Speaker: Simon Nieh | Company: Front Edge Technology | Date: 9-10 Feb 2022 | Full Presentation A stable solid-state electrolyte material is only part of the solution to an all-solid- state Lithium battery. Li ionic conductivity in cathode is as important for energy density, power density and charge rate. The morphology of metallic lithium formed on electrolyte surface when charging is a major factor controlling the safety and cycle life. This presentation will discuss the cathode and anode development at Front Edge Technology for a LiCoO2/LiPON/Li battery system. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National Laboratory, Fraunhofer IKTS, RWTH Aachen University, Lawrence Livermore National Laboratories, Meta Materials Inc, Skeleton Technologies, Solid State Battery Inc, Argonne National Laboratories, OneD Battery Sciences, VTT, Leyden Jar Technologies B.V., b-Science, Rho Motion, Wevo-Chemie, LiNA Energy, CNM Technologies, Ionblox, Empa, Zinc8 Energy Solutions, Avicenne Energy, Echiontech, South8 Technologies, Basquevolt, NanoXplore, Chasm, Li Metal, Sila Nanotechnologies, Quantumscape (tentative), Fraunhofer ISI, etc https://www.techblick.com/

Speaker: David Lim | Company: Australian Advanced Materials (AAM) | Date: 10-11 March 2021 | Full Presentation Australian Advanced Materials (AAM) is an Australian start-up company established to develop and commercialise revolutionary materials technology being developed in Australia. AAM is a wholly owned subsidiary of Strategic Elements Ltd. AAM is currently developing a printed memory technology for the printed/flexible electronics sector based on its Nanocube Ink technology. This presentation will cover the current status of the printed memory development by AAM. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Company: Break | Date: 9-10 Feb 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National Laboratory, Fraunhofer IKTS, RWTH Aachen University, Lawrence Livermore National Laboratories, Meta Materials Inc, Skeleton Technologies, Solid State Battery Inc, Argonne National Laboratories, OneD Battery Sciences, VTT, Leyden Jar Technologies B.V., b-Science, Rho Motion, Wevo-Chemie, LiNA Energy, CNM Technologies, Ionblox, Empa, Zinc8 Energy Solutions, Avicenne Energy, Echiontech, South8 Technologies, Basquevolt, NanoXplore, Chasm, Li Metal, Sila Nanotechnologies, Quantumscape (tentative), Fraunhofer ISI, etc https://www.techblick.com/

Speaker: David Dewey | Company: Fujikura Kasei| Date: 10-11 March 2021 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

and superior sustainability Speaker: Ofer Shochet | Company: Copprint| Date: 10-11 March 2021 | Full Presentation The future of printed electronics is Copper. Conductive Copper inks are ushering in a new era of printed electronics, empowering ubiquitous conductivity. In this presentation, we will review Copper pastes, which are superior to silver pastes and to etching techniques. These pastes are suitable for various substrates such as Paper, PET, PI, Glass, Aluminum, Alumina, FR4, silicon wafers and photovoltaic wafers. We will review different applications such as printed antennas, heaters, flexible circuits, PCBs, and displays. We will demonstrate that a very high level of conductivity can be obtained with Copprint’s Nano-Copper pastes while dramatically reducing costs and using simple, low-cost equipment and under-air processing. All our Copper inks are commercially available for purchase. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

