Selective Surface Activation Induced by a Laser (SSAIL) technology is one of the new methods that can address the challenges in circuit formation on flexible substrates. By adapting laser and chemical plating parameters, SSAIL can be used on a wide range of flexible substrate materials to create high-precision and high-quality circuit patterns with strong adhesion, making it highly suitable for use in the production of flexible electronics.
Since SSAIL works on standard dielectric materials (PET, PC, PEN, PI, etc.) and there is no tooling changes between different substrates or designs, it allows fast development of new flexible circuits. The line writing speed of 5-10 m/s is then easily transferred from prototyping to production.