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Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles

Speaker: Pål Morten Lindberget | Company: CondAlign AS | Date: 11-12 May 2021 | Full Presentation

CondAlign’s technology represents a novel process for production of anisotropic, conductive films. Using an electric field to structure and align particles, the results in a z-axis conductive film structure. One product type we can produce is anisotropic conductive adhesive (ACA) films with thicknesses from a few µm to some hundreds µm and resistance below 0,01 Ohm/cm^2. With very high chain densities (pitch below 10µm), these films are currently being tested in several bonding processes, like FOB, FOF, COB, COF, as an alternative to traditional ACF. The process is demonstrated in roll-to-roll production, proofing it is scalable and cost effective.

Morten Lindberget

VP Business Development @ CondAlign


An enabler with 25 years international experience from leadership, sales and business development roles in technology consulting, contract manufacturing, medical device technology and scale up. Morten holds a MSc in Mech. Engineering from TU Delft, the Netherlands, and an Executive Master of Management from BI, Norway.

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