – 4 times the geometric area

Electrical conductivity: 5 – 10 Ω/square at room temperature

Functionalisation: can be functionalised with metal oxides, bioreceptors, ion-selective membranes

Thermal conductivity: 3.8 W/mK and temperature coefficient of resistance of 0.0013/°C to -0.000488/°C)

Chemical stability: compatible with most organic and aqueous solutions, stable in solutions from pH 0 – pH 10

Anti-fouling: no performance loss after 30 min exposure in whole milk

Additionally, Gii is manufactured using roll-to-roll and roll-to-sheet compatible, low-temperature fabrication processes, enabling scalable production capable of producing 80 million parts per year per machine. This positions Gii as a commercially viable solution for industries seeking to accelerate product innovation without compromising on performance, cost or sustainability.


Join our presentation to explore how Gi is redefining advanced materials for next-generation devices and how your industry can benefit from its potential.

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Armor Smart Films, an ARMOR Group company is a trusted industrial partner, supporting clients from design to large-scale production of functionalized surfaces.
With advanced capabilities in coating, printing, and formulation, Armor Smart helps accelerate innovation and market entry.
A key focus lies in electroactive technologies using P(VDF-TrFE) copolymers, known for their excellent piezoelectric properties.
These materials enable the development of next-generation sensors, haptic interfaces, heating surfaces, and medical instrumentation—combining flexibility, efficiency, and seamless integration.

Blackleaf produces graphene-based heating inks.

Thanks to an innovative and sustainable graphene production process, combined with deep expertise in chemical formulation, we offer our clients comprehensive solutions and a diversified portfolio of graphene-based heatable inks.

Our heating inks are used to bring heat onto surfaces through two complementary methods: flexible heating foils and heating coatings.

This presentation introduces our innovative approach to enabling debonding-on-demand applications using printed electronic materials. By combining expertise in adhesives and functional inks, Henkel leverages decades of market and industry expertise while supporting the transition to more sustainable, circular products. The talk will explore how functional inks can act as a trigger for debonding on demand: either electrically or thermally to facilitate controlled delamination of nonconductive substrates and sensitive components. Market challenges and needs are addressed, as well as use cases presented.

Printing electrical circuits on TPU (thermoplastic polyurethane) substrates opens the door to a wide range of applications in wearable and flexible electronics. Typically, though not exclusively, these circuits are transferred onto woven or nonwoven textiles, enabling functions such as signal transmission, stretch monitoring, heat transfer, and more.

The Challenges
Despite its potential, screen printing conductive and carbon inks on TPU presents significant difficulties:
• Printing process: TPU sheets often stick to the mesh or lift off the platen, disrupting the process.
• Curing phase: Exposure to the curing temperature compromises the flatness and dimensional accuracy of TPU, causing a total loss of image registration.
• Transfer to textile: During the final bonding step, the heat required to adhere the printed circuit to the textile softens the TPU, damaging the tracks and reducing conductivity.
These issues frequently lead to high scrap rates and, in many cases, make it impossible to produce a reliable circuit.

Our Solution:
To overcome these challenges, we have developed a dedicated product line and an application process that eliminate the critical issues of TPU printing and enable the production of multi-layer circuits.
This innovative material combines:
• A multilayer TPU film
• A heat-stabilized PET film
The lamination of these two components ensures perfect flatness and thermal stability, both essential for consistent and accurate printing results.
When used together with our encapsulant product, it becomes part of a system specifically designed for multi-layer electronic circuits, ensuring durability, reliability, and improved conductivity

Screen printed conductive inks offer a cost-effective and versatile method for creating biosensors. By depositing these inks onto flexible substrates, researchers can fabricate conformable and lightweight sensing platforms. This technique is particularly valuable for developing point-of-care diagnostics and wearable devices for continuous health monitoring, as it allows for the rapid and scalable production of sensors with high sensitivity and specificity.

