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High resolution 3600ppi full color Silicon Display for AR glasses and HMD

“Silicon” Displays with an incredible 3600ppifull color using microLED and QD technology? Sharp (HIRANO Yasuakie et al) will join us from Japan to explain this technology at the upcoming TechBlick event on microLEDs and quantum dots (

As shown in the slide below, first blue-only uLEDs are formed on a sapphire substrate. Here, one LED array contains 352 x 198 micro LED dies of 24 um x 8 um in size. In parallel, an LSI chip containing the driving circuitry is formed on a silicon wafer. Here, the cathode (N-type electrode) and anode (P-type electrode) are fabricated for each micro LED die to apply driving voltage independently to each die. The Au bump electrodes are fabricated in accordance with the pitch of the LED dies. The two substrates are flip-chip bonded using Au-Au bonding. Here one can already see the parallel to the silicon and optoelectronic industry (vs. the traditional thin film display industry!). Next, the sapphire layer is removed via laser lift off. Finally, Cd-free quantum dots (green and red) are deposited atop the microLED dies to enable R G color conversion. This way one achieves RGB colors

The device architecture is shown in slide 2- here one can see the location of GaN uLED dies, Au bumps, as well as light shielding walls and quantum dots (QDs). This way, a full color 1,053 ppi display is formed.

However, given the small size of the emissive area of uLEDs, the brightness is low. An innovative solution here is to switch from individual driving cathode electrodes to a common one, thus freeing up more spaces for uLEDs. As shown in slide three, the light emission in one pixel was improved from 23% to 38%. As a result, brightness of 11 knits was achieved. This is an excellent progress. Of course, it is not the final game as even at 11 knits the brightness is not yet not sufficient for outdoor AR applications.

Join us and your industry peers on 30 NOV – 1 DEC 2022 at our first-ever specialist microLED and QD event to hear more about this technology from Yasuakie-san et al:


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