Join us, 77 other exhibitors, 68 speakers and over 600 participants in Berlin (17-18 OCT 2023) to RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D. Explore the programme now https://www.techblick.com/electronicsreshaped

Janos Veres Director & VP of Engineering NextFlex, together with its extended ecosystem network, has been exploring the potential for novel electronics packaging and integration on a system level. This includes electronics integration in wearables, textiles, medical, and high-density integration of RF circuitry, all the way to integration of antennas on the skins of aerial vehicles. Such high-level integration is enabled by the combination of thinned bare die, additive manufacturing, printing, robotics, laser imaging, novel materials and plastics technologies. NextFlex established a unique Technology Hub with a diverse set of tools and know-how to support the needs of government and industry partners. This presentation will discuss system-level integration and packaging implementations with examples of wearables, safety devices and industrial monitoring, as well as very large scale integration on airframes. The talk will address design methodology and the manufacturing process flow used on the devices including additive printing, assembly, test, and final encapsulation. Hybrid electronics is an exciting trajectory for future electronics, enabling new shapes and form factors.

Are you interested in screen printing of electronics and functional materials? Then the below panel is a must-watch for you, bringing you over 100 years of experience in the field covering all aspects from mesh to screen to screen printing machinary to screen printing of utlrafine lines. This panel took place in May 2023 but we are now making it available to you to watch on-demand In the video below The panelists each give a short presentation [7min] introducing the state-of-the-art in the field followed by a lively and detailed discussion covering all the pressing questions in the industry. Ron Hayden from RH Solutions LLC with a focus on Screen Printing and Auxiliary Equipmen David Eisenbeiss from Kissel + Wolf Group with a focus on emulsion Technology, including the latest Laser Imaging developments Fernando Zicarelli from Fernando's Consulting (formerly at Asada Mesh and now at e2ip) with a focus on Mesh Technology and Tooling Erika Rebrosova from Sun Chemical with a focus on functional ink technology Julie Ferrigno from e2ip focusing on on applications for fineline screen printing

Join us, 77 other exhibitors, 68 speakers and over 600 participants in Berlin (17-18 OCT 2023) to RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D. Explore the programme now https://www.techblick.com/electronicsreshaped

Menno Bos | Sales Manager International

Saeed Madadi ​ Celanese Intexar™ line of Stretchable, Washable inks and films have been the premier materials for transforming materials into smart garments since 2018. Since the pandemic, the adoption of wearable technology has taken off not only in fitness applications but also healthcare. As such the testing requirements and needs have changed since the advent of wearable technology. Learn how the Celanese Micromax™ Electronic Inks and Pastes team has been working with customers and gathering market data to understand the evolution and developing products to meet the new needs of the market. Join us and the global community in Berlin on 17-18 OCT 2023. Lets RESHAPE the Future of Electronics, making it Additive, Sustainable, Wearable, and 3D. Explore the programme here https://www.techblick.com/electronicsreshaped

Stéphanie Limage Innovation Manager Associate NETO Innovation specializes in setting up projects to finance your R&D: Horizon Europe projects, EIC (Pathfinder, Transition and Accelerator), Eureka and National French projects. Our team is composed of 3 PhDs with expertise in green energies (solar, hydrogen, batteries, bio-energy, carbon capture and storage), printed and flexible hybrid electronics and their related applications (IoT, EMI shielding, in-mold electronics, sensors, displays, OLEDs, OPVs), healthcare (immunology, oncology, and medical devices) and innovative materials (biomaterials, nano-based materials, metal oxides) from manufacturing to application.

Kevin Schmid Manager & Engineer InnovationLab presents a novel printed circuit boards (PCBs ) production method based on additive manufacturing, which helps to meet higher environmental standards for electronics production while also reducing costs. The circuits are screen printed and are compatible with a conventional reflow soldering processes.

