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Reshaping the future of electronics: advances in digital and/or 3D additive manufacturing

Digital additive manufacturing of electronics is a key technology development frontier, shaping the future of electronics, making electronics production additive, on-demand, customized, sustainable, and 3D.

All the key innovations in this field from around the world will be showcased at the TechBlick’s Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023. This event brings together the entire industry in one place, offering 68 live talks, 12 expert-led masterclasses, 4 tours, 78 tabletop exhibitors, and over 600 attendees.

In this article, we highlight some of the key innovations which will be discussed as part of the programme in Berlin.

Join us and the global community in Berlin on 17-18 OCT 2023 and let us together RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, or 3D.

Apply the following coupon: Save100Euros

Learning from the masters

The programme starts on 17 OCT 2023 with masterclass and tours. Here you will have the opportunity to learn about

  1. 3D Printed Electronics: This class will be led by Martin Hedges, Founder of Neotech AMT GmbH, one of the leading firms in building 3D printed electronics machines with deep expertise. Martin will teach us about all the key deposition processes and system-level approaches enabling different types of 3D Printed Electronics.

  2. Electrohydrodynamic Printing (EHD): This class will offer an introduction to EHD printing, an emerging additive electronics technology overcoming fundamental barriers of conventional inkjet printing. This class will be offered by Patrick Galliker, CEO of Scrona, a leading company pioneering this technology in Zurich,Switzerland.

For those who are interested, we will then take you on a tour of the facilities at Quantica3D, a company developing a technique for multi-material jetting of high-viscosity materials.

Start-up Innovation and Applied Research

As part of the programme you will hear from a number of exciting start-ups, developing truly novel technologies. Here is a short and non-exhaustive summary:

Dry [Ink-Less] Multi Material Printing Technology: Dr Mahjouri-Samani, Founder of NanoPrintek, will explain about its dry multi-material printing technology, enabling ink-less additive digital deposition of pure nanoparticles, which are generated in-situ and on-demand with bulk-like properties, followed by real-time laser-sintering to multi-layer structure without any further post processing.

Electrochemical Printing of Multi-Material Electronics: Dr.Viktorova, CEO and Founder of, Syenta, will join us from Australia to explain about Syenta’s patented fabrication method for multi-material 3D printing using electrochemistry. This method combines electrochemical with three-dimensional control of electrode positions to culminate in a new process for 2D patterning and 3D printing of metals, semiconducting materials as well as polymers into complex shapes with ultra small feature sizes. This method does not rely on nanoparticles and therefore does not need post-treatment and allows for nearly bulk material properties.

Dry Digital Plasma Deposition without Curing: Dr. Prasad from Space Foundry will present the technology they developed at NASA. Here, the aerosol goes into a print head - where a plasma is generated. The aerosolized ink will interact with the plasma, tailoring in-situ the properties of the aerosolized ink. Here, ink properties are changed not by wet processes, but in the dry plasma process, eliminating both pre-processing of ink properties and post-processing the printed pattern.

Continuous Laser-Assisted Deposition of Standard Materials: This is a multi-material production process that relies upon the LIFT (laser induced forward transfer) technology, enabling digital, precise, high-resolution, and high-volume deposition of most industrial materials including high viscosity ones like standard solder pastes. In this talk, Mr. Javice from ioTech Group will explain the advances in this technology, showcasing how different materials with high-resolutions can be printed for applications ranging from semiconductor packaging to flexible electronics.

Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets: Dr. Cormier from Rochester Institute of Technology is one of the best-known figures in printed electronics and additive manufacturing. He will explore the use of on-demand liquid metal droplet jetting to fabricate printed circuit patterns, showing how one can achieve solid metal traces whose conductivities match that of the bulk metal on temperature sensitive flexible polymer substrates and/or 3D structures. Importantly, the process uses inexpensive wire, rather than nanoparticle ink, as the feedstock material. Pre and post-processing steps normally used with nanoparticle ink processes, such as substrate cleaning and ink drying + curing, are eliminated.


