Speaker: John Yundt Company: SunRay Scientific In this work, we propose a novel packaging concept for highly integrated RF systems using SunRay Scientific’s magnetically aligned ZTACH® ACE. We demonstrate the ability to "grow" z-axis interconnects allowing for multilayer packages that are not sensitive to the height between pads. Using this effect, we introduce two approaches to integrating multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated system-in-a-package. First, a reverse-pyramid package with all chips stacked facing down on a silicon substrate is demonstrated. Second, a "Matryoshka" package assembled with the alternation of chip's face direction is also demonstrated. The simplified assembly process of ZTACH® ACE and the new packaging concepts can offer a compact and cost-effective solution to system-in-package based RF systems. This technology can be processed at temperatures ranging from 80˚C up to 160˚, making it friendly to a range of substrates and applications from PCB, FPC, Flexible Hybrid Electronics and even wearable textile applications where device attach presents considerable issues. SunRay Scientific will present its success in the development of a novel anisotropic conductive adhesive, ZTACH® ACE, for the next level of heterogenous integration. Materials and process development will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements were made for die-to-die bonding and Ball Grid Arrays (BGA) on Polyimide. Test results will show the thin ZTACH® ACE bond, typically 25 – 75 microns thick, provides superior adhesion, low contact resistance, and mechanical robustness on a range of rigid, semi-rigid and flexible substrates during electromechanical testing. Updates on progress towards achieving ≤ 50-micron pitch will be shared. SAVE THE DATE

The demand for shortwave infrared (SWIR) sensors has shown significant growth in the market. However, the prevailing high costs of existing technology presents a challenge to widespread adoption in consumer electronics. In response, novel technologies have emerged, and among them, organic semiconductors have garnered attention due to their flexible molecular design, large-area coating capability, and devoid of heavy metals. These distinctive attributes position organic semiconductors as promising candidate for SWIR applications. In this presentation, we will summarize an overview of the current status and challenges of utilizing organic semiconductors for SWIR photodetectors from the perspective of a material developer. SAVE THE DATE

Authors: Lena Reinke lena.reinke@panacol.de | Tobias Kaposi: tobias.kaposi@panacol.de Paradigm shifts and disruptive technologies typically combine with, and often rely on generational changes. Such a shift can be seen in today’s photovoltaics development, where organic photovoltaics (OPV) is creating radically new applications in consumer electronics. They include indoor light harvesting to extend battery life of wearables, and outdoor energy generation with performance previously unimaginable from conventional photovoltaics. The same is true for flexible electronics. Manufacturers are redefining the boundaries of volumetric form factor, functionality, and design flexibility in consumer and automotive electronics. A critical contributor to these technology advancements has come from the advancement of bonding technologies. Adhesives now go beyond the basic benefits of sound structural bonding and provide additional functionality to the assembly. This has become the industry standard. Working in conjunction with our highly valued partners and customers, Panacol has successfully developed a range of multi-functional adhesive selections for applications in OPV and flexible electronics. For OPV applications, these adhesives provide higher resistance to environmental stresses. Adhesives for barrier foil lamination optimize the critical interplay between the pretreatment, foil, stack, and adhesive. New conductive adhesives efficiently adhere and protect electrical connections for SMD components in flexible packaging. In all cases, the specific requirements of the application and its assembly process are key factors to consider when making an adhesive selection. Significant benefits can be realized when an optimal pairing is achieved with the component design, assembly, (UV) adhesive properties, and the curing process. Component and process design is afforded much greater flexibility. High throughput processes, including reel-to-reel, can be run with greater efficiency which reduces total cost of operation. Finished products can also possess more functionality and durability. If this all sounds too good to be true, you may be right! As with all other new disruptive technologies, there are many challenges to overcome. Established component designs, assembly processes, and product sourcing criteria used for conventional photovoltaics and flexible electronics must be modified to adapt to the new adhesive technologies. In some cases, the adhesives themselves may need to be slightly modified to better match the intended application and process. However, when the combined efforts achieve a successful balance, mass production becomes more efficient, and it produces a better product. Overcoming these challenges requires cooperation between product manufacturer and the adhesive manufacturer. As such, Panacol is continuously trying to broaden its network of technology partners and active customers. We welcome the opportunity to work with manufacturers who are bringing their own disruptive technology to the photovoltaic and flexible electronics assembly markets. Caption: Schematic illustration of the manufacturing process of flexible OPVs using adhesives. Photo: Panacol. Note: The photographic material may only be published in connection with the associated article. We can shape a new supply chain together! If you are interested in learning more about our products, come visit us at our booth at TechBlick in Berlin on October 17th and 18th. Or for immediate assistance, please contact Lena Reinke or Tobias Kaposi at: lena.reinke@panacol.de Tel.: +49 (0) 151 550 65571 tobias.kaposi@panacol.de Tel.: +49 (0) 151 550 65581 We look forward to reshaping the future of photovoltaics and flexible electronics together with you! About Panacol Panacol-Elosol GmbH was founded in 1978 as a German subsidiary of the Swiss Panacol AG in Frankfurt. In 2008, Panacol was acquired by Munich-based Dr. Hönle AG, a leading global supplier of industrial UV equipment technology. As a member of the Hönle Group, Panacol is a knowledgeable and reliable provider of adhesives, coatings, and UV/LED curing equipment for OEM and contract manufacturers.

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Speaker: Andrzej Pepłowski CEZAMAT, Warsaw University of Technology After years of extensive research and development in biomedical wearables, focusing on chemical and physical measurements, we have gained significant expertise in their manufacturing. Our extensive knowledge of ink dynamics, colloid mechanics, and material characterization enables us to understand the underlying phenomena in technological processes. Starting from material composition and preparation to printing and device operation, we effectively translate our expertise into scientific advancements. Through quantitative and reproducible methods, we establish the foundation for groundbreaking innovations in printed electronic SAVE THE DATE

Zackary Davis Danish Technological Institute The demand for flexible, stretchable and sustainable electronic solutions is growing rapidly due to the growth in eHealth, automotive, smart buildings and other similar application areas. At the core is printed electronics, which uses printing technologies such as screen, flexographic and inkjet printing, together with functional materials and inks to fabricate electronics directly onto plastic foils, paper or textiles. To de-risk European industry to adept these novel materials and technologies, Danish Technological Institute (DTI), has established a One-Stop-Shop, which facilitates European industry with consultancy, development and pilot production. DTI can take novel ideas and perform proof of concept projects, develop these into full prototypes and in many cases, upscale prototypes to a pilot scale. Furthermore, DTI can provide support throughout the entire value chain, from materials to final products. In this presentation, you will witness DTI's work on novel material formulations, particularly focusing on bio-based and sustainable printable materials, including copper-based and transparent silver nanowire inks. DTI will showcase various fully functional demonstrators and prototypes they have developed, ranging from wearable EMG sleeves and heated undergarments to crystal lighting and embedded sensors in drones. DTI Printed Electronics is also heading a vast network through the formation of the open innovation test bed, Sustainatronics. This collaborative initiative involves leading research and technology organizations, as well as industries across Europe, accessible through a single-entry platform. Through Sustainatronics, you can access dedicated services as well as infrastructure access to the best printed electronics laboratories in Europe. SAVE THE DATE

