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Pulseforge | Use of Photonic Soldering to Enable High Quality Connections on T-Sensitive Substrates


This is auto-transcriped from the presentation without human control


You are probably familiar with no Novacentric as as our kind of parent company and we have over the past of. Few months have migrated to to establish a new division within the company called Pulse Launch. So we bring the same innovative team to this foray, and we were working to solve a lot of the problems that that people are having with various processing challenges that they're facing. We're based in Austin, Texas. Then we always love to host you guys. So if you're ever in the Texas area of the United States, come visit us. So we're in the business of delivering light and we use that light to heat up or do some work on a different material. And the key that we bring to the table is that we can deliver this this energy in a very digital manner, in a non non-contact digital format, whereby we can really target what material we're heating up and we heat it up. Whereas the lead precisely and and repeated. So this heating can be done above the thermal equilibrium thermal damage threshold of most materials, enabling us to really get into creating value for our customers. This can be attributed. This type of pulsing can be attributed to processing a wide range of different materials. So that allows us to really get Spring Valley to a lot of different applications. So these are just some sample applications that we have. But for today's discussion, I want to talk about soldering and the ability for us to place components on substrates that have conductive pathways with few flashes of light actually solder. And the video you see on the left is a normalization of what that's happening. But on the right is actually a live video of how this happens within a two second timescale where the solder melt and the component moves it. We have a lot of advantages. One of the advantages that's very easily represented on the video is the ability to alter on a non flat surface, which is very unique because we don't actually have moving air. This also this ability also allows us to really process with low amounts of thermal input so we get a very good improvement and energy efficiency of the process as well as the tools are inherently smaller than the floor. And so we get a lot of space savings as well for our customers. Here's to to really be able to do solder components onto temperature sensitive substrates like PET, we need this delta. So this is a video of how the soldering is happening as measured by a thermal camera. And we can have a very, very high ramp rate of the of the component without really damaging the without really heating up the underlying substrate. So underlying so that this allows us to really process materials in a wide range of different substrates and different kind of conductive conductors. Enabling us to get. Performance comparable if not better than what we get in the reflow. So these are some chip components. These are showing the entire metallic chip components and how they behave. So these are line of sight exposure. We do work with components that don't have line of sight. So these are some examples of phones that don't have line of sight exposure and you're able to cure them. So we get really good attachment to it to a similar degree that we would achieve in a conventional reflow. But we can do this on temperature sensitive substrates like. So the tools that we have in the field that are able to deliver this performance are our kind of our small scale pilot line or our small production scale on the left, as you call the bag system. And underwriters are kind of in-line system that's more controlled for the process. There are a lot of advantages for this material. Of all the big advances in one minute, yes, we can take advantage of a lot of a lot of properties that are built into solder paste. So here's an example of these components being misplaced intentionally. And then using the sorting process, we can actually realign them and make it work. Another thing that we talk about, there's no inherent movement to the system, so we actually get better performance with smaller components. So we don't necessarily have the same limitations as heating up as you would have in a reflow process. With that, I would like to thank you for coming here and just give you an example of what we call the leaf design, which is a set of LEDs on top of a substrate that we get we give out a trade show. So if you run into any of my colleagues in near future trade shows, ask him for one. Thank you very much. Thank you very much for the excellent presentation. Very.


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