The technology for integrating dies is one of the key enablers for the realization of new applications in flexible hybrid electronics (FHE), e.g. in in-mold electronics or smart glass. Using inkjet printing technology, DoMicro has developed a state-of-the-art approach for micro assembly. This approach enables the realization of demonstrators of advanced applications with for example ICs, passive components, sensors and LEDs. An example, described in this paper, is the demonstrator for wireless IoT devices with touch sensors and a Bluetooth chip. With the integration of ultra-thin bare dies, the total height of the demonstrator is below 0.7 mm. This thin form-factor enables smooth integration of functionality in various surfaces, labels, fabric etc. The inkjet printing technology brings several important capabilities, such as seamless and invisible integration, integration of thinned bare dies on flexible substrates and a reduced number of process steps. Configurations for die bonding and contacting A first step for the realization of the wireless IoT demonstrator was the investigation of the optimal configuration for die contacting and bonding. Several configurations have been studied. Figure 1 is showing a Fan In Ball Grid Array (BGA) configuration by inkjet printing on bare die. An inkjet-printed dielectric is covering the die while keeping the areas at the contact pads open. Next on top silver ink is connecting the bond pads to a BGA pattern on top of the dielectric coating. Alignment and registration of structures are performed through the automatic vision system of the used PixDRO LP50 laboratory printer equipment. Figure 2 shows the flip-chip bonding of a bare die to an inkjet-printed silver pattern. For interconnection, high accuracy alignment die bonding equipment is used. Figure 1. Fan In Ball Grid Array printed on die Figure 2. Flip Chip bonding on printed tracks (through substrate view) Figure 3. Fan Out Die first face-up Figure 3 is showing the face up thinned bare die of a microprocessor being interconnected on the bond pads. As it is impossible to inkjet print conductive tracks via a steep vertical surface, a dedicated ramp structure is provided to guide and support the inkjet-printed silver conductors. This innovative approach of contacting is avoiding any regular and height consuming wire bond loops with glob top or as applied in advanced packaging, a redefinition layer or substrate (RDL) interface. This ‘die first’ approach is creating minimal height for assembling and mounting dies in systems. It enables a good optical alignment of the die before integration and offers a compatibility of material surface interaction. From the three configurations as described above, the innovative face up ‘die first’ technology was chosen for the realization of a flexible hybrid electronic (FHE) wireless IoT demonstrator because it was the best fit for this application. It should be noted that it depends on the application which configuration gives the best fit. Bluetooth Beacon The next step was to create the Bluetooth functionality. This was done with a Nordic 51822 Bluetooth low energy (BLE) chip, which was available in thinned bare die version. The integration of this chip with printing has been demonstrated in an existing beacon design (see figure 4). Figure 4. printed BLE beacon Wireless Flexible Hybrid Electronics interface Typical for having wireless functionality for IoT devices is the combination and integration of a sensing function, computing processing and radio functionality for operating and communicating remotely from nodes to the network. In line with this, the final step for the realization of the wireless IoT demonstrator was the integration of a micro controller, a Bluetooth radio Integrated Circuit (IC) and a printed touch sensor on a polyester foil. The micro controller (a thinned Cypress CY8C20 touch controller) has been integrated in the same way as the BLE chip. For sake of demonstration, powering the demonstrator has been addressed with a regular cell battery. It is understandable that integration of a flat flexible battery solution would top off this wearable flat flexible device. Typical advantage over standard wire bond interconnection is the ability to print functional circuitry on all kinds of thin and bendable substrates. This form-factor enables smooth integration of functionality in various surfaces, labels, fabric etc. Next to that, the ability to integrate a bare die chip face up instead of flip chip, can expose the sensor side of the chip to the outside in an extremely low height package solution. On the polymer foil, the thinned BLE IC and the thinned touch controller IC are bonded and contacted in a functional circuit and antenna by inkjet printing technology. Additionally, some SMDpassive components were added as well. Powered with the external cell battery this demonstrator is able to show two-way bluetooth communication with a cellphone app. The high accurate inkjet-printed traces are aligned and connected to the fine pitch (60 micron track/gap) bond pad of the IC’s. Passives used are approximately 0,5mm thick (height) as this is commonly available in SMD components. Figure 5 is showing the layout of touch area and electronic circuitry for both MC and BLE including the antenna structure. After powering and testing with the Nordic Blinky app, the functionality is shown while interaction is initiated from the demonstrator device back and forth. The touch area is changing the status message in the app. Touch function is activated by a manual touch area on the sample, the state of the button is shown on the wireless interface. The LED can be switched on/off remotely and activated by a switch on the app. Figure 6. LED on, button released Figure 7. LED off, button pressed You can check out the demonstrator video via https://domicro.nl/demonstrator-wireless-iot-devices/ Conclusions & Outlook DoMicro has demonstrated that bare dies can be integrated in flexible substrates using inkjet printing for the contact. This is achieved with a dedicated ramp structure for guiding and supporting the printed silver conductors. This innovative approach of contacting eliminates the need for height consuming wire bond loops. The approach has been demonstrated in a Flexible Hybrid Electronics application with thin bendable Bluetooth electronics that can be laminated in a thin flexible and/or wearable product or application. The thin form-factor enables smooth integration of functionality in various surfaces, labels, fabric, in-mold devices, smart glass, etc. Furthermore, the ability to integrate a bare die chip face up instead of flip-chip, can expose the sensor side of the chip in an extremely low height package solution. The target group for the demonstrated technology includes application developers in several industry sectors like automotive, transport and logistic companies, and medical device companies, but also in science, aerospace and other applications that might have a need for new ways of integrating electronic functionality in products and structures. Imagine, Create, Accomplish DoMicro BV is a technology company providing innovative manufacturing technology, application solutions and micro-assembly technology for flexible hybrid electronics (FHE) and microdevices. DoMicro develops cutting edge inkjet printing processes and technology for micro-assembly and 3D packaging. At the forefront of innovation, DoMicro offers state-of-the-art R&D services and exploration of new capabilities and applications for customers with manufacturability in mind. The company delivers R&D services, small series production, system architecture and project management. Typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV electrodes, OLED, Lab-on-chip, wearables, in-mould electronics, IC and MEMS integrations. www.domicro.nl Innovations Festival: Printed, Hybrid, 3D, InMold, Textile Electronics Limited Free Spots Available

