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Neural implants have the potential to restore lost or impaired nervous system functions through electrical stimulation or recording of the brain. However, current neural implants suffer from a fundamental limitation: a mechanical mismatch with the soft host tissue of the central nervous system which can cause poor electrode-tissue contact, unspecific stimulation or recording, and chronic scarring. At Neurosoft Bioelectronics, we have developed soft neural electrodes that address these limitations. Our electrodes are made of more compliant materials that seamlessly interface with the brain, promoting the long-term bio-integration of the devices and reducing surgical risks opening new avenues in the field of Brain-Computer Interfaces (BCI). SAVE THE DATE

With the growing incidence of record high temperatures, extended heat waves and extreme weather events, it is increasingly important for physically active people to take steps to avoid heat-related complications and optimise performance under hot conditions. Maintaining proper hydration is a key part of this process. However, both the rate and salt content of sweat can vary significantly by person, actvity type and intensity, and weather conditions among other factors. Thus there is a need for personalised monitoring devices tailored to the individual and the type of activity. For athletes, workout routines typically have pre-defined intensities and durations with known weather conditions. Capturing sweat profile snapshots under a variety of conditions enables predictions of hydration needs for future workouts, with an accuracy depending on the number and variety of snapshots. A single-use wearable of the type presented in this talk provides an efficient and cost- effective way to capture these snapshots. Some of the unique design and manufacturing challenges involved in bringing such devices to market will be discussed. For industrial workers, physical activity can extend over longer durations, be highly variable in intensity, and occur multiple times during a single day under variable weather conditions. Moreover, overheating impairs both physical strength and mental acuity, raising the likelihood of workplace injuries. Such workers benefit from a continuous monitoring device that provides instantaneous feedback and can be worn on a daily basis. Various aspects of the design of such a platform and how it differs from the single- use device will be presented. SAVE THE DATE

Ehsan Faegh Company: CCL Industries, Imprint Energy The rapid growth of smart electronics and internet-connected devices has spurred the demand for compact, flexible and energy-efficient power sources. Printed batteries have emerged as highly promising alternatives to traditional bulky batteries, such as AA or AAA, offering a distinctive solution by seamlessly integrating energy storage directly into electronic components and systems. In recent years, lithium-ion batteries have dominated the market, however, the lithium-based batteries face several challenges, including lammability, toxicity and disposability concerns, and regulatory challenges related to shipping. Given the importance of safety in smart electronics applications, the adoption of environmentally friendly battery chemistries becomes paramount. Imprint Energy has pioneered an ultrathin and flexible Zinc battery technology designed to meet the demanding power requirements of cellular applications across a wide range of operating temperatures, from -35°C to 60°C. Our innovative battery solution boasts a remarkable peak power of >1500 mW in a small form-factor. Compared to lithium chemistries, Imprint Energy batteries excel in multiple performance aspects. A significant advantage of Imprint Energy zinc batteries is their non-hazardous classification, eliminating transport and operational limitations associated with hazardous goods like batteries containing lithium. This makes Zinc batteries particularly appealing for powering smart shipping labels, where safe and unrestricted transportation is essential. Imprint Energy employs a cutting-edge manufacturing process utilizing screen and stencil printing technologies. The high-throughput sheet and roll-to-roll process ensures efficient and scalable production, enabling widespread adoption. Herein, we present emerging applications where printed batteries can revolutionize smart electronics. These applications span across wearable devices, Internet of Things (IoT) sensors, flexible displays, electronic textiles, and medical devices and patches. We discuss the advantages offered by printed batteries produced at Imprint Energy in terms of safety, size, shape, weight, flexibility and seamless integration, which enable the development of innovative and user-friendly smart electronic products. SAVE THE DATE

Speaker: Gari Arutinov Compay: Holst/TNO .With the growing demand for ever-smaller devices, such as mini- and microLED displays with higher resolution rates, there is an unstoppable trend toward the miniaturization of components. High-speed, mass-production of these electronics is getting more and more difficult because the handling and accurate placement of these tiny components is very challenging. Each component needs to be carefully selected, transferred, and then accurately placed and assembled with interconnects – all at lightning speeds. As conventional industrial equipment fails to deposit ultrafine patterns of die attach material and handle such tiny components at required high rates, this calls for the development of alternative high-throughput assembly technologies. At Holst Centre, we have developed laser-assisted processes enabling high-throughput flip-chip integration of microLEDs. More specifically, we demonstrate the capability of high-throughout printing of die attach materials (solder pastes and conductive glues) at sub-20µm resolution and highly-selective and accurate mass transfer of microLEDs at assembly precision of 1µm (lateral) and 1° (rotation) and >99.9% yield SAVE THE DATE

Author: Aart-Jan Hoeven aj.hoeven@domicro.nl | DoMicro Advanced packaging of semiconductor-based sensors brings very specific interconnection requirements. These often are related to a very narrow pitch of the interconnections or the fragility of the sensor. Different interconnection methods may also be needed because of the orientation of the sensing area or the integration of the sensor in Flexible Hybrid Electronics. DoMicro has developed an interconnection process for micro assembly of semiconductor-based sensors. This interconnection process is described as inkjet printed wire bonding. This article highlights results from recent work on an application with complex sensors. Furthermore, it includes a perspective on the competitive advantages brought by inkjet printed wirebonds. Conventional interconnection methods Figure 1. Inkjet printed wire bonds for the interconnection of microprocessor bare die Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact Aart-Jan Hoeven aj.hoeven@domicro.nl | DoMicro for your discounted attendee passes Figure 1 shows a sample with interconnections made with inkjet printed wire bonding. This printing method can be considered as 2.5D printing. Depending on the sensor and integration and processing challenges, the inkjet printed wire bond interconnection method brings advantages over conventional interconnection methods. Reduced heights: Thin integration of bare die sensors for flexible hybrid electronics can be done for BGA or QFN packages which are soldered to the PCB. These typically are made with wire-bond interconnections from the sensor die to a lead frame. This results in a relative thick package. Integration of the bare (and thinned) die directly on the flexible circuit reduces the total height. The inkjet printed wirebond interconnection method can be used to interconnect bare dies to the flexible circuit without adding extra height to the package. Configuration choices: Some optical sensor chips have their contact pads on the same plane as the sensor area. Interconnection with the (Flexible) PCB can therefore not be done using flip chip methods with anisotropic bonding. An advantage with inkjet printed wire bonds is that different configurations are possible. Solutions for heat limitations: The limitations of the processing conditions of some opto-semiconductor sensors do not allow wire bonding or flip chip bonding. The temperature, pressure or ultrasonic energy of these interconnection methods can damage those sensors. Inkjet-printed wire bonds uses less harsh processing conditions. This is a non-contact interconnection method where only limited heat is required. Inkjet printed interconnections enable new (ultra-thin) applications Using inkjet printing technology, DoMicro has developed a state-of-the-art approach for micro assembly of demonstrators for advanced applications with for example ICs, passive components, sensors and LEDs. In previous work, DoMicro has worked on the integration of thinned bare dies using the inkjet printed wire bond interconnection method. The technology for integrating dies is one of the key enablers for the realization of new applications in flexible hybrid electronics (FHE), e.g. in in-mould electronics or smart glass. This approach was developed for a wireless IoT demonstrator with a face-up thinned bare die. The die was interconnected on its bond pads. This demonstrator is shown in Figure 2. As it is impossible to inkjet print conductive tracks via a steep vertical surface, a dedicated ramp structure guides and supports the inkjet-printed silver conductors. This innovative approach of contacting avoids any regular and height consuming wire bond loops with glob top or as applied in advanced packaging, a redefinition layer or substrate (RDL) interface. The ‘die first’ approach is creating minimal height for assembling and mounting dies in systems. It is very suitable for sensor ICs for which the active side should be face up and it offers a compatibility of material surface interaction. The wireless IoT demonstrator includes touch sensors and a Bluetooth chip. With the integration of ultra-thin bare dies, the total height of the demonstrator could be kept below 0.5 mm. Using a flexible substrate of only 50µm thick and bare dies of 40µm thick, the passive components and crystals are now the thickest parts of this demonstrator. This thin form-factor enables smooth integration of functionality in various surfaces, labels, fabric etc. Figure 2. wireless IoT demonstrator Advanced sensor interconnections Based on the work as described above, DoMicro is currently working on an interconnection solution for advanced photoelectric sensors. These are opto-semiconductor line sensors with a high spatial resolution. The top electrode of the sensor is patterned and consists of more than 250 individual pixels at a fine pitch of 100µm. The pixels need to be interconnected with the read-out electronic device which is packaged as a flexible COF (Chip On Film). This semiconductor sensor cannot withstand high temperature and pressure so the interconnection processes have to be adapted to these constraints. The processing steps are defined: Bonding the COF module on the top electrode of the sensor using a non-conductive adhesive. Inkjet printing the ramp structure that allows for a smooth transition in Z-direction from the sensor pixels to the COF contacts. Inkjet printing the interconnection traces between the 250 sensor pixels and the COF contacts. Sintering of the silver nanoparticle ink: laser sintering allows for low heat impact on the sensor. Packaging the sensor assembly. Figure 3. Sensor (1) and the COF (2) on top. Right image shows the alignment of the sensor pixels with the COF contacts at 100µm pitch. Printing the silver interconnection traces is done using a Pixdro LP50 inkjet printer from SÜSS MicroTec. This versatile inkjet printing platform offers benefits like UV pinning, substrate heating, choice of many industrial printheads and high placement accuracy. Figure 4. Inkjet printing on substrate for Flexible Hybrid Electronics using SÜSS MicroTec LP50 advanced research inkjet printer Alignment of the printing and bonding steps is critical for this interconnection method. The positioning accuracy needs to be within 10µm. Furthermore, the wetting behaviour of the inks needs to be controlled in order to reach the required track gap accuracy. On top of this ramp the silver interconnection traces are printed using a silver nanoparticle ink. The traces are about 2mm long and 50µm wide. They connect each pixel of the sensor to a contact of the COF module. This is schematically shown in Figure 4. Images of the printed interconnections and its height profile are shown in Figure 5. Height profiles of samples were characterized using Keyence 3D Laserscanning microscope. Figure 4. Schematic representation of the printed interconnections between the sensor pixels and the COF contacts. 1: Sensor 2: Ramp 3: Read-out electronics COF Figure 5. Top left: 3D image of the printed interconnection. Top right: microscope image of the printed traces on the sensor, ramp and COF contacts. Bottom: height profile of the silver traces (average of the blue lines in the top right image) Alignment of both the ramp print and silver interconnection print with respect to the COF and sensor contacts is possible with the required accuracy. This printing strategy results in sufficient evaporation of solvents of the printed silver ink which is required to minimize ink wetting that could short-circuit the traces. It was found that the resistance for the printed interconnections was ~2 Ω/mm. Following these steps, packaging was done with a combination of potting and encapsulation. This protects the interconnections while providing strain relief for the COF module. Conclusions and outlook A 2.5D inkjet printing process was used for micro-assembly of advanced opto-semiconductor sensors with a large number of fine pitch pixel contacts that needed to be interconnected to an FPC. Using the contactless inkjet technique, it was possible to print interconnections at a 100 µm pitch. Laser sintering can be used for creating conductivity while limiting the heat load on fragile sensors. All individual process steps are shown to be feasible as functionality was shown with the demonstrator sensor assembly. Next steps will focus on maturing the process integration, repeatability and reliability aspects. The work demonstrates that inkjet-printed interconnections for advanced sensors are feasible. This alternative interconnection method can be used in situations where conventional wire-bonding packages or flip-chip bonding processes are not applicable. IMAGINE, CREATE, ACCOMPLISH DoMicro BV is a technology company providing innovative manufacturing technology, application solutions and micro assembly technology for flexible hybrid electronics (FHE) and micro devices. DoMicro develops cutting edge inkjet printing processes and technology for micro assembly and 3D packaging. At the forefront of innovation DoMicro offers state-of-the-art R&D services and exploration of new capabilities and applications for customers with manufacturability in mind. The company delivers R&D services, small series production, system architecture and project management. Typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV electrodes, OLED, Lab-on-chip, wearables, in-mould electronics, IC and MEMS integrations. www.domicro.nl Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact Aart-Jan Hoeven aj.hoeven@domicro.nl | DoMicro for your discounted attendee passes

The growing concern for the environment has led to a shift towards sustainable packaging and transportation solutions. This presentation will focus on the benefits of incorporating smart labels and low power technologies in transport packaging. We will discuss the various material choices available and how they impact the overall sustainability of the product. Additionally, we will provide a rough calculation of the total waste generated by traditional transportation methods and compare it to the waste generated by using printed electronics in smart labels and low power technologies to enhance logistics. Join us to learn how SODAQ's innovations and solutions can help reduce waste and promote a more sustainable future. SAVE THE DATE

The scalable slot-die coating methods adopted within TNO enable fabrication of efficient perovskite solar devices with intrinsic stability using various material and layer combinations. Furthermore, several different encapsulation strategies are investigated to define a low-cost route to guarantee long term stable modules. Demonstration of a stable semi-transparent bifacial flexible perovskite module is a step forward on various applications, such as building- and vehicle-integrated PV (BIPV & VIPV) and noise barriers on highways. In this talk, we will give an overview of our story towards realizing a stable, efficient, and bifacial perovskite processed via roll-to-roll slot-die coating technique. SAVE THE DATE

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Ram Prasad Gandhiraman | Company: Space Foundry Inc SAVE THE DATE

Speaker: Georg Boedler Company: Inkatronic Inkatronic has over 25 years’ experience in inkjet technologies, and develops specialised industrial machines for mass production. Implementing an inkjet solution to industrial processes can create incredible advantages, as well as open up new opportunities for manufacturing. However, scaling up a solution from a proven laboratory method to a mass-manufacturing environment is surprisingly difficult. In our presentation, we will give a breakdown of some of the challenges that need to be overcome in order to achieve this successfully. SAVE THE DATE

Micro electronic pattern and flat cable core manufacturing process with electroforming by roll to roll equipments. This process can be applied to the development of flexible flat-cable, copper electrode of solar cell and flexible electonic components. The first advantage of this process is that relative long and wide scale metal pattern could be produced. SAVE THE DATE

By Mikael Boedler, INKATRONIC GmbH | mb@inkatronic.com Niederdorfstrasse 6, 4063 Hörsching Tel.: +43 7221 22298 In this article, we will discuss the different aspects of an effective ink delivery system. We will focus on a recirculating inkjet system as they are highly in demand in industry, especially where functional fluids come into play. Though recirculating printheads are mostly on the same price level as non-recirculating, gravity feed equivalents the ink supply system needed is much more intricate and as a result, significantly more challenging to implement (an example of a recirculating ink delivery system is shown in figure 1 below). The benefits of recirculating systems, however, are clearly outlined in the next section making it a worthy endeavour. Figure 1 - INKATRONIC Scalable Circulating Ink Supply. Advantages of Recirculating Inkjet Technology in Industry Improved Print Quality - Recirculating printheads maintain a consistent ink temperature and viscosity, resulting in more consistent droplet formation when jetting at various frequencies. This leads to a better print quality with sharper details and better lay-down accuracy. Reduced Nozzle failures - Continuous ink circulation helps prevent nozzle failures caused by ingesting air, ink drying out, or ink settling, ensuring uninterrupted printing. Faster Start-Up Times - most recirculating printheads can start printing immediately, whereas gravity-feed printheads may require cleaning cycles to recover missing nozzles. Enhanced Printhead Longevity - The reduced risk of nozzle clogs and more stable operating conditions can extend the lifespan of recirculating printheads when compared to gravity feed systems. Improved Jetting Consistency - The stability in ink properties provided by recirculating printheads helps maintain consistent output across multiple print jobs, making them suitable for high-volume and continuous printing applications. Reduced Maintenance - Gravity feed printheads may require more frequent cleaning, purging, and maintenance, while recirculating printheads need less attention, leading to lower downtime and operating costs. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. For your special attendee discounts please contact us. Basic Principles of a Recirculating Ink Delivery System In theory, a recirculating ink supply is simple. By creating a pressure difference between the “in” and “out” ports of a printhead a flow of ink is generated (see Figure 2). At the same time, the correct pressure difference must be maintained to generate a slightly negative meniscus pressure at the nozzles. Achieving such a state initially is relatively easy, the hard part is maintaining it while the printhead starts jetting, recirculating pumps run and ink is refilled to compensate for the rate of ink leaving the system. Figure 2 - A simple diagram showing two ink tanks with different pressures connected to a printhead. Pin is higher than Pout causing ink flow through the printhead. The overall pressure at the printhead will determine if a meniscus is held at the printhead nozzles. Figure 3 - INKATRONIC Single Head Circulating Ink Supply. What are the Requirements for a Recirculating Ink Delivery System Pressure Control A meniscus pressure operating window is around ±2 mbar. Though changes within this range are unlikely to affect jetting stability, drop properties will always be affected by the smallest changes causing shifts in printed densities. For this reason, keeping the meniscus pressure within an optimal range is essential. Ink Pumps A reliable ink pump is essential for circulating ink through the system. Diaphragm pumps are commonly used for inkjet applications due to their accuracy and low maintenance requirements, though they must offer good speed control. Sharp start/stop operations are undesired and low pulsation is essential. Peristaltic pumps have their advantages but they need more frequent maintenance with their tubes, while gear pumps should be avoided due to their high shear rates which can affect an ink’s properties in circulating loops. For good chemical resistance, in the case of diaphragm pumps, they should contain FFKM valves and seals. Teflon is the recommended material for membranes. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. For your special attendee discounts please contact us at mb@inkatronic.com. Valves As a general rule, valves should be avoided where possible. If needed they have to be compact, with FFKM elastomers, large orifices, and low power consumption. This combination is often not available as standard and a partnership with a manufacturer is required to develop such valves. Pressure Spikes Pumps and valves create varying pulses of pressure, each of them, or in combination, can lead to undesired spikes in pressure. Pressure spikes can cause an immediate loss of nozzles. A positive spike can float a nozzle causing nozzle plate wetting (as shown in figure 3) and a cleaning stop. A negative pressure spike can lead to nozzle drop-outs by the ingestion of air (as shown in figure 4). In the case of a momentary ingestion of air, this is less consequential as the circulating flow of ink will quickly recover the nozzles. An acceptable range for pressure spikes can be +5 to -10 mbar, noting that the “in” pressure is most sensitive to this. It should also be noted that in some cases when large amounts of nozzles are started/stopped simultaneously they themselves can cause pressure spikes at the inlet side of the printhead. Figure 4 - Shows a printhead nozzle plate wetting. This is due to a positive pressure at the nozzle plate. Figure 5 - Shows a printhead nozzle ingesting air. This is due to too high negative pressure at the nozzle plate. Tubing and Connectors Appropriate fittings and tubing should be used that are compatible with the inks chosen for the printing application. Long-term testing should be conducted to observe shrinking, swelling, and sweating. All tubes should be kept as short as possible and with multiple heads they have to be exactly equal in the length. High-quality connectors are recommended as a leaking inkjet system can cause lots of trouble to fix, not to mention the mess. More critical though, is the ingestion of air at any point of the negative pressure side of the system, such a leak is almost impossible to identify. This causes Ink foaming which provokes large jetting dropouts and the level control system to give false readings, which can cause an ink overflow. Materials for Manifolds and Tanks The material chosen for an ink tank should be compatible with the ink chemistry, preventing any chemical reactions or contamination. Common materials for ink tanks are stainless steel, high-density polyethylene (HDPE), polypropylene (PP) and aluminium. In the case of aluminium, it should never be used with water-based inks. Sedimentation and Draining of the system Sedimentation can occur in only a few hours which leads to unstable jetting and nozzle clogging. To avoid sedimentation of high-density inks they need constant motion or stirring. Ink should be kept circulating through the entire ink supply system and extended idle times should be avoided. For a weekend shutdown, it is recommended to implement an automatic draining process to remove the ink from the system and keep it agitated in the main ink reservoir. Temperature Control Ink temperature should be maintained precisely at the optimal value, deviating only ±1°C. This has to be controlled at the tanks and at each printhead. The tank heaters have to be well distributed, local overheating of ink must be avoided. Flow-through heaters in the ink recirculation lines can be used in addition, if needed. Experiments have to be conducted in order to determine an ink’s sensitivity to temperature. Printheads with integrated heaters should reach the target ink temperature with the heater switched off, otherwise the temperature reading by the head thermistor may not be representative of the ink temperature at the “in” and “out” ports. Printhead heaters should be used for fine-tuning the ink temperature, raising it by not more than 2°C. Degassing, Air Bubble Removal Ink formulations can contain dissolved gases or air bubbles, which can disrupt the flow of a fluid within the printhead. A degasser removes these entrapped gases from the ink, resulting in more stable and reliable jetting. This is especially recommended for water-based inks, while UV and solvent-based inks will always show improvements from this. The Parameters for Setting up an Inkjet System For each specific ink and printhead, a different set of parameters will need to be determined. These parameters include: Temperature. “In” and “out” pressures. Flow rate. Head voltage. Waveform. These parameters must be determined experimentally by setting up an ink supply system, with a chosen printhead, the printhead electronics and the ink of choice. When testing a new ink the starting point should be to set the recommended temperature/viscosity set-points provided by the ink manufacturer in accordance with the printhead requirements. With the right temperature settings the “in” and “out” pressures are set in the range which prevents the printhead from dripping or sucking in air. The resulting flow rates are in a range of 10 to 200 ml/min depending on the printhead and have to be measured and maintained. At this point, the jetting performance can be analysed using a dropwatcher. The “in”/”out” pressures can now be adjusted with each jetting trial to find the region within which we achieve the best jetting performance. A flow rate that becomes too low can cause jetting instability and a delay/complete loss of nozzle recovery. A flow rate that is too high can affect the jetting straightness. The next parameter to test is the temperature. Temperature changes during the operation of a system should not fluctuate more than ±1°C. Any changes in temperature during jetting can affect drop size, jetting speed,as and jetting stability. As with pressure, temperature should be adjusted between jetting tests under the dropwatcher in increments of 0.5°C, while keeping other parameters constant. This should also produce a profile showing the ideal range in jetting performance, this time, relative to temperature. If the ideal temperature is different to the temperature set at the start of the procedure, the pressure range test can be repeated to see if the optimal pressure range changes with the new temperature value. Both pressure and temperature range tests would need to be repeated until the optimal pressure and temperature ranges stay constant. This entire procedure has to be repeated for each different ink chemistry, though it is a more complex procedure to swap out a printhead to test with the same ink. It is recommended to select as few printheads as early as possible in the development stages of a printing solution to avoid uneconomically lengthy development times. Functional fluids often have a high amount of solids in their chemistry and as such require frequent/constant agitation to prevent sedimentation, mentioned earlier. For chemists, it’s a challenge to design such fluids within the low viscosity requirements of piezo printheads, somewhere between 4 to 20 mPa s. Testing is recommended to avoid unpleasant surprises in the form of damaged printheads. Other parameters such as head voltage and waveform can also be analysed, however, they are outside of the scope of this article. A dedicated apparatus for complex inkjet development is the INKATRONIC Test Bench, with Dropwatcher shown in Figure, 6 below. With such equipment it is possible to gain productivity and have all the necessary tools at your side to effectively achieve your targets. Figure 6 - Shows the INKATRONIC Test Bench which includes a Meteor dropwatcher for analysing ink jetting in microscopic detail as well as a vacuum table for test prints. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped.For your special attendee discounts please contact us at mb@inkatronic.com.