Search Results

Speaker: Hikaru Uno | Company: Merck | Date: 9-10 March 2022 | Full Presentation EMI shielding is a critical aspect of semiconductor packaging and chip/wafer manufacturing that ultimately enables OEMs to provide more communication and performance features using less space, weight, and providing more form factors in their products Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Rafael Michalczuk | Company: Swarovski | Date: 9-10 March 2022 | Full Presentation Swarovski will showcase the development and application of Printed Electronics in combination with Functional Crystals that enable Smart Decorative Surfaces going beyond pure decorative function – e.g. for the automotive interior design Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Aad van der Spuij | Company: Henkel AG & Co. KGaA | Date: 9-10 March 2022 | Full Presentation The ongoing expansion of megatrends such as IoT and digitalization, is driving the demand for printed sensors and antennas that are applicable to differently shaped surface structures. Throughout this presentation Henkel Printed Electronics will showcase latest Loctite ink material innovations for 3D printed electronics. Ranging from conductive silver inks suitable for screen printing and forming, valve jet printing and pad printing. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Sandra Melo | Company: Simoldes | Date: 9-10 March 2022 | Full Presentation The LEIMSA project aims to develop disruptive components for the interior of the car, floor center console and dashboard, allowing the integration of truly innovative and sustainable user centered functionalities. For this purpose, decorative elements and distinctive functionalities will be integrated into the products with as few operations as possible, through the use of emerging and lightweight technologies in the mold (in-mould operations), such as In-Mould Decoration (IMD), or In- Mold Labeling (IML), High Pressure Forming (HPF) and In-Mould Electronics (IME). Modern IM (In-Mould) technologies allow the combination of several stages of traditional production processes in the mold to obtain additional functionalities for the parts or components, but also for aesthetics improvements. As a result, an upgrade of functionalities is achieved, as well as a better aesthetic appearance and a greater durability of the generated products. The development of intelligent and haptic surfaces with an attractive seamless 3D design and an immersive and intuitive HMI (human-machine) interface centered on the user experience are the main goals of LEIMSA. For this purpose, the needs of the users were identified, in order to guide the development of product, design and style to the market. The development of production tools and integration for a pre-industrial level of technological maturity is also contemplated. The LEIMSA project is carried out by a consortium of six highly renowned entities in the national and international automotive industry: Simoldes Plásticos, S.A (leader promoter of the project), Bosch Car Multimedia, Celoplás, Plásticos para a Indústria S.A., DTx, CEiiA and the University from Minho. With a global investment of 4,898,005.06 €, this project is co-financed by the Portugal 2020 Programme, under the Operational Program for Competitiveness and Internationalization (COMPETE 2020) with the amount of 3,036,914.62 €, from the European Fund for Regional development. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Ana Cortez | Company: Celoplás | Date: 9-10 March 2022 | Full Presentation The LEIMSA project aims to develop disruptive components for the interior of the car, floor center console and dashboard, allowing the integration of truly innovative and sustainable user centered functionalities. For this purpose, decorative elements and distinctive functionalities will be integrated into the products with as few operations as possible, through the use of emerging and lightweight technologies in the mold (in-mould operations), such as In-Mould Decoration (IMD), or In- Mold Labeling (IML), High Pressure Forming (HPF) and In-Mould Electronics (IME). Modern IM (In-Mould) technologies allow the combination of several stages of traditional production processes in the mold to obtain additional functionalities for the parts or components, but also for aesthetics improvements. As a result, an upgrade of functionalities is achieved, as well as a better aesthetic appearance and a greater durability of the generated products. The development of intelligent and haptic surfaces with an attractive seamless 3D design and an immersive and intuitive HMI (human-machine) interface centered on the user experience are the main goals of LEIMSA. For this purpose, the needs of the users were identified, in order to guide the development of product, design and style to the market. The development of production tools and integration for a pre-industrial level of technological maturity is also contemplated. The LEIMSA project is carried out by a consortium of six highly renowned entities in the national and international automotive industry: Simoldes Plásticos, S.A (leader promoter of the project), Bosch Car Multimedia, Celoplás, Plásticos para a Indústria S.A., DTx, CEiiA and the University from Minho. With a global investment of 4,898,005.06 €, this project is co-financed by the Portugal 2020 Programme, under the Operational Program for Competitiveness and Internationalization (COMPETE 2020) with the amount of 3,036,914.62 €, from the European Fund for Regional development. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Thomas Nugraha | Company: Motherson Innovations | Date: 9-10 March 2022 | Full Presentation Motherson's customer demand on product innovation Introduction to previous projects that challenges Motherson to be more active in printed electronics. The projects not only cover Automotive projects (which is the core business of Motherson), but also In different area outside of Automotive industry. · Printed electronics introduction to Motherson Products Explanation on the need to implement printed electronics based on above customer demand. Each project requires always require different "recipe" to meet customer expectation, which result in various challenges. · Overcoming challenges on prototyping, production and product reliability Due to each project requires different properties, the combination of substrate, ink and manufacturing steps results in unexpected challenges. We always add one or two additional step compared to our standard development steps to ensure the quality of production and acceptable yield. · Printed electronics : a close collaboration for all players in the ecoystem Same as other product and technology. Each player need to understand what is the demand of end customer, while also providing information regarding what was previously impossible, become possible by printed electronics. With this, the customer, may come up with new product idea and innovation by implementing this new possibilities. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: PV NanoCell | Company: 9-10 March 2022 | Date: 9-10 March 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Pierre Ball | Company: BeLink Solutions | Date: 9-10 March 2022 | Full Presentation Printed Electronics technology requires robust industrialization processes to ensure high volume production success. BeLink Solutions with legacy experience in conventional electronics as well as screen printing for the automotive market has combined both expertises to develop high volumes processes in Printed Electronics. Our objective is to support Printed Electronics market growth for Automotive, Industrial, Smart Home & Building customers by providing robust and reliable manufacturing processes. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Francois Jeanneau | Company: Novasentis | Date: 9-10 March 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Ben Harries | Company: Versarien | Date: 26-27 April 2022 | Full Presentation Simon and Ben will be introducing some of the opportunities and challenges of implementing 3DCP technology in the construction of buildings and infrastructure, along with some of the emerging benefits of using graphene additives in printing materials. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Simon Ayley | Company: Water Research Centre. | Date: 26-27 April 2022 | Full Presentation Simon and Ben will be introducing some of the opportunities and challenges of implementing 3DCP technology in the construction of buildings and infrastructure, along with some of the emerging benefits of using graphene additives in printing materials. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Chisato Oyama | Company: Komori Corp | Date: 24-Jun-22 | Full Presentation We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes. For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer. We have also tried to print and reflow the solder paste. Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively. We will report the details on the day. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda