Superconducting electronics and quantum systems are experiencing a significant growth in interest due to recent successes in superconducting quantum computing. Cryogenic electronics systems present a unique set of challenges for complex, densely integrated systems with large numbers of components and cables/interconnects often spanning multiple temperature stages. Conventional microwave co-axial cables that are currently in common use can stress volume and thermal constraints of these systems. Suitable connectors for such systems are also needed. In this presentation, I will describe our R&D efforts on high performance, multi-conductor superconducting flexible cables and connectors made using thin-film and wafer-level fabrication approaches. These interconnects have high microwave performance to multiple 10’s of GHz, low mass, and low thermal cross-section structures. This hardware shows great promise as interconnect structures for future superconducting and cryogenic electronics systems, including superconducting microwave quantum computing applications.

Bio: Dr. Michael C. Hamilton obtained a BS in Electrical Engineering from Auburn University in 2000 and MS and PhD in Electrical Engineering from The University of Michigan in 2003 and 2005, respectively. From 2006 to 2010, he was at MIT-Lincoln Laboratory (Lexington, MA), where he worked on a range of microwave and solid-state device projects. Dr. Hamilton joined the Electrical and Computer Engineering Department of Auburn University in 2010 and is now James B. Davis Professor and Director of the Alabama Micro/Nano Science and Technology Center (AMNSTC). He is the Auburn University IEEE Student Chapter Faculty Advisor. Dr. Hamilton is involved with IEEE MTT-S: Education Committee, Chair of MTT-7 Technical Committee on Microwave Superconductivity and Quantum Technologies, producer/moderator of the IEEE MTT-S Webinar Series. He is currently serving on the editorial board of a new open access journal: IEEE Journal of Microwaves. His current interests and areas of research include superconductive electronics and technologies for quantum systems, micro/nano fabrication, packaging and integration of high-speed systems, signal and power integrity of densely integrated systems, application of micro and nanostructures for enhanced performance of RF and microwave systems and packaging for extreme environments (both high and low temperature).