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Interconnect Technologies for Integrating Rigid Components in Flexible Hybrid Electronics Applications.

Interconnect Technologies for Integrating Rigid Components in Flexible Hybrid Electronics Applications.
Christophe Sansregret

Advanced Packaging Process Development

MiQro Innovation Collaborative Centre (C2MI)

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Interconnect Technologies for Integrating Rigid Components in Flexible Hybrid Electronics Applications.

Flexible hybrid electronics are devices that combine rigid surface mounted components and flexible substrates. Such device exploits the performance and reliability merits of semiconductor technologies while capitalizing on the flexibility and low cost of printed electronics. However, effecting the interconnections necessary for this integration in a repeatable and reliable fashion is no simple task. This course will provide an overview of available interconnect technologies along with their respective strengths and shortcomings, drawing from both theory and practical experience.

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