MicroLEDs have a tremendous potential for future displays. However, there are several technical challenges to overcome prior to widespread deployment of MicroLEDs. One key hurdle is developing a process to release the dies from the sapphire growth wafer. Another is a process to transfer these to the display substrate with micron-level precision and reliability. Laser processing offers several opportunities for MicroLED display production, such as Laser Lift-Off (LLO) to separate the finished MicroLEDs from the sapphire growth wafer and Laser-Induced Forward Transfer (LIFT) to move the devices from a donor to the substrate.

In this presentation, laser-based system solutions for the different manufacturing steps for microLEDs, will be presented. Integrated process control and monitoring are used to assure stable and reliable operation to ensure high throughput and low yield losses.