Gregor Scheipl | Marketing Business Development Executive PyzoFlex® represents a smart sensor technology that can easily be integrated as an additional component in a wide variety of surfaces/structures. This allows existing or new products to be equipped with additional sensory functions. It is based on completely (screen-)printed physical sensors that react to pressure and temperature changes as well as to structure-borne sound (vibration). The core element of this technology is the electroactive polymer (EAP): P(VDF-TrFE), which we source in the highest quality from Arkema/Pietzotech. It finally allows the sensor system to be ultrathin (10µm + substrate), durable, flexible, energy friendly and easy to integrate –major goals for novel and innovative sensor systems. The design (size & geometry and contacts) of the sensor is optimized for the specific application and the hardware required for signal processing and -transmission is adapted to the specific application as well (depending on e.g.: the deformation on the sensor as well as the integration of the sensor into the final product, etc.). PyzoFlex® is therefore not an off-the-shelf solution but a customized system optimized for each specific application.

Ali Shakouri Professor of Electrical and Computer Engineering Integrated circuits (ICs) have revolutionized computing and communication in the last couple of decades. There are many efforts to use similar principles to develop low-cost Internet of things (IoT) devices to help solve societal grand challenges in water, food and healthcare. Here, we present development of a low-cost printed sensor platform as well as its hybrid integration with ICs for electronics, communication and networking for field deployment. Most existing commercial chemical and gas sensors are expensive, work in well-controlled environment and require frequent calibrations. It is very challenging to achieve high sensitivity and selectivity and stable continuous operation in a harsh environment. Roll-to-roll manufacturing and printing can be used to make low-cost functional films and sensors. However, printed devices have inherently more variability than traditional vacuum processes for ICs. We show examples where in-line characterization and imaging during manufacturing enable reducing the device variability by up to 80%. We also present a novel design paradigm where sensor diversity and physics-guided machine learning and statistical techniques are used to make accurate measurements in noisy and harsh outside environment. We demonstrate continuous nitrate measurement with 3ppm sensitivity in an agricultural field with LoRa network over two weeks. Similar ideas for robust sensors for pharmaceutical manufacturing, marine environment, as well as point-of-care devices will be briefly mentioned. Roll-to-roll manufacturing of composite polymer films can also be used to make large-area physical sensors and actuators. We will describe flexible semi-transparent piezoelectric vibration monitor and loudspeakers. In some "drop and forget" applications, one can eliminate the readout electronics completely. We present novel battery-less chipless RFID sensors with drone read-out electronics for characterizing moisture and microbial activity in the soil. This can be fully biodegradable working for couple of weeks to months. Similar sensors can be used for food safety and freshness for supply-chain monitoring. Join us, 77 other exhibitors, 68 speakers and over 600 participants in Berlin (17-18 OCT 2023) to RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, and 3D. Explore the programme now https://www.techblick.com/electronicsreshaped

Thibaut Soulestin | Application Engineer EIMEA Henkel Adhesive Technologies has developed a large material portfolio of conductive inks and coatings suitable for printed electronics technology. Today, a global, cross-functional Printed Electronics Team manages the development of printed electronics applications with a cross-industry focus on market trends driven by digital transformation, building on more than four decades of market and material formulation expertise with strong partners that enable scalable solutions. Our functional ink and coatings portfolio is ideal for producing the next generation of flexible sensor solutions by accelerating the go-to-market of smart, seamlessly connected & data-generating product innovations. Within our portfolio, we offer material solutions suitable for various smart surface technologies, including PTC heaters. Self-regulating PTC heaters are enabled by Henkel’s Positive Temperature Coefficient (PTC) inks in combination with silver and dielectric inks and coatings. Compared to standard applications where the incorporation of cables and wires requires a substantial manufacturing effort, Henkel inks and functional coatings enable the production of self-regulated heaters with uniform surface heating that add value beneath the surface. The presentation will focus on Henkel’s PTC ink range and methodology to expedite technology development within smart printed surface technologies. With Henkel’s technical support and decades of expertise, you will be able to accelerate your innovation developments and unlock the full potential of this solution.

Lets RESHAPE Electronics, making it Printed, Hybrid and 3D. Join and 600 other peers in Berlin (17-18 OCT 2023). Explore the programme now https://www.techblick.com/electronicsreshaped