In the dynamic landscape of retail stores, bars, clubs, and seasonal markets, the need for effective product visibility becomes even more evident. Illumination technologies are amongst the highly effective means for brand distinction and impactful visual communication. As consumer awareness around sustainability continues to grow, conventional electronics integration in product packaging faces criticism due to concerns about electronic waste and its environmental impact. Commercialization of printed and hybrid electronics provided an alternative solution offering the potential to minimizing electronic waste. Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped Hybrid and printed electronics use various light technologies and easily integrate into different package forms and in-store marketing tools. Within this context, there is a huge demand for ultra-thin flexible labels with preferred OLED lighting technology. Brand managers, package designers and developers face the challenge of seamlessly integrating OLED illumination into the visual language of products, particularly for bottles’ flexible labels. Years of effective market adoption of our technology platform SaralLight© with LED, EL or OLED embedded illumination approaches, brought us to the point to evaluate today’s market readiness enough for taking a step back and embracing the broader industry view. This perspective led to the creation of a new set of Saral Inks©: SaralOLED Label Ink set. With this novel ink set and know-how transfer, we empower printing and packaging industry to produce self-powered flexible labels with embedded OLED in-house. Figure 1 Flexible self-powered OLED la bels: What you produce and how it looks with your graphics The appeal of OLED labels for in-store marketers and packaging innovators Designed to facilitate the creation of flexible OLED-embedded labels, SaralOLED Label Ink set aligns perfectly with market needs, forging a path towards efficient and interactive visual communication. It is known that Organic Light Emitting Diode (OLED) is super eco-friendly. And, recent technological advancements made it possible to produce OLED pixels in a very thin and lightweight structure on plastic substrates that make them ideal for flexible labels illumination. This sets OLED apart from the more common LED illuminated hybrid electronics. LEDs offer cool colour variations, high efficiency and brightness but leave limited space for flexibility. LEDs are point light sources with relatively bulky structure. However, the production process of flexible OLEDs has remained complex. Some small-scale printing is being conducted at universities or research centres under certain circumstances, but mass production technology using regular printing machines is still not available. Market-ready flexible OLEDs are currently produced using highly sophisticated vacuum deposit technology that makes them relatively expensive to produce and use. Having said that, a distinct pattern of increasing market demand for OLED embedded illuminated labels for in-store marketing is evidently traceable. We're presenting SaralOLED Label Ink set to assist packaging developers and printing firms in addressing this growing market demand. Simplifying the tech: A closer look Figure 2 is a graphical representation of the OLED embedded structure. This simplified overview is meant to break down the printed ink layers in a concise yet insightful manner. Figure 2 SaralOLED Label Ink set: ink components and printing structure The development of this novel ink set was only possible through a handful of key technology enablers: 1. Autonomous energy-producing functionality by SaralBattery Inks: With a focus on production scalability, design flexibility, and technological affordability, we've developed SaralBattery Inks for easy customization and screen-printing of batteries on lightweight recyclable substrates as an integrated part of the electronic circuit. Unlike market-available ready-to-use printed batteries on plastic, these inks work on biodegradable materials like paper too, enabling the creation of sustainable batteries. SaralBattery Inks set consists of seven inks that can be printed in series connection to increase voltage allowing customized solutions. Notably, the ink set features a specially designed layer between the anode and cathode, eliminating the need for a separate paper-placement process. This printed layer acts as an electronic insulator while being ionically conductive. Contribution of SaralBattery Inks as a part of SaralOLED Label Ink set means that there will be absolutely no need for the attachment of external batteries to the label. Instead, the power source will be printed as an integrated part of the production process. The produced label will keep self-powered functionality for several years. 2. Compact and stable structure using printable Saral Adhesive Inks: In SaralOLED Label Ink set, we have included three different adhesive inks with distinctive functionalities: Saral HotMeltGlue 800: Its main heat-activatedfunction is to laminate the cathode and anode sides of the printed battery. The key advantage of this ink is that it works when heated above 100°C. As the glue is not active in room temperature, after printing and drying, the printed sheets can be stacked on top of each other. This adhesive ink is solvent based, thermally dried and similar to all other components of SaralOLED Label Ink set, simply screen printable. Saral SilverGlue Alpha 600: This ink is specifically developed to easily attach SMD components and in this case, the OLED pixel to the label. Saral SilverGlue Alpha 600 is a two components silver based conducting glue that requires low temperature curing (110°C), suitable for paper, plastic and glass. Saral Silver Glue Beta 700: It is a specially designed anisotropic silver-based glue to electrically interconnect two substrates. This functional adhesive ink is heat activated and suitable for both paper and plastic. 3. Swift and reliable production facilitated by an all-in-one ink set: At Saralon, our mission is to simplify printed electronics through InkTech. Given that, we always consider the challenges and obstacles that printers may encounter during the production process and commercialization of technology. SaralOLED Label Ink Set is designed to ensure easy and successful production practice of self-powered OLED embedded labels on thin and flexible substrates insomuch as: It is a complete set of functional inks that work in the most harmonious and efficient way. Therefore, printers do not need investing extra time and cost to find compatible inks for various circuit parts. We’ve made it easy by providing this all-in-one set of inks. It is InkTech in the sense that Saral Inks always come with design files, printing guide and professional technical support. There exists a starter kit that includes all necessary inks in the minimum possible quantity and technical details for the printers, convertors and innovative electronics developers to have their own experiments and trials before ultimate decision making. About Saralon Saralon GmbH is an industry leader in the development of functional inks for printed electronics (Saral Inks) and provider of ready-to-use printed electronic applications based on Saral Inks. Keeping the need of printing companies in mind, Saralon GmbH has simplified the complete production process of Printed Electronics, which is called InkTech. InkTech is a combination of inks and production technologies for Printed Electronics. Apart from selling inks, Saralon provides complete production know-hows for ready-to-use applications. In order to create an application based on Printed Electronics, the integration of graphics printed objects with electronics must be done in a cost-effective way. Saralon GmbH, with its long expertise in the field of integration techniques, provides full support to printing companies to develop ready-to-use applications. If there's anything you'd like to discuss or if you require additional insights, please reach out to us: Saralon GmbH Lothringer Strasse 11 – Hall L 09120 Chemnitz, Germany inks@saralon.com +49 371 503 499 10 Join us and the global community in Berlin on 17-18 OCT 2023 and let us together RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, or 3D.

