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Dupont MCM | Demonstration of high frequency 5G modules using LTCC | June 2022

This is an auto transcriped version of the talk without human control

All right. Thank you very much. I appreciate the invitation to come talk about our materials. So first, I want to go into an introduction of motivation and 5G. So in response to society's increasing appetite for more and more data, telecommunication networks are looking to increase wireless communication, bandwidth and connectivity. And a critical aspect of this is the hardware, the devices that will that will need to operate at higher frequencies, at frequencies known as millimeter wave or about 20 gigahertz. Unfortunately, current device designs use materials that will not deliver the efficiency in terms of power utilization or with practical economics. But if you could integrate the semiconductor chips in the same modules as the passives and the switches and the filters and the antenna structures, this will shorten wiring distances and increase electrical efficiency as well as miniaturizing devices which are all good things using materials that I only use that only not only allow for increased integration, but also have stable performance at high frequency and at a myriad of operating conditions are critical to realize the advanced designs that these higher frequencies that will give us more data, but they also will provide hard hardware that will give a robust build out and avoid things like field failures or unnecessary maintenance cost in the field. And so that's why we focused on 5G. And so what I really am here to talk today about today is our product line called DuPont Green Tape Ltsc. And if you're not familiar with this technology, we take cast a ceramic slurry of precursor particles. It's a flexible tape that can be have vias punched in it filled with metal paste, have screenprint advanced screen printing of x, y, traces of conductors and then layers stacked, laminated and co fired at what's a relatively low temperature for ceramic processing and what results from that. I put on a chart here in the middle, a traditional printed circuit board that's ubiquitous around the electronics industry are ceramic. LTC is a similar 3D layer to construction of a circuit where here now instead of the dielectric being something like f floor, which is pre break filled epoxy or plated copper, we have a very high quality, dense ceramic material with metallization pastes created conductor lines. In this case, I'm going to talk about silver today. And so this is takes advantage of all the great material properties of ceramic but in the same laminar kind of construction to make very complex circuits. And like PKD, like PCB, you can make chip packages, components, all kinds of things. So LTC is a relatively mature technology. It's been around for four decades. It's been used for antennas and components and even antennas, but you can use it as a chip package. To date, it has somewhat fallen out of favor and has a current perception, and I would say a misperception that it's fundamentally hard for prototype or expensive or a costly process. The PCB is ubiquitous, LTSC is a little bit lower installed base, and so I think that's just a transient state of the technology. But really what justifies the use in revisiting this material is the great material properties. So I show here one of our systems, the lost tangent on the left here is the lowest for any commercially available material in the millimeter wave frequency regime. And you can see over a wide range of frequencies the loss stays very low, the dielectric constant is stable. But not only is it a good dielectric material, it's stable under a host of conditions. So under a wide temperature regime, the loss and dielectric constant don't shift. It's impervious to moisture or hermetic. And so there's no fear like there is in FR for printed circuit board materials that humidity will address dielectric properties and change device design. And in addition, the thermal properties are superior to any organic solution. So in order of magnitude higher thermal conductivity that's matched to the semiconductor devices and a strong flexible strength. So ceramics are fragile, but these ceramics are tough and so they're strong, rigid substrates. And material properties are not the deciding factor in how to make an electronics device, and we recognize that. So we partnered with a research institute in Taiwan and made what I show here is a module. The basis is ltsc. And so this is a multilayer package with antennas on one side and the ability to assemble the chips and passes on the other side. I show a picture of it fully assembled and a schematic of what it looks like in cross section. This was put into an into a system that's represented by this block diagram where all the ltsc is the emitter. We can characterize all kinds of antenna properties of this phaser array beam steering beam formed system. But the real proof here is that we can build a system that transmits 4K video up to ten meters across a conference room. And this is a relatively simple design that was quickly prototyped and really had no hiccups in thermal design, which is unusual for a high power, high frequency device with multiple antennas. And so we think this kind of references on kind of proves the point that LTC is a superior material and easier to design. And so in conclusion, I think LTC has a lot of myths associated with it. But if you think of it from a total solution standpoint, these great material properties that we're quite proud of can be utilized in a design when you think about the total cost of the whole solution. And although there may be some differences in the value chain and the prices, I think if you think of the total solution, it justifies the Watts already occurring increase manufacturing base. And so we'd like to talk to whoever would be interested and work with them to try and make designs to sort of unlock the power of these materials in current designs. Thank you.

Speaker 100:06:44Well done, Brian. Impressive work. I've seen thumbs up and applause coming up the whole time during the presentation. So people like to talk and that this went smoothly is really great.


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