Speaker: Mike Rosenberg | Company: Prieto Battery | Date: 9-10 Feb 2022 | Full Presentation While the electric vehicle market is growing exponentially, there are still significant issues with the lithium-ion (Li-ion) batteries that are powering those vehicles. Auto companies are still looking for batteries that can provide longer driving ranges, can be charged in the same amount of time as today’s petrol cars, can start at temperatures as low as -30 oC and are safer than today batteries, which may have thermal runaways or fires in accidents and upon charging. Prieto is developing an advanced 3-dimensional (3D), solid-state, rechargeable lithium-ion (Li-ion) battery that will address these issues and enable a complete transition to electric vehicles. Prieto’s advanced 3D batteries will have higher energy density than today’s Li-ion batteries, which translates to significantly longer ranges in electric vehicles. The 3D batteries can be charged in 3 to 15 minutes and can operate at temperatures ranging from -30 oC to 120 oC. In addition, these batteries will be safer than traditional Li-ion batteries, since they use a solid polymer electrolyte versus a liquid electrolyte, thus eliminating possible thermal runaways and fires. While improving the performance of the batteries is paramount to improving electric vehicle performance and enabling a complete transition to electric vehicles, being able to manufacture at low-cost and high-volume is equally important. The design of Prieto’s 3D battery was done with low-cost, sustainable, and high-volume manufacturing in mind from the very early stages of development, enabling a faster transition to full scale commercial manufacturing. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ Our next battery-related event will take place on 15-16 FEB 2023, covering 1) Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap 2) Battery Materials: Next-Generation & Beyond Lithium Ion The speakers include: General Motors, Graphenix Development, Brookhaven National Laboratory, Fraunhofer IKTS, RWTH Aachen University, Lawrence Livermore National Laboratories, Meta Materials Inc, Skeleton Technologies, Solid State Battery Inc, Argonne National Laboratories, OneD Battery Sciences, VTT, Leyden Jar Technologies B.V., b-Science, Rho Motion, Wevo-Chemie, LiNA Energy, CNM Technologies, Ionblox, Empa, Zinc8 Energy Solutions, Avicenne Energy, Echiontech, South8 Technologies, Basquevolt, NanoXplore, Chasm, Li Metal, Sila Nanotechnologies, Quantumscape (tentative), Fraunhofer ISI, etc https://www.techblick.com/

