The exponential growth of computing, connectivity, and intelligent devices demands breakthroughs in how materials, electronics, and systems are built. Conventional semiconductor and microfabrication methods are increasingly constrained by limitations in scalability, flexibility, and sustainability.

Direct Atomic Layer Processing (DALP) offers a new approach: atomically precise, direct, and selective material processing on complex surfaces. Instead of incremental improvements to established methods, DALP represents a paradigm shift, from planar, rigid, and centralized chip-making toward flexible, on-demand, and design-driven fabrication.

This capability enables rapid material discovery and prototyping, accelerating the path from concept to functional device. It also opens new opportunities in advanced packaging, MEMS and sensors, and catalysis, where precision, adaptability, and material diversity are critical. DALP paves the way toward a future where innovation in materials and devices can happen faster, smarter, and with unprecedented freedom.