A Tool for Every Additive Electronics Project: One of the challenges for flexible hybrid electronics is that it is not easy to prototype and later manufacture ideas. This has slowed down, and continues to slow down, the industry as whole, throttling idea-to-product conversion. Jesus Zozaya, CEO of Voltera, will explain how they are addressing these pain points. Their modular dispensing platform enables users - be they academics and researchers or engineers in large companies - to rapidly and digitally prototype designs and ideas on various substrates with materials and properties that can be easily transferred into high-volume screen printing. This breaks down one of the long-standing barriers in the idea-to-manufacturing transition in this field. In parallel, Voltera is building a collaborative ecosystem that further lowers barriers to the realization of ideas based on flexible hybrid electronics.

Jetting Functional Fluids - Up Scaling from Laboratory to Industrial Production: Implementing an inkjet solution to industrial processes can create incredible advantages, as well as open up new opportunities for manufacturing. However, scaling up a solution from a proven laboratory method to a mass-manufacturing environment is surprisingly difficult. In this presentation, George Boedler, CEO of Inkatronic, will draw up his 25+ years of experience in inkjet technology to give a breakdown of some of the challenges that need to be overcome in order to achieve this successfully. This talk is recommended for those who wish to achieve mass production of electronics with inkjet.

Advancing the State-of-the-Art

3D Printed Electronics with SMT integration: In recent years, 3D printer technology that can manufacture bare PCBs using digital printing technology for both conductors and insulators has been developed. However, it is essential to optimize the SMT process in accordance with the transformation of the bare PCBs manufacturing process for the practical application of this technology. In this talk, Tominaga-san from Fuji will introduce a novel machine that combines the additive manufacturing process of bare PCBs and low-temperature SMT technology.

Next generation of resolution in additive technology: Inkjet has well known limits including resolution and viscosity. Here, Lukas from XTPL explains how their Ultra-Precise Deposition can deposit functional materials with a wide range of viscosities with micro-level precision on planar as well as non-planar surfaces. Furthermore, he will showcase the available solutions for next-generation Flexible Hybrid Electronics, Advanced IC Packaging, and Flat Panel Display applications.

Redefining Coatings in Electronic Packaging with Digital Selective Metallic Coating: This is an innovative technique to digital yet site-selectively deposit thin coatings of metal onto 2D and 2.D surfaces, replacing expensive vacuum PVC techniques which also require masking and wet etching. In this talk, Franz Vollman from Heraeus showcases how they have developed a turnkey ready-to-deploy industrial solution, consisting of particle-free inks with industrial wafer-based inkjet printers, covering any standard CAD design into customized thin metallization films in the range of 150 nm to 3 μm with a conductivity of 20-50% of bulk silver. Franz will also explain the key applications including EMI shielding of semiconductor packages for 5G applications.

Applications of Ultraprecision Aerosol Deposition in 3D Printing and Packaging: Aerosol jet technology offers digital & ultraprecise deposition methods, over 2D and 3D surfaces, with excellent resolutions. David Keicher from IDS will give an overview about different ways to advanced the art and the application of aerosol deposition.

3D Printed Electronics is Powerful when combined with CHIPS: 3D Printed Electronics saves space and enables new designs in 2.D and 3D. In this talk, Kenneth Church, CEO of nScrypt, explains how one can deposit conductors and electronics and how one can place and integrate active components onto surfaces. Furthermore, he will focus on optimizing next-generation smart tools and smart labs to ensure thousands of layers are perfect every time, making this technique ready for mass production.

Cicor Group: Aerosol jet technology offers capabilities in printing sensors in 2D and 3D, as well as a way to connect off the shelf components in a very efficient and space saving way. Karl-Heinz Fritz will give an overview about different ways to make best use of the capability.

In addition, there will be a vibrant exhibition showcasing the entire depth and breadth of additive and printed electronics including all advances in digital and 3D additive electronics. For example, you can visit Quantica3D, Notion Systems, Hummink, Suss Microtech, DoMicro, and many more onsite.

Join us and the global community in Berlin on 17-18 OCT 2023 and let us together RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, or 3D.

Apply the following coupon: Save100Euros


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