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Reliability of adhesives for MiniLED/MicroLED interconnects

This study investigates the long-term reliability of directional conductive adhesives (DCA) for electrical and mechanical interconnects in MiniLED and MicroLED applications. Building on a previous feasibility study from 2024, the adhesive bonds are subjected to extensive temperature and moisture resistance testing.
Key points:
- Evaluation of three adhesives for semiconductor mass production
- Performance of "light-on" tests, measurement of die-shear strength and U-I characteristics
- Tests under different conditions: Initial, after 500 h at 85°C/85% RH and after 500 h at 120°C
- Analysis of electrical and mechanical properties before and after storage

The results show excellent stability of the adhesive bonds, especially at 120°C storage.
This study represents an important step towards the commercialization of MiniLED and MicroLED applications and positions adhesive technology as a key element for future scalability and cost efficiency in production

Currently there is a portfolio of anisotropic conductive adhesive films available, targeting room temperature bonding in flexible, printed and hybrid electronics. These products are commercially available and utilized in products containing heat or pressure sensitive components. One advantage with these products is they provide electrical and mechanical bonding in one step, avoiding any post processing in the form of heat or pressure.
In addition to the current versions with 25 µm and 100 µm thickness, there is a demand for an extended product offering, fulfilling requirements covering broader application areas. The patented production technology is material independent, allowing for using different types of conductive particles (shape and material), as well as various adhesive polymers.
Upcoming product versions can include adhesive ACFs for bonding of pads below 0.1 mm^2, and distance between the pads below 100 µm. Increased adhesiveness is achieved with new polymer formulations, and improved conductivity for connecting various material- and surface combinations is achieved by utilizing particles with alternative shapes and sizes

Given the fast-evolving landscape of hybrid electronics, the challenge of creating reliable interconnects between flexible, stretchable, and rigid circuits has become increasingly important. This presentation will provide a technical overview of the latest connector technologies and integration methods designed to meet the demands of emerging electronic systems.

Key topics will include:
- A review of connector types and selection criteria based on mechanical, electrical, and environmental requirements
- Technical specifications and recent innovations in connector design for hybrid electronics
- Best practices for attaching connectors to diverse substrates, including soldering to flex circuits, heat sealing, and other bonding techniques
- Testing methodologies for evaluating connection durability under stress, abrasion, and environmental exposure

Attendees will gain practical insights into designing and implementing robust interconnects for next-generation flexible and hybrid electronic devices.

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Graphene and 2D materials have the potential to revolutionise the world as we know it. Graphene has reached a tipping point, and we are now seeing real-world benefits living up to the early excitement of just a few years ago. Collaboration is key to realising graphene’s potential, and building a community of partners will accelerate the step change in graphene’s commercial prospects.
With world-class facilities and resources, supported by experienced and knowledgeable applications engineers and internationally renowned academics, we work across a broad range of novel technologies and applications and can help you design, develop, scale and launch the next generation of innovative products and processes. With a portfolio of over 500 completed projects to date, the team are highly skilled and focussed on delivering research to meet the needs of our partners.
This talk will cover (i) the main application areas covered by our expertise, (ii) the options available for engaging with us and (iii) an overview of our printed and flexible electronic capabilities. There will be emphasis on how our pilot-scale printing equipment can help companies to develop graphene and 2D material-based solutions to problems existing across a wide range of application areas. We have successfully worked with industry on technologies such as sensors for environmental and health monitoring, flexible electronic devices, and energy-efficient heating elements, plus many more.

The performance of silver conductive inks is critically influenced by the parameters of the drying process, particularly temperature and time. This presentation explores how these factors affect the electrical conductivity, adhesion, and overall functionality of printed silver traces. Through a series of controlled experiments, we examine the interplay between drying temperature and duration, highlighting optimal conditions for achieving low resistivity and robust film formation without compromising substrate compatibility.

Sensors are transforming diagnostics by enabling detection at the earliest molecular or physiological changes — before traditional symptoms appear. Using proprietary conductive materials and ultra-sensitive, low-power platforms, these sensors offer real-time, continuous monitoring for early intervention across medical and point-of-care applications. This talk will explore the technology’s core innovations, its impact on predictive diagnostics, and how sensors are setting a new benchmark for early disease detection and personalized care.

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