top of page

Innovative Thermal Vias: Meeting the Power Dissipation and Thermal Management Needs

of Today’s Advanced High Performance Systems

Speaker: Alfred Zinn | Company: Kuprion Inc| Date: 10-11 March 2021 | Full Presentation

In today’s market, electronic systems have become ever more complex while current design methods for PCBs are limiting and inadequate. New approaches are needed to meet reliability demands for increased power dissipation and thermal management of advanced high performance systems. In this presentation, Kuprion, a spinout of Lockheed Martin, will not only detail these challenges, but demonstrate how new, innovative technologies like Active Cu (ActiveCopper™) filled thermal vias are addressing the requirements for more robust interconnect structures to enable thinner, cooler, more compact and reliable operating devices.

Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs)

portfolio of expert led masterclass year-round platform

And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor.

To learn more visit

To see feedback about previous event see


Subscribe for updates

Thank you!

bottom of page