High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology.

Selective Surface Activation Induced by Laser (SSAIL) technology allows creating Cu traces on any dielectric material (organic, glass, ceramic, etc.). In first part of this talk we are presenting our results for high throughput 10-25 µm trace formation on FR4 and PET for PCB/FPC production. In the second part we discuss 1-25 µm traces on PI, EMC and glass for semiconductor packaging. This enables novel methods for PCB/FPC and semiconductor packaging avoiding chemical etching, masks and reducing power consumption and waste.