The global trend for smarter devices has led to a surge in the use of electronic functions often represented by printed circuit boards (PCBs), which contribute to about 7% of global electronic waste (E-waste). Printed electronics technology, utilizing low-impact additive manufacturing techniques, offer a promising alternative to conventional PCB processes as presented by multiple life cycle assessments (LCA) studies. These techniques, thanks to their low thermal budget and reduced chemical use, allows the fabrication of PCB on a variety of lower environmental impact substrates such as cellulose based materials. In CEA-Liten, we address the challenges of high-density multilayer printed PCBs by developing a four-metal layer flexible printed PCB with over 100 thru-hole vias and components assembly on both sides. This approach broadens the applications of printed PCBs to consumer electronics markets, promoting more sustainability in electronics manufacturing and addressing its end of life.