Introducing Program: Critical Process Innovations and 3D Printed Hybrid Electronics Applications for Space Missions, RF Electronics, Automotive Electronics, PVs, Green PCBs, Smart Packaging, etc
- khashayar Ghaffarzadeh
- 32 minutes ago
- 4 min read
TechBlick's The Future of Electronics RESHAPED USA - Why Should You Join Us?
The Future of Electronics RESHAPED USA (Boston, 11 & 12 June 2025) is just less than a month away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches.
This is the only event in North America dedicated to additive, printed, sustainable, hybrid, wearable and 3D electronics. See the program here.
In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In a previous article we highlighted some process innovations and material innovations as well as applications, manufacturing, and enabling technologies related to flexible hybrid electronics in wearable sensors and biosensors
In this particular article, we focus on several applications beyond wearables/sensors as well as additional critical process innovations that advances the art of additive, hybrid and 3D electronics.
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NASA Goddard Space Flight Center: NASA’s 3D Printed Electronics Lab enables custom antennas, sensors, and circuits to be printed directly onto spacecraft surfaces, enhancing performance and reducing SWaP. Printed solutions allow precise control over materials and geometry, improving reliability and accelerating mission design cycles.
Raytheon | An RTX Business presents advances in Printed Hybrid Electronics (PHE) for next-gen RF systems. Using direct-write additive manufacturing, Raytheon develops printed interconnects and passive components to reduce SWaP, eliminate soldering, and enable conformal designs. Work at RURI focuses on board-level printing of coatings, resistors, capacitors, and inductors for reliable, compact, and structurally integrated electronics.
Boeing Research & Technology - John D. Williams discusses advances and ongoing challenges in adopting additive electronics in aerospace systems.
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Jones Healthcare Group presents intelligent packaging solutions designed to improve medication adherence through integrated printed electronics. Smart packaging enables real-time tracking, reminders, and data logging—enhancing patient outcomes and supporting connected healthcare systems
IEE Sensing presents automotive use cases for printed electronics, from legacy safety systems to emerging needs in smart mobility, sensing, and infotainment. Hybrid electronics enable sensor fusion and edge computing for in-cabin monitoring and beyond.
Dracula Technologies highlights scalable inkjet-printed organic photovoltaics for powering IoT devices via indoor light. Fully printed IOPV modules support autonomous, battery-free operation with shape customization.
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Greensource Fabrication outlines U.S. PCB reshoring enabled by Zero Liquid Discharge (ZLD) systems and IC substrate capabilities via Semi-Additive Processes. A roadmap for sustainable and advanced domestic production will be presented.
DEVCOM Army Research Lab presents a study on the durability of printed hybrid electronics under extreme mechanical shock. Using a “mill-and-fill” method with sintered silver traces on polymeric substrates, assemblies were subjected to up to 100,000 g impacts. Findings revealed low-cycle fatigue behavior, with cumulative shock leading to cracking, electrical degradation, and eventual component detachment.
E Ink outlines advances in color-changing ePaper technology, enabling ultra-low power, full-color displays for outdoor signage and other sustainable applications. The new platform combines ACeP™ pigment mechanisms with microcapsule structures to deliver high-contrast, wide-temperature-range displays up to 75". The talk highlights real-world use cases and sustainability benefits of these dynamic surfaces.
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TracXon introduces a patented, high-speed roll-to-roll process for printing vertical interconnects (VIAs), addressing a key bottleneck in printed electronics. This breakthrough enables double-sided, high-density circuitry without costly multi-layer isolation stacks. TracXon’s VIA filling system integrates with existing R2R and S2S lines, bringing printed electronics closer to PCB-level complexity.
Essemtec presents precision jetting and mounting platforms for flexible substrates, addressing challenges like adhesive rheology and fine-pitch component placement in printed electronics.
Notion Systems outlines industrial deployment of inkjet and EHD printing for miniaturized electronics. The session covers resolution, material compatibility, and real-world case studies, concluding with insights into ongoing R&D.
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Altium discusses a cloud-based vision for agile electronics development, enabling real-time collaboration across engineering, procurement, and project teams. The platform integrates AI-assisted requirements, shared design environments, and supply chain visibility - streamlining the path from concept to manufacture and transforming hardware development into a truly agile process.
Advanced Printed Electronics Solutions discusses strategies for scaling additive electronics through improved CAD/CAM tools and adaptive manufacturing. The talk addresses key barriers to broader adoption - design complexity, performance, and volume production - and highlights how emerging technologies enable both mass customization and scalable manufacturing.
3DFlexible presents a conformal circuit printing approach using AM-enhanced 5-axis CNC platforms. By integrating printing and post-processing tools with automated tool changing and multi-axis motion, the system enables precise, multi-layer deposition on complex surfaces. This cost-effective, reliable solution advances conformal electronics manufacturing on standard CNC hardware.
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FineX – Panasonic showcases roll-to-roll fine mesh production for transparent conductive films used in EMI shielding, de-icing, photovoltaics, and displays. The solution addresses scalability and cost barriers of micron-scale “invisible” meshes.
MicroContinuum, Inc presents a scalable roll-to-roll subtractive process for producing multilayer nano/micro-patterned films combining polymers, metals, and dielectrics. These flexible substrates enable advanced applications like OLED lighting, IR energy harvesting, and metamaterials. A key focus is improving OLED efficiency via nanoarray light extraction and transparent metal mesh electrodes.
Carpe Diem Tech will also present the latest advances on nanoimprint lithography for flexible printed hybrid electronic and optical applications.
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