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Tadas Kildusis

CCO

Akoneer

Lithunia

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High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology

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Electronics RESHAPED USA 2026

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Wearables RESHAPED USA 2026

Mountain View, California

Computer History Museum:
1401 N. Shoreline Blvd.
Mountain View, CA 94043

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Akoneer

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The Future of Electronics RESHAPED 2025

22 October 2025

Making of multilayer glass HDI PCB

Tadas Kildusis

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Estrel

Berlin, Germany

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The Future of Electronics RESHAPED 2024 USA

11 June 2024

High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology.

Tadas Kildusis

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UMass Boston

Boston, USA

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TechBlick Innovations Festival | Free-To-Attend 2024

24 April 2024

Going maskless for chip packaging with SSAIL

Tadas Kildusis

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TechBlick Platform

Online

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Innovations Festival: Printed, Flexible, Hybrid, 3D, Wearable, & Textile Electronics 2023

20 June 2023

Using SSAIL technology for fast development of flexible circuits

Tadas Kildusis

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TechBlick Platform

Online

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High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology

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