LIFT or laser induced forward transfer is a process enabling digital non-contact deposition of highly viscous conductive pastes and even adhesives and solder. This is in contract to inkjet which digital prints low viscousity inks. The principle of operation is demonstrated in the first slide. A transparent film is coated uniformly with a thin layer of paste. When laser pulses hit a spot on the film, if the paste is correctly formulated, it will detach and land on the substrate. As such, this technique opens to way to print without mask or nozzles pattens of various viscous materials on any substrates. The second slide shows the various materials that could be printed. The table is from IO Tech, suggesting that a wide range of off-the-shelf materials can be LIFT printed. It is of course not as straighforward as this since many parameters need to optimized, e.g., laser fluence, pulse rate, distance of film to substrate, print speed, coated film thickness, shear thinning properties of the paste, target substrate, etc, etc I include some printed patterns from literature. These are printed straightlines using PV metallization pastes, showing that narrow linewidths as well as very high aspect ratios can be achieved. In one example, a linewidth of 65um is achieved. Note that this is below the state of production in screen printing of PV pastes (34um). In subsequent slides, you can see various demonstrations. In these examples, solder paste is LIFT printed, adhesives are deposited, or packaging interconnects are fomed (in this example a linewidth of 20um is claimed, although we have not seen verification yet). Finally, you can see that also Ag and Cu nanoparticle inks can be formulated to be compatible with LIFT. In general, LIFT is a intersting technology. The production is not yet fully commercialized despite the principle of LIFT being well established for some years. The latest efforts aimed at creating industrial-scale R2R machine able to print multi-materials. It will be an interesting space watch, especially if it indeed succeeds in printing ultrafine linwidths using viscous pastes digitally but at R2R speeds. Join the TechBlick Innovations Festival (24 June 2022 | FREE | Online) to hear from Keiron Printing Technologies, a start-up in Eindhoven developing and commercialising a novel LIFT machine.

JetMetal Technologies has developed a novel process which is able to spray jet metallize surfaces with select area control. In this technique, two water-based components are sprayed onto a surface and via a redox process under atmospheric temperature and pressure conditions a thin layer of pure metal (in this case mainly Ag) is formed. The thickness can range from 10nm to 5um but is most typically a few hundred nanometers. This process is thus a bridge between high-throughput painting process and thin and controlled plating deposition. The formed lines are close to pure Ag, and thus offer high conductivity. Indeed, JetMetal Technologies suggests that they can reach 85-90% of bulk Ag conductivity on a smooth PET substrate when the sprayed coating is 500nm thick. Both the thinness and high conductivity are clearly differentiated from traditional particle-based pastes and inks because such traditional inks are typically 20-30% bulk Ag conductivity when applied on low-T PET substrates. Furthermore, with the exception of inkjet or particle-free inks, the printed thickness levels are typically in the few micrometer ranges. A challenge for any spraying or jetting process is the ability to achieve selective area metallization. JetMetal has developed a hybrid process in which a dielectric ink is first printed (Screen, inkjet, gravure, etc) to act as a mask. The jet metallization then applies the Ag, metallising the exposed parts and (this is crucial) removing the masking ink at the same time. Therefore, no lift-off or similar process will be required. As shown in the slides below, JetMetal has a S2S screen printing machine in-house (400x400mm with >50um resolution) as well as a R2R pilot jet metallization line (400m width, <3m/min web speed). Multiple applications are showcased in the slides. RF Antenna: a thin and highly smooth (Sa<20nm) layer is deposited achieving 90% bulk Ag conductivity with >50um resolution. The properties are shown in the slide PI based heater with with 50nm homogeneous Ag layer A metal mesh with 150nm linewidth and >90% aperture acting as a semi transparent thin film heater a thermoformed 3D circuit with <1000% elongation. This is interesting because in their case they elongate the masking ink first and then metallize the 3D shape using the jetting process. Thus, the elongation of particle-filled conductive inks will not be the limiting factor JetMetal Technologies will be exhibiting at TechBlick's Innovations Festival (24 June 2022 | FREE | Online). Sign up now here to join us

