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Room temperature bonding of electronics in wearables and flexible applications

with Anisotropic Conductive Adhesive films.

Speaker: Morten Lindberget | Company: CondAlign | Date: 2-Dec-22 | Full Presentation

Anisotropic Conductive Adhesive films for room temperature, low pressure bonding will shortly be available for commercial use. What is the performance of these films, and how can they add freedom and value in designing and manufacturing new products in the area of wearables, flexible, and hybrid electronics?

An update on the availability and road-map for this product range will be presented, as well as application examples and performance data. Process savings will be discussed, related to the fact this bonding technique does not require heat nor additional pressure, and investments related to mounting equipment is moderate.

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