Interconnect Technologies (Printed Circuit Boards) Required to Support Microelectronics Packaging in DoD

This presentation will provide an overview of DoD Executive Agent (EA) efforts promoting printed circuit board and interconnect technology (PrCB) development projects leveraging domestically sourced materials and processes to address the most advanced circuit board and microelectronics packaging requirements. The presentation will also offer insights into related DoD policy and guidance development efforts designed to promote the acquisition and sustainment of electronic systems required to provide US Warfighters with unrivaled electronic systems.

Today's military systems rely heavily on electronics to complete their intended missions, and Interconnect Technologies are a critical and integral part of those electronics. Over the last 40 years the U.S. printed circuit board manufacturing industry has steadily declined, as an increasing number of facilities closed, merged with other companies, or moved offshore. This has exposed the Department to vulnerabilities accessing critical Interconnect Technology products. Additionally, recent and ongoing Covid-19 pandemic impacts have exacerbated and highlighted supply chain impacts that further exposed vulnerabilities within this industry sector.

DoD has become reliant on foreign, and sometimes undependable suppliers to deliver advanced technology products. The DoD PrCB EA, via DoD Directive 5101.18E, was chartered to facilitate access to reliable, trusted, and affordable products and technologies that meet the quality, performance, and security requirements of the DoD. The EA is facilitating collaboration within and across the DoD to conduct research, development, and sustainment efforts targeting component-unique requirements.

This presentation will update the audience on DoD Executive Agent progress towards achieving it’s mission to ensure DoD access to trusted and affordable electronic interconnect technologies necessary for critical national defense systems and warfighter superiority.

Bio: Mr. Smith entered public service at Naval Surface Warfare Center Crane Division in October 1987 serving in both project technical and leadership positions throughout his tenure. In July of 2015 Mr. Smith accepted his current assignment as the DoD Executive Agent for Printed Circuit Board and Interconnect Technologies - Navy Technical Lead. In this role, he supports initiatives to oversee issues related to Trust, Technology Development, Supply Chain Management, and Knowledge and Capability Sustainment. As a collateral and complementary duty, Mr. Smith also currently serves as the Naval Sea Systems Command, Technical Warrant Holder for Electronics.

Mr. Smith holds a Bachelor’s Degree in Mechanical Engineering from Purdue University, a Master’s Degree in Public Affairs from the Indiana University School of Public and Environmental Affairs, and is Level III certified in the Defense Acquisition Workforce - Systems, Production, Research and Engineering career field.