EHD is one of the most exicintg developments in the additive electronics field. It offers several key advantages over traditional inkjet: (1) it can achieve lower resolutions beyond current capabilities of inkjet, (2) can handle a wider range of ink viscosities, and (3) can cover non-flat topographies. EHD can print drops with <500nm diameters. It can reach 1-10um resolution, which standard inkjet would struggle to achieve. Furthermore, it can handle pastes with viscousities of some 1000 Cp. Given that the principle is based upon particles being pulled out by electrostatic force, whereas being pushed out by mechnical force as is the case with inkjet, the trajectory of the particles can be controlled, enabling one to print on 3D or non-flat topographies. These are all important technological steps forward. In the second slide, you can see examples of printing lines, droplets, and other patterns, demonstrated by Enjet. In the case of lines, one can see L/S ranging from 2/2um to 80/80um, demonstrating both the versality and also ultrafine line printing capabilities of this technology. In the inset, digital printing over a non-flat surface is shown, demonstraing good step coverage. A challenge for this technology is that it is slow. Most systems are R&D systems with a single head. However, companies are now developping industrial-scale mult-head printing. The embedded video shows a multi-bozzle array printing of 0.5-1um Ag NP lines by Scrona. This is a fantastic result because it shows a pathway towards industrial scale printing at ultra fine lines, beyond what inkjet achieves. Final slides show some applications. The application space is in fact broad and expanding. The EHD can be used to digital print micropads for placement of ever shrinking microLEDs (is the die attach a particle free Ag ink??); it can be used to print quantum dots (QDs) onto ever shrinking microLED dies, enabling color conversation; it can be used to repair printed metallizations and wrap-around edge electrodes for microLEDs or repair TFTs post production; it can be used in semiconductor packaging to digital print inteconnects or shielding; etc etc Join the TechBlick Innovation Festival (24 June- free | online) here to learn more. At this festival, Fraunhofer IAP will present the latest on EHD of QDs for display applications and DoMicro will present its perspectives on EHD printing, perhaps for die-first integration. 0.5- 1um Ag NP lines with multi-head EHD

Digital fineline printing is one of the most important developments in additive electronics. Inkjet itself has come very far with excellent progress even towards R2R industrialization. However, inkjet has two limitations as a technology: (1) limited resolution and (2) limited ink viscosity range. Here, we highly two technologies that can overcome these limits Here we highloght the microdispensing technology developed by XTPL with nozzle diameters in the range of 0.5-12um. It demonstrates a unique combination of ultrafine line (few micron) 'digital' printing on flat and non-flat surfaces AND highly conducting (4p% Ag bulk?) highly viscous nanoparticle (Ag, Cu, Au) pastes. Thus, this technology advances the art not just by extenting the resolution of digital printing beyond what inkjet achieves but also by enabling far more conductive and highly loaded conductive pastes. The innovation here is not just the microdispensing machine, but also the unique non-Newotonian highly-loaded nanoparticle pastes. The AgNP pastes have high loading (>85 wt% in some cases), small particles (45nm), and are in ethylene glycol solvents. The pastes require relatively high sintering temperatures (250-300C) but offer high conductivity, e.g., 4.2 uOhm.cm for the ink with 80wt% loading. In the first slide below you can learn about the microdispensing machine itself. It currently has a substrate size of around 50 mm x 50mm. The max print speed is around 10mm/s. Thhe XY motor and Z motor controllers have accuracies of 2um and 0.5um, respectively. In the next slide, what can see the types of structures that can be printed. In the benchmarking chart, it is demonstrated that they can achieve 2um linewidths with >40% bulk Ag conductivity, which outperforms other reports in the literature. In the right, one can see the types of structures being printed, showing that the printed structure demonstrate high aspect ratios. Given the highly loaded nature of the pastes as well as the narrow nozzle, fear of constant clogging exists. In the next slide, it is shown that the non-Newtonian pastes can be printed through a 2.5um nozzle for long periods of periods, demonstrating the stability of the process. In the final slide, we showcase the structures which can be printed.

Speaker: Ken Klapproth | Company: CHASM Advanced Materials| Date: 10-11 March 2021 | Full Presentation Bio With more than 25 years of success matching technically advanced products to market demand, Mr. Klapproth has helped companies small and large achieve double-digit growth. He joined CHASM in 2019 bringing global expertise from leading sales and marketing organizations at companies including Desalitech, Elsevier, IHS, Entuity, Proficiency, and Siemens. Results-oriented and data-driven, Ken is fanatical about accelerating sales traction for technically complex products, cutting edge demand generation, is the holder of two U.S. patents, and believes electronics should be intuitive, integrated, organic, and – most importantly – NOT seen. Ken holds a BS in Mechanical Engineering from the University of Connecticut and began his professional career at Pratt & Whitney designing jet engines found under the wing on many of today’s modern aircraft including the Boeing 777. In his spare time, Ken is an avid woodworker, photography and video enthusiast, and runner. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda