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Speaker: Brian Laughlin | Company: DuPont Microcircuit & Component Materials. | Date: 24-Jun-22 | Full Presentation DuPont™ GreenTape™ 9KC Low-Temperature Co-fire Ceramic (LTCC) tape and silver (Ag) metallization was used to fabricate an antenna-in-package (AiP) radio frequency front end (RFFE) module operating at 28 GHz. DuPont collaborated with ITRI in Taiwan to design, fabricate, and test this AiP RFFE module which utilizes a Anokiwave phasor chipset and a 2x4 patch antenna array that gives >18 dBm Effective Isotropic Radiated Power (EIRP) while steering the radiated beam over ±35° with <1 ppm error vector magnitude (EVM) under 64 QAM modulation. This reference design is analogous to many use cases for 5G telecommunication deployment such as small cells and mmWave base stations where LTCC is a excellent material platform due to high reliability, superior thermal performance, and stable material performance at high frequency over all practical ambient conditions. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Pauline Hibon | Company: Quad Industries | Date: 24-Jun-22 | Full Presentation Quad Industries is a printed electronics solution provider that delivers value through exceptional print, assembly and converting skills. We enable innovation, growth and customer success through long term partnerships! By means of highly accurate screen-printing, we integrate smart functionality on a wide range of flexible and stretchable films. This presentation focuses on technology and application developments in the domain of medical electrode patches. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Stefano Bianchi | Company: Seristampa | Date: 24-Jun-22 | Full Presentation We are going to show a prototype made by Seristampa with an IMD surface joint to a capacitive foil (printed with stretchable conductive inks) assembled on an electromechanical device, giving mechanical feedback under your finger once you press the touch surface. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Menno Bos | Company: KIMOTO | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Robert Boks | Company: Panacol-Elosol GmbH | Date: 24-Jun-22 | Full Presentation Flexible electrically and thermally conductive adhesive systems are mostly heat curing adhesives which have a given flexibility after curing. They are perfectly designed for flexible(in-molded) electronics, for example in the field of wearable stretchable electronics and thin-film solar cells. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Minami Masato | Company: Panasonic Electronic Materials | Date: 24-Jun-22 | Full Presentation Printed electronics manufacturers are continually developing new use cases using Panasonic BEYOLEX film. This unique thermoset substrate is very soft, has high temperature resistance and almost zero permanent deformation after strain. This talk will briefly highlight several examples of PE devices made with this new. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Jorge Carbo | Company: LiquidWire | Date: 24-Jun-22 | Full Presentation Metal Gel fluid-phase circuits and strain sensors present a unique solution for developing wearable 3D physiological monitors with highly stretchable, thin, and comfortable wiring that makes electronics seamless and invisible when embedded in a garment. In addition to detecting 3D body motion, Liquid Wire circuits can host any technology that a traditional PCB can. But unlike conventional flex circuitry, the Metal Gel conductor stretches with the body’s movements and reflows back into place without harming device performance even after 30,000+ strain cycles. This presentation will explore the underlying technology of pliable Metal Gel circuits and sensors so thin and stretchable they’re hardly noticeable to the wearer. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Andrew Bambach | Company: ACI Materials | Date: 24-Jun-22 | Full Presentation ACI Material’s Stretchable Electronics (SE) product portfolio offers a complete solution for durable wearable electronics. The products are printed on thermoplastic polyurethane (TPU) films which can be bonded to fabrics. This results in devices that stretch without cracking and maintain excellent electrical properties satisfying the harsh demands of wearable electronics. Early to market stretchable conductors have a narrow scope of application due to limited stretchability without cracking. ACI’s product have a superior combination of electrical performance, resistance to fatigue during cyclic elongation, and excellent recovery. Examples of use in biometric sensors and fixed resistance heaters will be shown. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Jonas Mertin | Company: Fraunhofer ILT | Date: 24-Jun-22 | Full Presentation Printed electronics are increasingly relevant to the large-scale industrialization and commer- cialization of integrated sensors and functionalities. To equip high-value components with printed sensors medium lot sizes, direct printing of functionalities onto a semi-finished or finished component is the most automatable approach to manufacturing. However, the thermal post-treatment of printed layers is often not possible or can only be achieved with compromises using conventional oven processes, either for reasons of energy and thus cost efficiency, com- ponent size, loss of mechanical properties or insufficient thermal load capacity of the compo- nents used. The use of laser radiation for thermal post-treatment of printed functionalities offers ad- vantages in these application scenarios. Due to the local heat input, sensors printed directly on components can be selectively and quickly post treated. On the one hand, this saves energy in production and thus costs. On the other hand, it enables the automation of the entire sensor production directly on a component or a semi-finished product on a machine tool or production Further advantages are the significantly shorter processing times of laser processing com- pared to oven processes as well as the complete 3D compatibility of the process. We will present the possibilities and advantages of combined printing and laser processes for manufacturing embedded sensors. We will show how these technologies can be combined with other manufacturing processes to open up new possibilities for the production of component-connected functionalities. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Donald Davis | Company: Kent Displays | Date: 24-Jun-22 | Full Presentation VersaNote, the world’s first ultra-flexible and rugged writing display that mimics the feel, flexibility, portability and analog writing of paper will be discussed. A fully automated roll to finished part line was designed for the mass production of VersaNote including display production, interconnect to PCB, and encapsulation. Kent Displays, Inc. currently offers its expertise and capabilities in cleanroom based roll-to-part production through its contract manufacturing business unit to others interested in making revolutionary, flexible electronic devices. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Jeff Duce | Company: Boeing | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Ian Jenks | Company: SmartKem | Date: 24-Jun-22 | Full Presentation In a rapidly changing world where our realities are no longer distinct from virtuality, we look at how SmartKem can deliver the next generation of displays that will help facilitate this new metaverse. Through its disruptive TRUFLEX® semiconductor platform, SmartKem can produce backplanes using its low-temperature production process to enable the real world to engage with the virtual. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda