Printed electronic devices, both flexible and rigid, have garnered significant interest and adoption across multiple market segments, including aerospace, medical, IoT, automotive, energy and consumer electronics. The technology is highly adaptable and compatible with low cost, automated mass production processes, thereby attracting both industrial and academic applications.
To maximally exploit the opportunities of this technology, the MiQro Innovation Collaborative Center (C2MI) in collaboration with École de Technologie Supérieure (ÉTS) has developed a hybrid printing solution using copper (Cu) inks that addresses both circuit density optimization and the integration of solderable, surface mount components. The hybrid approach leverages the respective strengths of two industrially pervasive printing processes, namely inkjet and screen-printing, on the same device. The inkjet technique enables fine lines and spacing of conductive traces with minimal ink consumption. Further, the technique does not rely on design-specific hard tooling, such as masks, thus allowing immediate correction or fine-tuning of device designs. On the other hand, the strength of screen-printing lies in its capability to cost-effectively print the thicker deposits necessary for reliable component connections. The use of a Cu ink renders these deposits compatible with the industry standard SAC305 solder used in high volume PCB surface mount assembly.
In this presentation, we first review key market trends and technology needs, then discuss the challenges specific to both the hybrid approach and the use of Cu ink materials. This includes ink compatibility, curing parameters and height control. Approaches taken by C2MI to address these challenges using its industry-compatible processes and equipment are then reviewed.

Christophe Sansregret is working at the Micro Innovation Collaboration Center (C2Mi) in process development in Printed electronics and advanced packaging. He focuses on flexible and printed electronics production through additive manufacturing. He is currently developing processes for the integration of surface mounted electronic components on flexible substrates using copper inks in collaboration mainly with the École des Technologies Supérieurs (ÉTS).