Martin Hedges NeoTech AMT GmbH This presentation will review recent advances in manufacturing sustainable 3D mechatronic systems using Additive Manufacturing (AM) technologies. A brief update of select key industrial applications in Luminaires, Medical and Signal Electronics will be given. SAVE THE DATE

Speaker: Franz Vollman Company: Heraeus Lets reshape the future of Selective Metallic Coatings. Inkjet printing of 2.5D selective coatings becomes reality with our novel solution consisting of a special particle-free silver ink, an industrial hi-tech printer for mass production and a manufacturing process that translates any standard CAD format of a coating drawing into accurate selectively coated components. Our system adds a new dimension to package design, empowering package designers to create varied pattern layouts efficiently. Customized thin metallization films are possible in the range of 150 nm to 3 μm with a conductivity of 20-50% of bulk silver. The equipment fulfills the standards of the semiconductor industry, and its mass production capability is proven. This additive manufacturing method is especially suited for EMI shielding of semiconductor packages to secure signal integrity in 5G applications. Digital printing via inkjet enhances the design freedom thanks to maskless selective coating of package topsides, sidewalls (e.g. with stand-off), as well as trenches for compartmental shielding. Shielding effectiveness studies run at a specialized renowned institute confirm that the applied silver film with 2 μm thickness, which is inkjet-coated at the ideal, material saving aspect ratio of 1:1 (side wall to top side), provides excellent shielding performance. The maskless selective and precise deposition of the silver ink onto specific areas of the components avoids excess material and minimizes waste. No wet chemical processes are required, making this process environmentally friendly. With a factor 10 lower power consumption compared to sputtering, it has a much better CO2 balance, too. SAVE THE DATE

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Plug&Use portfolio of printed-flexible sensors Author: Aakash Grewal Tel. +49 7264 702-49-128, E-Mail a.grewal@binder-connector.de Printed electronics for sensors is proven to be a solution for the challenges faced by conventional sensor industry. The ability to integrate the sensor and even fabricate it over any type of geometry makes it unique. In this quest, binder provides individual and customized solutions for flexible and printed Force Sensing Resistors for applications ranging from Automotive to Medical sector. The sensors are ready-to-connect and can be offered as completed device. Binder ITZ, the innovation and technology center located in Bad Rappenau, serves as the hub for new technologies and products developed by Franz Binder GmbH & Co. Elektrische Bauelemente KG (Neckarsulm). Drawing upon our expertise in chemistry, electronics, physics, and process development, we specialize in applying printable electronic components directly onto 3D surfaces with utmost precision, achieving a seamless fusion of functionality and design. Our strength lies in delivering customer-specific solutions for diverse geometries and substrates. As pioneers in key printed electronics technologies such as printed sensors, Electroluminescence, heating elements, and fine conductive lines, we possess the unique ability to make any form of surface geometry conductive. Moreover, the rising demand for printed force sensors, specifically Force Sensing Resistors (FSR), underscores their versatility in applications ranging from robotic fingertips to sensitive touch buttons in car infotainment system. FSRs, characterized by a polymer thick film (PTF) design, exhibit a decrease in resistance as the applied force on the active surface increases. Optimized for touch control of electronic devices, FSRs possess properties akin to load cells and strain gauges, making them sought-after components in various industries. The know-how of Force Sensing Resistors (FSRs) FSR is a type of sensor that changes its resistance when a force is applied. With the increase in applied force, the resistance of the sensor decreases hence allowing the detection of physical pressure, squeezing, and weight. Talking in the context of Printed Electronics, it means, a conductive polymer that exhibits variation in electrical conductivity when force is applied, for example, a printed Carbon/Graphite layer pressed against Interdigitated Silver electrode layer. The resistance change in the FSR can be measured using appropriate circuitry, such as a voltage divider or a Wheatstone bridge configuration. By monitoring the resistance, the magnitude of the applied force can be determined. By leveraging their unique principle, FSR sensors enable precise and responsive interaction with electronic systems, enhancing user experience in a variety of contexts. Although not being extremely precise, for most touch-sensitive applications FSRs are good cost vs. benefit deal. Flexible Sensor Realisation The challenge of printing an FSR sensor, which is also reproducible, is realised at our facility using Screen printing technology. Due to the very homogeneous deposition of conductive pastes with screen-printing, it is chosen to depose very finely spaced interdigitated silver electrodes on PET substrate. The other side of the sensor contains the active material Carbon paste, which is also printed on PET substrate. In between a plastic spacer is used. The idea behind this thicknesseswas to print low-cost material to obtain as good functioning as possible. Spacer material plays a crucial role in the functioning of sensor as it separates the two layers and depending on the thickness, the amount of force is determined. Different thickness of the tapes are tested. Another important task is to test the FSR sensor after fabrication as it is important to see in how much area we are applying force and what is the outcome. For that, specific masses of the same diameter as that of conductive film is taken and the resistance against the applied force is measured. The flexible substrate used for the FSR sensor provides much needed flexibility to integrate with any application and at any surface. The round shape can easily be customized as per application. Electronics of the Sensor The mechatronics of the sensor is also done in-house at Binder ITZ by a demonstratorhighly qualified team of Electronics Engineers. The demostrator is also presented in the image. The shunt-mode FSR proved to be an efficient solution in detecting force or pressure and convert these stimuli into user-specific data to read. At Binder ITZ, we are doing high-end research and provide solutions to our customers with much more eco-friendly and yet fully functional sensor with much lower production cost compared to conventional sensor fabrication methods. About binder binder, headquartered in Neckarsulm, Germany, is a family-owned company characterized by traditional values and one of the leading specialists for circular connectors. Since 1960, binder has been synonymous with the highest quality. The company works with more than 60 sales partners on six continents and employs around 2,000 people worldwide. The binder group includes the binder headquarters, 16 affiliated companies, two system service providers as well as an innovation and technology center. In addition to Germany, the binder sites are located in Austria, China, France, Hungary, the Netherlands, Singapore, Sweden, Switzerland, the UK, and the USA. 1. FSR sensor Arduino circuit schematic and relationship graph. Photo: binder 2. Layout of printed FSR sensor in ShuntMode Construction. Photo: binder 3. Printed Flexible FSR by binder ITZ. Photo: binder 4. Electronics & signal of Printed sensors by Binder ITZ (Functional Prototype) Fields of application Human Machine Interfaces Robotics and Automation Medical and Healthcare Automotive Industry Virtual Reality and Gaming Sports and Fitness Industrial and Manufacturing Internet of Things Wearable Technology Aerospace and Defense We are Speaking & Exhibiting at "Innovations Festival" event on 22 June 2023. Explore the program and register for free now Features Ready-to-connect and, if required, pre-assembled Customizable as per demand and application Integrated with a complete circuit to assist other applications Self-sustaining and communicating printed circuit Company address: Franz Binder GmbH & Co. Elektrische Bauelemente KG Roetelstrasse 27 D-74172 Neckarsulm/Germany Tel. +49 (0) 7132 325-0 Fax +49 (0) 7132 325-150 info@binder-connector.de www.binder-connector.de

The 3D Printed Electronics market is rapidly growing and, according to several research and marketing studies, is estimated to reach multi-billion dollars annually over the next several years with double-digit growth. The 3rd dimension is more than just an additional space to add electronics; it implies a more optimized use of the space, it becomes a powerful tool to enhance products that are currently limited due to shape and size requirements. Adding planar electronics to non-planar or round objects means making the object larger and using bolts, wires and mounts to hold the electronics in place. This is a standard, and even state of the art method, to make an object electrically functional. However, it wastes space, decreases the durability, adds additional steps in manufacturing for integration and imposes constraints on the users. In many cases, adding electronics is not viable given the size constraints or the complexity imposed when adding. 3D Printed Electronics combines electronic packaging with electronic integration. Adding actives with 3D printing implies that electronics can be a part of any 3D printed object. The value of this has not been fully articulated or even imagined, but early demonstrations and the imagination of some reveal that 3D Printed Electronics will not only be the next-generation of electronic packaging, but it will also revolutionize next-generation products. The discussion on CHIPS and the impact is muted without next-generation packaging. 3D Printed Electronics and semiconductor chips are a natural marriage. In this talk we will explore the advantages of 3D Printed Electronics and the required tools to make complete working circuits. Additionally, we will show why successful 3D Manufacturing using 3D Printed Electronics is more than printing. We will demonstrate the advantages of using 3D manufacturing and multiple tools and processes in a single system. The idea of printing structures, conductors and adding actives opens new opportunities for more electronic functions in smaller form factors. It also allows for more personalized electronics to be viable. We will focus on optimizing next-generation smart tools and smart labs to ensure thousands of layers are perfect every time. SAVE THE DATE